North America HB-LED Committee Meeting Summary and Minutes

Transcription

1 Nrth America HB-LED Cmmittee Meeting Summary and Minutes N.A. Standards Fall 2013 Meetings Thursday, Octber 31, :00 17:00 PST Next Cmmittee Meeting The next N.A. HB-LED cmmittee meeting is tentatively scheduled fr April 3, 2014 in cnjunctin with the NA Standards Spring 2014 Meetings at. Fr additinal meeting details, the latest schedule, registratin, and travel infrmatin, please visit Table 1 Meeting Attendees C-Chairs: Chris Mre (---), Iain Black (Philips Lumileds), Bill Quinn (William Quinn Cnsulting), David Reid (Silian) SEMI Staff: Michael Tran Cmpany Last First Cmpany Last First BayTech Grup Baylies Winthrp Snscan Martell Steve Bruker Nan Nvak Matt Self Wagner Peter Rubicn Technlgy K Dnggeun Saint-Gbain Maicc Lisa SEMI Krea Shim Natalie Silian Cha Julie SEMI N.A. Tran Michael Italics indicates virtual participants Table 2 Leadership Changes Nne. Table 3 Ballt Results Nne. Table 4 Authrized Activities # Type SC/TF/WG Details 5629 Revised SNARF Impurities and New Standard, Guide fr Identificatin Defects n Bare Surfaces f Sapphire Wafers Nte: SNARFs and TFOFs are available fr review n the SEMI Web site at: Table 5 Authrized Ballts # When SC/TF/WG Details 5684 Cycle 8, Cycle 1, 2014 HB-LED Wafer Line Item Revisins t SEMI HB1-0113, Specificatins fr Sapphire Wafers Intended fr TF Use fr Manufacturing High Brightness-Light Emitting Dide Devices Impurities and New Standard, Guide fr Identificatin Defects n Bare Surfaces f Sapphire Wafers N.A. HB-LED Cmmittee 1 Thursday, Octber 31, 2013

2 Table 6 New Actin Items Item # Assigned t Details 2013Oct# Oct#02 HB-LED Wafer TF HB-LED Wafer TF Meeting n Nvember 13 t review ballt prpsal f Dcument 5684 and send t SEMI. Write supprting paragraph t explain changes t rughness descriptin in SEMI HB Oct#03 Impurities and 2013Oct#04 Impurities and 2013Oct#05 Impurities and 2013Oct#06 Impurities and Cllect images fr area cntaminatin, particles, and vids. Include scale fr all images. Review Page 1 (Purpse, Scpe, Limitatins, Referenced Standards and Dcuments) in SEMI HB1. Meet n Nvember 12 t review updated dcument. Need t determine which Cycle in 2014 t ballt Dcument Table 7 Previus Meeting Actins Items Item # Assigned t Details Status 2013Jul#01 Michael Tran Frward Brian Rubw s ballt mtin slides t David Reid (Silian). Open 2013Jul#02 Michael Tran Wrk with Natalie Shim (SEMI Krea) t align the Krea HB-LED Wrking Grup charter with the Glbal HB-LED charter. 2013Jul#03 Michael Tran Transfer existing SNARFs under the Equipment TF Open 2013Jul#04 Bevan Wu Re-instigate cmmunicatin with ITRI n 2 PSS feedback. Open 2013Jul#05 Peter Wagner Share wafer flatness parameter presentatin. Has t be published in M1 first as RI t reference it. 2013Jul# Jul# Jul#08 Peter Wagner, Prpse 4 and 6 wafer gemetry specs fr PSS. Julie Cha, and Win Baylies Peter Wagner, Julie Cha, Win Baylies, Jhn Stver, Steve Martell, and Christpher Jnes Frank, Andrew Kim, Julie Cha, Peter Wagner T wrk n the first draft f Dcument # 5630, (Guide fr Measuring Surface Rughness f Sapphire Wafers fr HB-LED Applicatins) by Octber T wrk n DSP specificatin and survey. 2013Apr#02 David Jyce Wrk n the defect definitins as a Related Infrmatin additin t SEMI HB1. Open DONE based n rund 1 f survey after we understand the def. better. but want mre feedback. Examine at Strategies in Light in Santa Clara Lk int cntacting NIST abut getting invlved in this wrk. DONE. In prgress. N.A. HB-LED Cmmittee 2 Thursday, Octber 31, 2013

