有关敝公司产品的注意事项 IMDRF, IMDRF 用于陶瓷电容器与电感器以外的敝公司产品
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- Isabel Harrington
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1 有关敝公司产品的注意事项 用于陶瓷电容器与电感器以外的敝公司产品 / IMDRF, IMDRF
2 高频产品UB & imax(3.5ghz) AH 086M 片状天线 回流焊 PARS 型号标示法 NUMBER A F M =Blnk 空格 spce Series 类型 nme Code AH AF 2Electrode 端接类型 code Code Series nme Multilyer ntenn Helicl ntenn Electrode code ith plting 3Dimensions(cse 外型尺寸 size) Code Dimensions(cse mm size)[mm] EXERNA 外型尺寸 / 标准数量 DIMENSIONS / SANDARD QUANIY 4Specil 类别代码 code Code F M N Specil code Inverted F F Mono pole Mono pole(dul) 5Frequency 频率 Code Frequency[MHz] (exmple) [MHz] ~ ~ ~ Descrie Center Frequency 2.ower Frequency for 频率 Dul nd 6Spec 个别规格 code Code 01~ S1~ Spec code Applicle AH to AH 104F 104F 7Pckging 包装 Code Pckging - ping AH 212M type, AF 216M type AH 316M type AH 083F type Direction mrk E Direction mrk E Direction mrk Feed mrk AH 104F type AH 104N type AH 086M type Feed mrk c c Direction mrk Feed mrk c c Direction mrk c c Feed mrk ype E c Stndrd quntity[pcs] [pcs] Emossed tpe AF 216M 2.5± ± ± ± AH 212M 2+/ ± ± ± AH 316M 3.2± ± ± ± min AH 083F 8± 3± 1± - 3.1± 1± 1.15± 1000 AH 104F 10± 4± 1± - 2.5± 1± 1± 2000 AH 104N 10± 4± 1± - 3± 0.8± 1.5± 2000 AH 086M 8± 6± 1± - 1.8±0.2 1± mm Unit:mm PARS 型号一览 NUMBER Applictions Prt numer Externl dimensions( )[mm] [mm] Center frequency[mhz] [MHz] GPS AH 316M AF 216M AN(2.4GHz) AH 212M Bluetooth AH 316M imax(2.5ghz) AH 083F ZigBee AH 104F2450S AH 104F2650S AN(2.4GHz/5GHz) AH 104N2450D / chipntenn_e-e05r01 162
3 频产品 电气特性 典型特性 EECRICA CHARACERISICS / YPICA CHARACERISICS ypicl chrcteristics on AIYO YUDEN evlution ord AH 316M ypicl VSR chrcteristics of VSR ypicl chrcteristics rdition pttern (@1.575GHz) AF 216M 高ypicl VSR chrcteristics of VSR ypicl chrcteristics of pttern (@2.45GHz) ypicl VSR chrcteristics of VSR ypicl chrcteristics of pttern (@2.45GHz) AH 212M ypicl VSR chrcteristics of VSR ypicl chrcteristics of pttern (@2.45GHz) AH 316M ypicl VSR chrcteristics of VSR ypicl chrcteristics of pttern (@2.45GHz) AH 083F
4 高频产品ypicl chrcteristics of VSR ypicl chrcteristics of rdition pttern 电气特性 典型特性 EECRICA CHARACERISICS / YPICA CHARACERISICS ypicl chrcteristics on AIYO YUDEN evlution ord AH 104F2450S1 ypicl VSR chrcteristics of VSR ypicl chrcteristics of pttern (@2.45GHz) AH 104N2450D1 ypicl VSR chrcteristics of 2GHz VSR(2GHz nd) ypicl chrcteristics of pttern (@2.45GHz) ypicl VSR chrcteristics 5GHz of VSR(5GHz nd) ypicl chrcteristics of pttern (@5.25GHz) AH 086M
5 CHIP ANENNAS PACKAGING 1Minimum Quntity ype Stndrd Quntity (pcs) Emossed pe AF216M, AH104F, AH104N 2000 AH316M 3000 AH083F, AH086M 1000 AH212M pe Mteril Emossed pe op tpe Sprocket hole Chip Filled Bse tpe Chip cvity Chip 3ping Dimensions Emossed pe Sprocket hole φ /-0 (φ /-0) 1.75±0.1 (0.069±0.004) A B D C F 4.0±0.1 (0.157±0.004) 2.0±0.1 (0.079±0.004) ype AF216M AH316M AH083F AH104F, AH104N AH086M AH212M Chip Cvity pe idthness Insertion Pitch pe hickness mx. A B C D F K 1.85± ±0.2 8± ±0.1 4± (0.073±0.008) (0.108±0.008) (15±0.008) (0.138±0.004) (0.157±0.004) (0.077) (0.012) 1.9± ±0.2 8± ±0.1 4± (0.075±0.008) (0.138±0.008) (15±0.008) (0.138±0.004) (0.157±0.004) (0.033) (0.012) 3.35± ±0.2 16± 7.5±0.1 8± (0.132±0.008) (29±0.008) (0.630±0.012) (0.295±0.004) (15±0.004) (0.061) (0.012) 4.35±0.2 15±0.2 24± 11.5±0.1 8± (0.171±0.008) (0.407±0.008) (0.945±0.012) (0.435±0.004) (15±0.004) (0.061) (0.012) 6.25± ±0.2 16± 7.5±0.1 12± (0.246±0.008) (25±0.008) (0.630±0.012) (0.296±0.004) (0.473±0.004) (0.051) (0.012) 1.5± ±0.2 8± 3.5±0.1 4± (0.059±0.008) (0.091±0.008) (15±0.012) (0.138±0.004) (0.157±0.004) (0.059) (0.012) Unit:mm (inch) his ctlog contins the typicl specifiction only due to the limittion of spce. hen you consider the purchse of our products, plese check our specifiction. For detils of ech product (chrcteristics grph, reliility informtion, precutions for use, nd so on), see our e site ( chipntenn_pck_e-e05r01
6 4eder nd Blnk Portion 5Reel size ype A B AF216M, AH212M AH316M 178±2.0 (7.0±0.08) 50 min. (2.0 min.) 10.0±1.5 (94±0.06) 3.0 mx. (0.12 mx.) AH083F 178± min. 17.0± mx. (7.0±0.08) (2.0 min.) (0.67±0.04) (0.1 mx.) AH104F AH104N 330±2.0 (13.0±0.08) 100±1.0 (3.94±0.04) 25.5±1.0 (1.0±0.04) 3.0 mx. (0.12 mx.) AH086M 330± ± ± mx. (13.0±0.08) (3.94±0.04) (0.67±0.04) (0.1 mx.) Unit:mm(inch) 6op pe Strength he top tpe requires peel-off force of 0.1~0.7N in the direction of the rrow s illustrted elow. his ctlog contins the typicl specifiction only due to the limittion of spce. hen you consider the purchse of our products, plese check our specifiction. For detils of ech product (chrcteristics grph, reliility informtion, precutions for use, nd so on), see our e site ( chipntenn_pck_e-e05r01
