3D Packaging & Integration North America TC Chapter Meeting Summary and Minutes

Transcription

1 3D Packaging & Integratin Nrth America TC Chapter Meeting Summary and Minutes NA Standards Spring 2018 Meetings Tuesday, April 10, 15:00 17:00 SEMI Headquarters, Milpitas, Califrnia TC Chapter Annuncements Next TC Chapter Meeting SEMICON West 2018 Standards Meetings Thursday, July 12, 10:30 12:00 Marritt Marquis, San Francisc, Califrnia Table 1 Meeting Attendees Italics indicate virtual participants C-Chairs: Richard Allen (NIST), Chris Mre (Cvalent Metrlgy), Sesh Ramaswami (Applied Materials) SEMI Staff: Laura Nguyen Cmpany Last First Cmpany Last First Asahi Glass Satu Yuichiru NIST Allen Richard Asahi Glass Takahashi Mark PrPrincipia Draper Dn Crning Schmidt Ilna Snscan Martell Steve Cvalent Metrlgy Mre Chris SuperSight Perrts Len Eda 2Asic Cnsulting Reiter Herb SEMI Nguyen Laura Table 2 Leadership Changes Nne Table 3 Cmmittee Structure Changes Nne Table 4 Ballt Results Nne Table 5 Activities Apprved by the GCS between meetings f the TC Chapter # Type SC/TF/WG Details 6332 SNARF FO-PLP Panel TF New Standard, Specificatin fr Panel Substrate Characteristics fr Fan-Out Panel Level Packaging (FO-PLP) Applicatins TC Member Review tk place between 12/20/2017 and 01/03/2018 befre apprval by GCS n 01/11/2018 3DP&I NA TC Chapter 1 Tuesday, April 10, 2018 Milpitas, Califrnia/USA

2 Table 6 Authrized Activities Listing f all revised r new SNARF(s) apprved by the Originating TC Chapter. # Type SC/TF/WG Details 6332 SNARF FO-PLP Panel TF 6075 SNARF 3DP&I Bnded Wafer Stacks 6389 SNARF NA 3DP&I Cmmittee 6390 SNARF NA 3DP&I Cmmittee #1 SNARFs and TFOFs are available fr review n the SEMI Web site at: New Standard, Specificatin fr Panel Substrate Characteristics fr Fan-Out Panel Level Packaging (FO-PLP) Applicatins TC Member Review tk place between 12/20/2017 and 01/03/2018 befre apprval by GCS n 01/11/2018 New Standard, Guide fr Describing Glass and Quartz Based Material fr Use in 3DS- IC Prcess Revisin t SNARF title and scpe. TC Member Review tk place between 03/13/2018 and 03/26/2018 Reapprval f SEMI 3D3-0613, Guide fr Multiwafer Transprt and Strage Cntainers fr 300 mm, Thin Silicn Wafers n Tape Frames Reapprval f SEMI 3D5-0314, Guide fr Metrlgy Techniques t be Used in Measurement f Gemetrical Parameters f Thrugh-Silicn Vias (TSVs) in 3DS-IC Structures Table 7 Authrized Ballts # When TF Details 6389 Cycle Cycle NA 3DP&I Cmmittee NA 3DP&I Cmmittee Reapprval f SEMI 3D3-0613, Guide fr Multiwafer Transprt and Strage Cntainers fr 300 mm, Thin Silicn Wafers n Tape Frames Reapprval f SEMI 3D5-0314, Guide fr Metrlgy Techniques t be Used in Measurement f Gemetrical Parameters f Thrugh-Silicn Vias (TSVs) in 3DS-IC Structures Table 8 SNARF(s) Granted a One-Year Extensin Nne Table 9 SNARF(s) Ablished # TF Title DP&I Bnded Wafer Stacks New Standard, Guide fr Describing Silicn Wafers fr Use in a 300 mm 3DS-IC Wafer Stack N industry push, Activity discntinued Table 10 Standard(s) t receive Inactive Status Nne Table 11 New Actin Items Item # Assigned t Details 2018April#01 Laura Nguyen, Rich Allen Laura t send draft LI SNARF fr SEMI 3D1 t Rich Allen, cpy Steve Martell and Chris Mre. Include RA fr 3D1 ballt results frm Cycle in . 3DP&I NA TC Chapter 2 Tuesday, April 10, 2018 Milpitas, Califrnia/USA