3 Item # Assigned t Details Status 2013Apr#06 Win Baylies, Julie Cha, Francis Nguyen 2013Apr#010 Len Perrts Review SEMI M38 and wrk n adding reclaimed wafer specificatins t SEMI HB1. Prepare a reprt t the cmmittee n the applicability f ntchless wafers t HB-LED sapphire wafers. In prgress. 2012Oct#02 Chris Mre Review SNARF #5529 (HB-LED JMMM) fr Aixtrn nly specificatins. OPEN 2012Oct#03 Chris Mre Send an t the Eurpean Silicn Wafer cmmittee regarding the HB- LED cmmittee revisins t their SNARF fr Gallium Nitride n Silicn Wafer Fllw up with Len. OPEN 1 Welcme, Reminders, and Intrductins 1.1 Win Baylies (BayTech Grup) called the meeting t rder at 3:00 PM PST. The meeting reminders n antitrust issues, intellectual prperty issues and hlding meetings with internatinal attendance were reviewed. Attendees intrduced themselves. Attachment: 01, SEMI Standards Required Meeting Elements 2 Review f Previus 2.1 The cmmittee reviewed the minutes f the previus meeting. Mtin: By / 2 nd : Discussin: Vte: T apprve the previus meeting minutes as written. Steve Martell (Snscan) / Julie Cha (Silian) Nne. 3-0 in favr. Mtin passed. Attachment: 02, HB-LED (West 2013) 3 Liaisn Reprts 3.1 N.A. SEMI Staff Reprt Michael Tran (SEMI N.A.) gave the N.A. Staff Reprt. The key items were as fllws: SEMI Majr Events in 2013 Cmpleted: SEMICON Eurpa in cnjunctin with Plastic Electrnics Exhibitin 2013 Octber 8-10, 2013 in Dresden, Germany Strategic Materials Cnference Octber 16-17, 2013 in Santa Clara, Califrnia PV Taiwan 2013 Octber 30-Nvember 1, 2013 in Taipei SEMICON Japan December 4-6, 2013 in Chiba SEMI Majr Events in 2014 N.A. HB-LED Cmmittee 3 Thursday, Octber 31, 2013

4 Eurpean 3D TSV Summit January 21-22, 2014 in Grenble, France SEMICON Krea / LED Krea SEMICON China February 12-14, 2014 in Seul March 18-20, 2014 in Shanghai SEMICON Singapre SEMICON West April 23-25, 2014 in Marina Bay Sands July 8-10, 2014 in San Francisc, Califrnia SEMI Standards Publicatins Standards published frm July 2013 t September 2013: New Standards: 5 Revised Standards: 19 Reapprved Standards: 9 Withdrawn Standards: 0 There are a ttal f 892 SEMI Standards in prtfli and that includes 98 Inactive standards New Cycle 8 Vting Perid (tentative) Cycle 8, 2013 Ballt Submissin Date: Nv 15, 2013 Vting Perid Starts: Nv 29, 2013 Vting Perid Ends: Dec 31, 2013 Upcming Nrth America Standards Meetings in 2014 NA Liquid Chemicals Fall 2013 Meetings Nvember 5, 2013, SEMI HQ in San Jse NA Cmpunds Semicnductr Materials Cmmittee Fall 2013 Meeting Nvember 15, Telecnference & Web Meeting Only NA Standards Spring 2014 Meetings Standards Usage Interview March 31 April 3, 2014 at SEMI HQ in San Jse, Califrnia Lking fr details n hw standards are actually used: Develpment/Engineering Prcurement Manufacturing Interview shuld take less than 30 minutes cntact James Aman (jaman@semi.rg) Official SEMI Standards Grups LinkedIn N.A. HB-LED Cmmittee 4 Thursday, Octber 31, 2013