7 CHIP ANENNAS REIABIIY DAA 1. Operting emperture Rnge Specified Vlue -40~ Storge emperture Rnge Specified Vlue est Methods nd Remrks -40~+85 with eing tped, -20~ Solderility Specified Vlue est Methods nd Remrks At lest 90% of immersed terminl surfce is covered y new solder. Solder temperture : 230±5 Durtion : 3±1 sec. Preconditioning : Preheting t 150 fter immersion into flux. 4. herml Shock Specified Vlue est Methods nd Remrks Shll stisfy required VSR vlue of individul specifictions for ech item. 1 hour of recovery fter 10 times of 30min.immersion lterntely t -40 nd 85 of temperture, followed y evluting electricl chrcteristics. 5. High emperture Storge est Specified Vlue Shll stisfy required VSR vlue of individul specifictions for ech item. est Methods nd Remrks 1 hour of recovery under stndrd condition fter 96 hours recovery with 85 of temperture, followed y evluting electricl chrcteristics. 6. ow emperture Storge est Specified Vlue Shll stisfy required VSR vlue of individul specifictions for ech item. est Methods nd Remrks 1 hour of recovery under stndrd condition fter 96 hours recovery with -40 of temperture, followed y evluting electricl chrcteristics. 7. Humidity Storge est Specified Vlue Shll stisfy required VSR vlue of individul specifictions for ech item. est Methods nd Remrks 1 hour of recovery under stndrd condition fter 96 hours recovery with 60 of temperture, 90~95% reltive humidity followed y evluting electricl chrcteristics. 8. Resistnce to Reflow Specified Vlue Shll stisfy required VSR vlue of individul specifictions for ech item. est Methods nd Remrks wo times of reflow soldering y recommended profile ttched, followed y evluting electricl chrcteristics. his ctlog contins the typicl specifiction only due to the limittion of spce. hen you consider the purchse of our products, plese check our specifiction. For detils of ech product (chrcteristics grph, reliility informtion, precutions for use, nd so on), see our e site ( chipntenn_reli_e-e04r01
8 CHIP ANENNAS PRECAUIONS 1. PCB Design Precutions nd pttern design Plese do not rrnge the surfce nd inside lyer pttern ner the ntenn mounting re. nd pttern design nd pttern dimension exmples nd recommended ntenn lnd pttern AF216M AH316M ype Dimensions P A AF216M AH212M Unit:mm AH083F AH104F echnicl Considertions AH104N AH086M 2. Soldering echnicl Considertions Conditions of Reflow soldering (for reference) P Free Reflow Profile Reflow profile 300 Pek 260 Mx. ithin 10sec. emperture( ) Preheting150 60sec. Min. Heting ove sec. Mx. Slow cooling Components should e preheted to within 100 to 130 from soldering temperture. Assured to e reflow soldering for 2 times. Note : he ove profiles re the mximum llowle soldering condition, therefore these profiles re not lwys recommended. his ctlog contins the typicl specifiction only due to the limittion of spce. hen you consider the purchse of our products, plese check our specifiction. For detils of ech product (chrcteristics grph, reliility informtion, precutions for use, nd so on), see our e site ( chipntenn_prec_e-e05r01
9 3. Storge Conditions Storge conditions 1. he Products should not e used in the following environments : exposure to specil gses such s (C12, NH3, SOx, NOx) exposure to voltile gs or inflmmle gs exposure to lot of dust exposure to wter or condenstion Precutions exposure to direct sunlight or freezing 2. he Products should e kept in the following conditions : emperture : -10~+40 Humidity : 70%RH mx. 3. he products should e used within 6 months fter delivery. In cse of storge over 6 months, solderility shll e checked efore ctul usge. Plese contct our offices for further detils of specifictions. All of the stndrd vlues listed here re suject to chnge without notice due to technicl improvements. herefore, plese check the specifictions crefully efore use. his ctlog contins the typicl specifiction only due to the limittion of spce. hen you consider the purchse of our products, plese check our specifiction. For detils of ech product (chrcteristics grph, reliility informtion, precutions for use, nd so on), see our e site ( chipntenn_prec_e-e05r01
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