3 Table 12 Previus Meeting Actin Items Item # Assigned t Details 2017April#03 Rich Allen T cntact Victr Vartanian (nt at this time) and David Read (n) t see if they are still interesting f being TF leader. Clsed. 1 Welcme, Reminders, and Intrductins Richard Allen (NIST) called the meeting t rder at 15:00. The meeting reminders n antitrust issues, intellectual prperty issues and hlding meetings with internatinal attendance were reviewed. Attendees intrduced themselves. SEMI Standards Required Meeting Elements 2 Review f Previus The TC Chapter reviewed the minutes f the previus meeting. Mtin: By / 2 nd : Discussin: Vte: T accept the previus meeting minutes with revisins as amended. Steve Martell (Snscan) / Mark Takahashi (Asahi Glass) Nne. 4-0 in favr. Mtin passed. [2017Fall] 3DP&I NA Minutes FINAL_atm 3 Liaisn Reprts 3.1 3D Packaging & Integratin Japan TC Chapter Laura Nguyen (SEMI) reprted fr the Japan TC Chapter. Of nte: Leadership Cmmittee C-Chairs T JRSC 1st Chair persn, Kazunri Kat (AiT) 2nd Chair persn, Haru Shimamt (AIST) 3rd Chair persn, Masahir Tsuriya (inemi) GCS 1st GCS member, Kazunri Kat (AiT) 2nd GCS member, Masahir Tsuriya (inemi) Current Organizatin Chart f Japan TC Chapter {See attachment fr Org Chart} Meeting Infrmatin Last meeting Mnday, February 5, 2018 at Japan Winter 2018 Meetings Next meeting SEMI Japan ffice, Tky Mnday, May 21, 2018 at Japan Spring 2018 Meetings SEMI Japan ffice, Tky 3DP&I NA TC Chapter 3 Tuesday, April 10, 2018 Milpitas, Califrnia/USA

4 Authrized Activities Dc # Type SC/TF/WG Dcument Title/Details -- TFOF 3D Packaging & Integratin 5 Year Review TF 6352 SNARF 3D Packaging & Integratin 5 Year Review TF 6353 SNARF 3D Packaging & Integratin 5 Year Review TF The name f the task frce, the charter, and the scpe are revised due t the integratin f the tw glbal technical cmmittees. - Revisin t TFOF Line Item Revisin t SEMI G64-96 (Reapprved 0811) Specificatin fr Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) Authrized new SNARF Reapprval f SEMI G Specificatin fr Cin-Stack Type Tape Frame Shipping Cntainer fr 300 mm Wafer Authrized new SNARF Activities Apprved via GCS between Meetings # Type SC/TF/WG Details 6352 Ballt Submissin 6353 Ballt Submissin 3D Packaging & Integratin 5 Year Review TF 3D Packaging & Integratin 5 Year Review TF Line Item Revisin t SEMI G64-96 (Reapprved 0811) Specificatin fr Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) Apprved and authrized fr ballt vting Cycle by GCS n 03/09/2018 Reapprval f SEMI G Specificatin fr Cin-Stack Type Tape Frame Shipping Cntainer fr 300 mm Wafer Apprved and authrized fr ballt vting Cycle by GCS n 03/09/2018 Task Frce/Study Grup Highlights Thin Chip Handling TF #5836: New Standard: Test Methd fr Adhesive Strength fr Adhesive Tray Used fr Thin Chip Handling Ballt t be drafted 3D Packaging & Integratin 5 Year Review TF TF name/charter/scpe are revised due t the integratin f the tw cmmittees. Details are in the next slide. TC Chapter authrized the fllwing new SNARFs GCS authrized the fllwing dcuments t ballt in Cycle #6352: Line Item Revisin t SEMI G64-96 (Reapprved 0811) Specificatin fr Full- Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) #6353: Reapprval f SEMI G Specificatin fr Cin-Stack Type Tape Frame Shipping Cntainer fr 300 mm Wafer TF Name/charter/scpe are revised due t the integratin f the tw cmmittees. 3DP&I NA TC Chapter 4 Tuesday, April 10, 2018 Milpitas, Califrnia/USA

5 Steering Grup Open SNARFs Leadership: Masahir Tsuriya / inemi, Haru Shimamt / AIST, Eiji Yshin (Hitachi High- Technlgies) stepped dwn. Discussin: Technical Sharing: Organic Laminate Material Technlgy Overview (Hitachi Chemical) Panel Size TF status TF Opprtunities Discussin Adhesin strength n mlded surface Area Evaluatin metrlgy between RDL vs. ther materials in PLP/WLP Adhesive Tray Dcumentatin Update Open Discussin 6223: SEMI G (Reapprved 0811), Specificatin fr Integrated Circuit Leadframe Materials Used in the Prductin f Stamped Leadframes 6154: SEMI G10-96 (Reapprved 0811), Standard Methd fr Mechanical Measurement f Plastic Package Leadframes 6224: SEMI G11-88 (Reapprved 0811), Recmmended Practice fr RAM Fllwer Gel Time and Spiral Flw f Thermal Setting Mlding Cmpunds 6225: SEMI G13-88 (Reapprved 0811), Standard Test Methd fr Expansin Characteristics f Mlding Cmpunds 6226: SEMI G15-93 (Reapprved 0811), Standard Test Methd fr Differential Scanning Calrimetry f Mlding Cmpunds 6030: SEMI G20-96, Specificatin fr Lead Finishes fr Plastic Packages (Active Devices Only) 6227: SEMI G24-89 (Reapprved 0811), Test Methd fr Measuring the Lead-t-Lead and Lading Capacitance f Package Leads 6228: SEMI G25-89 (Reapprved 0811), Test Methd fr Measuring the Resistance f Package Leads 6229: SEMI G (Reapprved 0811) Specificatin fr Leadframes fr Plastic Mlded S.O. Packages 6233: SEMI G E (Reapprved 0811), Test Methd fr Trace Cntaminants in Mlding Cmpunds 6093: SEMI G , Test Methd fr Determining the Abrasive Characteristics f Mlding Cmpunds 6230: SEMI G43-87 (Reapprved 0811), Test Methd fr Junctin-t-Case Thermal Resistance Measurements f Mlded Plastic Packages 6094: SEMI G45-93, Recmmended Practice fr Flash Characteristics f Thermsetting Mlding Cmpunds 6095: SEMI G49-93, Specificatin fr Plastic Mlding Prefrms 6231: SEMI G51-90 (Reapprved 0811), Specificatin fr Plastic Mlded (Metric) Quad Flat Pack Leadframes 6232: SEMI G55-93 (Reapprved 0811), Test Methd fr Measurement f Silver Plating Brightness 6156: SEMI G (Reapprved 0811) Standard fr Equipment and Leadframe Fixtures fr Measurement f Plastic Package Leadframes 6167: SEMI G (Reapprved 0811), Test Methd fr Pull Strength fr Wire Bnding 5881: SEMI G , Specificatin fr Bar Cde Marking f Prduct Packages 6152: SEMI G , Measurement Methd fr Slder Sphere Size fr Ball Grid Array Package Five-Year Review 3DP&I NA TC Chapter 5 Tuesday, April 10, 2018 Milpitas, Califrnia/USA

6 Designatin Standard Title Actin By Assigned t SEMI G63-95 (Reapprved 0811) Test Methd fr Measurement f Die Shear Strength May DP&I 5 Year Review TF SEMI G Mechanical Interface Specificatin fr 450 mm Lad Prt fr Tape Frame Cassettes in the Backend Prcess Feb 2019 JA 450 ATDP TF Standards t receive Inactive Status Standard Designatin SEMI G (Reapprved 0811) SEMI G (Reapprved 0512) SEMI G (Reapprved 0612) SEMI G Title Specificatin fr Ball Grid Array Design Library Specificatin fr Overall Digital Timing Accuracy Test Methd fr the Analysis f Overall Digital Timing Accuracy fr Autmated Test Equipment Standard Test Data Frmat (STDF) Memry Fail Datalg Staff Cntact: Chie Yanagisawa, SEMI Japan (cyanagisawa@semi.rg) _JA_3DP&I_Liaisn_v D Packaging & Integratin Taiwan TC Chapter Laura Nguyen (SEMI) reprted fr the Taiwan TC Chapter. Of nte: Leadership Cmmittee C-Chairs: Wendy Chen (King Yuan Electrnics), Rger Hwang (ASE), Chien-Chung Lin (ITRI) Organizatin Chart {See attachment fr Figure} Meeting Infrmatin Previus meeting: Next meeting: Tuesday, September 26, 2017 at the Taiwan Fall 2017 Meetings; SEMI Taiwan ffice, Hsinchu Thursday, May 10, 2018 at the Taiwan Summer 2018 Meetings; SEMI Taiwan ffice, Hsinchu Ballt Results Dc # Dcument Title TC Chapter Actin 5800 New Standard: Guide fr Wafer Edge Trimming fr 3DS-IC Prcess Passed, with editrial change Task Frce Updates Middle End Prcess TF 3DP&I NA TC Chapter 6 Tuesday, April 10, 2018 Milpitas, Califrnia/USA

7 Dc 5800 passed Cycle 7-17 vte and wait the result f A&R prcedure review. Recruit new members frm TSMC, SPIL, PTI, UTC r Amkr t attend TC meeting. Testing TF Discuss New SNARF thin chip micr-crack inspectin guide. Call fr ther members with n-ging inspectin experience t jin the TF. The TF is recruiting new members. Five-Year Review Designatin Standard Title Actin By Assigned t SEMI 3D New Standard: Guide fr CMP and Micr-bump Prcesses fr Frntside Thrugh Silicn Via (TSV) Integratin May 10, 2018 Middle End Prcess TF SEMI 3D New Standard: Guide fr Alignment Mark fr 3DS-IC Prcess May 10, 2018 Middle End Prcess TF Staff Cntact: Dean Chang, SEMI Taiwan (dchang@semi.rg) _Taiwan_3DP&I_Liaisn_v1.1_LN 3.3 SEMI Staff Reprt Laura Nguyen (SEMI) gave the SEMI Staff Reprt. Of nte: SEMI Glbal 2018 Calendar f Events SEMICON Sutheast Asia (May 8-10; Kuala Lumpur, Malaysia) SEMICON West (July 10-12; San Francisc, Califrnia) SEMICON Taiwan (September 5-7; Taipei, Taiwan) SEMICON Eurpa (Nvember 13-16; Munich, Germany) SEMICON Japan (December 12-14; Tky, Japan) Upcming Nrth America Standards Meetings SEMICON West 2018 (July 9-12, 2018, San Francisc, Califrnia) NA Standards Fall 2018 Meetings (Nvember 5-8, 2018, SEMI HQ in Milpitas, Califrnia) NA Standards Spring 2019 Meetings (April 1-4, 2019 [tentative], SEMI HQ in Milpitas, Califrnia) Letter Ballt Critical Dates fr 2017 & 2018 Cycle : ballt submissin due: March 9/Vting Perid: March 23 April 23 Cycle : ballt submissin due: April 20/Vting Perid: April 30 May 30 Cycle : ballt submissin due: May 11/Vting Perid: May 25 June 25 Critical Dates: 3DP&I NA TC Chapter 7 Tuesday, April 10, 2018 Milpitas, Califrnia/USA

8 Standards Publicatins Reprt Cycle New Revised Reapprved Withdrawn Nvember December January February March Ttal in prtfli 985 (includes 225 Inactive Standards) Nncnfrming Titles (See PM Appendix 4) {Nne} Five-Year Review SEMI 3D3-0613, Guide fr Multiwafer Transprt and Strage Cntainers fr 300 mm, Thin Silicn Wafers n Tape Frames SEMI 3D5-0314, Guide fr Metrlgy Techniques t be Used in Measurement f Gemetrical Parameters f Thrugh-Silicn Vias (TSVs) in 3DS-IC Structures SNARF 3 Year Status, TC Chapter may grant a ne-year extensin 5173: New Standard, Guide fr Describing Silicn Wafers fr Use in a 300 mm 3DS-IC Wafer Stack SNARF was apprved n 3/29/2011; One-year extensin granted in Spring 2017 SNARF expires Spring : New Standard, Terminlgy fr 3DS-IC Technlgy SNARF expires Fall 2018 SNARF(s) Apprved by GCS in between TC Chapter Meetings Revisin t SNARF 6075: New Standard, Guide fr Describing Glass-Based Material fr Use in 3DS-IC Prcess New SNARF: New Standard, Specificatin fr Panel Substrate Characteristics fr Fan-Out Panel Level Packaging (FO-PLP) Applicatins In-prgress/Needs Actin SNARF apprved via GCS, January 11, 2018 Revisin t SNARF 6332; Mdified title SEMI 3D1, Terminlgy fr Thrugh Silicn via Gemetrical Metrlgy Reapprval Ballt / Cycle 4, 2017 Publicatin pending; Task Frce agreed t address Accept with Cmment in future Line Item Ballt [2018Spring] Staff Reprt 3DP&I 4 Ballt Review NOTE 1: TC Chapter adjudicatin n ballts reviewed is detailed in the Audits & Review (A&R) Subcmmittee Frms fr prcedural review. The A&R frms are available as attachments t these minutes. The attachment number fr each ballted dcument is prvided under each ballt review sectin belw. Nne 3DP&I NA TC Chapter 8 Tuesday, April 10, 2018 Milpitas, Califrnia/USA

9 5 Subcmmittee and Task Frce Reprts 5.1 3DP&I Inspectin and Metrlgy Task Frce 5.2 3DP&I Bnded Wafer Stacks Task Frce Task Frce Leaders reprted fr bth the 3DP&I Inspectin and Metrlgy and 3DP&I Bnded Wafer Stacks Task Frces. Of nte, during the task frce meeting, the task frce reviewed and cntinued wrking n the belw draft dcuments. There is n new update at this time. 6175: New Standard, Guide n Measurements f Openings and Vias in Glass 6075: New Standard, Guide fr Describing Glass-Based Material fr Use in 3DS-IC Prcess Please cntact Ilna Schmidt (Ilna.schmidt@crning.cm) and Rich Allen (richard.allen@nist.gv) if yu wuld like t participate in these activites. 5.3 Fan-Out Panel Level Packaging (FO-PLP) Panel Task Frce Richard Allen (NIST) reprted fr this Task Frce. Of nte: The Task Frce reviewed cmments t Draft Dcument 6332, New Standard, Specificatin fr Panel Substrate Characteristics fr Fan-Out Panel Level Packaging (FO-PLP) Applicatins, versin 3. Mdificatins were made t these areas listed belw. Please lk at the dcument and prvide feedback. A categry was added t qualify substrate type in Table 1, Sectin 2-1 Sizes that members advcated seem t be majrity 510 mm x 515 mm and 600 mm x 600 mm A small number f members advcated fr 650 mm x 650 mm Received a sampling plan frm NCAP; added t Sectin 8 Mre specific thickness ptins were added In additin, Japan PIC Chapter is prpsing a TFOF fr FO-PLP Wide Panel FOUP TF. T be prpsed at the next PI&C Japan TC Chapter meeting n April 26. T be prpsed in respnse t the frmatin f Fan-Out Panel Level Packaging (FO-PLP) Panel Task Frce under the 3D Packaging & Integratin NA TC Chapter. TFOF t be prpsed Charter: This TF will fcus n the develpment n Panel FOUP and related physical interface standards fr FO-PLP utilizing existing SEMI 450mm standards. The target panel size is assumed as fllws; Width 500~650mm x Depth 500~650mm Scpe: Develp the requirements fr: Panel FOUP Equipment t Panel FOUP interfaces FO-PLP Panel TF Meeting_2018Apr_v3 6 Old Business 6.1 Previus Actin Items Previus actin items are nted in Table 12 in red and fr recent updates in blue. There is n further ld business. 3DP&I NA TC Chapter 9 Tuesday, April 10, 2018 Milpitas, Califrnia/USA

10 6.2 Authrized Activities Standards due fr Five-Year Review The cmmittee reviewed the Standards due fr Five-Year Review. The cmmittee discussed these dcuments and decided t ballt fr reapprval. The fllwing actins were taken belw. Mtin: Mtin t authrize SEMI 3D3 and 3D5 fr Reapprval Ballt in Cycle 4, By / 2 nd : Discussin: Vte: Steve Martell (Snscan) / Mark Takahashi (Asahi Glass) Nne. 5-0 in favr. Mtin passed SNARF Three-Year Status The cmmittee reviewed the SNARFs three-year status list. The cmmittee discussed these dcuments and the fllwing actins were taken belw. Mtin: Mtin t ablish (abandn) SNARF 5173; New Standard, Guide fr Describing Silicn Wafers fr Use in a 300 mm 3DS-IC Wafer Stack. By / 2 nd : Discussin: Vte: Steve Martell (Snscan) / Chris Mre (Cvalent Metrlgy) Nne. 6-0 in favr. Mtin passed. 6.3 SEMI 3D1 Laura Nguyen infrmed the cmmittee n this tpic. SEMI 3D1 was a Reapprval Ballt in Cycle Cmments were received that wuld be later addressed in a Line Item Ballt. An Actin Item was taken t reach ut t vter(s) wh made the cmments and begin drafting a SNARF fr revisin. Actin Item: 2018April#01; Laura t send draft LI SNARF fr SEMI 3D1 t Rich Allen, cpy Steve Martell and Chris Mre. Include RA fr 3D1 ballt results frm Cycle in . [Ballt Results] Cycle DS-IC_atm 7 New Business 7.1 Revisin t SNARFs SNARF 6075 Ilna Schmidt (Crning) addressed the cmmittee n this tpic. SNARF fr 6075 was revised t clarify title and scpe. Tw-week TC member was sent ut between 03/13/2018 and 03/26/2018 and brught t the cmmittee fr apprval. Mtin: By / 2 nd : Discussin: Vte: Mtin t apprve revisin t SNARF 6075: New Standard, Guide fr Describing Glass-Based Material fr Use in 3DS-IC Prcess as written in the TC Chapter meeting. Steve Martell (Snscan) / Mark Takahashi (Asahi Glass) Nne. 4-0 in favr. Mtin passed. SNARF_Guide fr Describing(revisinv2)_atm SNARF 6332 Rich Allen (NIST) addressed the cmmittee n this tpic. SNARF 6332 was revised t clarify title and scpe. TC Member Review tk place between 12/20/2017 and 01/03/2018 befre apprval by GCS n 01/11/ DP&I NA TC Chapter 10 Tuesday, April 10, 2018 Milpitas, Califrnia/USA

11 In the 2018 March TF Meeting, TF members agreed t replace "Size" with "Characteristics" in the title: Specificatin fr Panel Substrate Characteristics fr Fan-Out Panel Level Packaging (FO-PLP) Applicatins. This was brught t the cmmittee fr apprval. Mtin: By / 2 nd : Discussin: Vte: Mtin t authrize revisin t SNARF 6332, New Standard, Specificatin fr Panel Substrate Characteristics fr Fan-Out Panel Level Packaging (FO-PLP) Applicatins. Steve Martell (Snscan) / Rich Allen (NIST) Nne. 6-0 in favr. Mtin passed. 8 Next Meeting and Adjurnment The next meeting is scheduled fr Tuesday, July 10, 2018 in cnjunctin with SEMICON West at the Marritt Marquis in San Francisc, Califrnia. See fr the current list f events. New Schedule: Wednesday, July 11 Thursday, July 12 Adjurnment: 15:31. 13:00-16:00 FO-PLP Panel (TF) 09:00-10:30 3DP&I Bnded Wafer Stacks and Inspectin and Metrlgy (TFs) 10:30-12:00 3DP&I (C) Respectfully submitted by: Laura Nguyen Crdinatr, Internatinal Standards SEMI Headquarters Phne: lnguyen@semi.rg Minutes tentatively apprved by: Richard Allen (NIST), C-chair July 5, 2018 Sesh Ramaswami (Applied Materials), C-chair <Date apprved> Chris Mre (Cvalent Metrlgy), C-chair <Date apprved> Table 13 Index f Available Attachments #1 Title SEMI Standards Required Meeting Elements [2017Fall] 3DP&I NA Minutes FINAL_atm _JA_3DP&I_Liaisn_v _Taiwan_3DP&I_Liaisn_v1.1_LNv Title [2018Spring] Staff Reprt - 3DP&I SNARF_Guide fr Describing(revisinv2)_atm [Ballt Results] Cycle DS-IC_atm FO-PLP Panel TF Meeting_2018Apr_v3 #1 Due t file size and delivery issues, attachments must be dwnladed separately. A.zip file cntaining all attachments fr these minutes is available at Fr additinal infrmatin r t btain individual attachments, please cntact Laura Nguyen at the cntact infrmatin abve. 3DP&I NA TC Chapter 11 Tuesday, April 10, 2018 Milpitas, Califrnia/USA