5 SEMI N.A. Standards staff cntact: Michael Tran, Attachment: 03, SEMI NA Standards Staff Reprt (Fall 2013) 3.2 Krea HB-LED Wrking Grup Michael Tran (SEMI NA) reprted fr the HB-LED Wrking Grup. Sme key items f nte: Discussin: nte: Leadership Hyungsu Park / SEMES Jnghyup Baek/ KOPTI Meeting Infrmatin Majr Updates Last meeting Octber 11, 2013 at SEMI Krea Office Next Meeting December 13, 2013 at SEMI Krea Office The wrking grup tentatively frmed tw sub teams; MO Surce and SEMI HB1 Review. MO (Mlybdenum) Surce team The team cllected frm three majr chemical cmpanies the cmmn specs f MO Surce. The data will be reviewed in the next meeting. SEMI HB1 Review team Chip makers reviewed SEMI HB1 and listed up revisin items. The revisin items were discussed with wafer cmpany. The team will invite mre wafer cmpanies in the next meeting and get their input. SEMI Krea Standards staff cntact: Natalie Shim, eshim@semi.rg Natalie Shim f SEMI Krea went int details f the MO Surce team and SEMI HB1 Review. Of MO Surce Team: The team wanted mre feedback n general specificatins. They als need standardizatin n cntainers s they can be replaced easily. SEMI HB1 Review Team: The team thught the flat length is pretty wide t fit industry requirements They prefer t reduce the size and they will need mre study n the three lwer sizes prpsed by the users. N.A. HB-LED Cmmittee 5 Thursday, Octber 31, 2013

6 Dnggeun K said the current rientatin flat length is t large. The device makers will lse real estate f the wafer and s they try t reduce the flat size t get mre chips. It is general trend f the device cmpanies. Win Baylies added that a ntch is anther way as it uses less area than a flat. Mre n the team s thughts n the flat f the wafers: They will need t study the specs fr each side f the wafer fr alignment. The crner flat is runded and it can be difficult t align. Natalie shim asked ne member and they als had a prblem with the flat length in the prductin line The TF sees this as mre f an equipment issue than with the wafers itself. They prpse perhaps the HB-LED Equipment autmatin TF can lk int this. The Krea cmpanies think the specs in SEMI HB1 are t general fr them Julie Cha said the HB-LED Wafer TF is willing t listen. The SEMI HB1 specs are lse s it can meet all custmers requirements. The Krea HB-LED WG is still trying t determine what standards is as it is a new cncept t them. The team thught that their crystal plane directin is nt matching with SEMI HB1 This culd lead t the wafer cracking as a result and they need matching directins. Dnggeun K said matching the directins is very critical as it can impact a lt f different prcesses. Bw Tlerance The chipmakers think is nt addressed r well defined. Dnggeun K said it is a cmplicated issue. There is n clear cnsensus between chip makers and the industry is mving twards negative bw. Natalie Shim said there were questins abut the tlerance. Zer is t be the starting pint, but zer desn t mean flat s it is nt clear. The chipmakers never use a psitive bw. Julie Cha said the TF culd nt agree n a target. As lng as target is within the range then it s k. Steve Martell added, if it is in a certain range then negative and psitive shuld nt matter. The team is als interested in the PSS TF The PSS TF is cnsidering rlling ut the PSS survey until the end f December fr SEMI HB1 Review team s feedback. Attachment: 04, Krea HB-LED Wrking Grup Reprt Fall Ballt Review 4.1 Nne. 5 Subcmmittee & Task Frce Reprts 5.1 HB-LED Wafer Task Frce / Impurities and Defects Task Frce Julie Cha (Silian) and Winthrp Baylies (BayTech Grup) reprted fr the HB-LED Wafer Task Frce / Impurities and Defects Task Frce. The TF discussed the fllwing tpics: Near Edge Prperties: N.A. HB-LED Cmmittee 6 Thursday, Octber 31, 2013

7 The HB-LED Wafer TF will jin the Advanced Wafer Gemetry (AWG) TF t supprt near edge prperties applicable t sapphire wafers. Duble Sided Plished (DSP) Wafer Specs: The TF reviewed prpsed specs fr 2, 4 and 6 DSP wafers. Lasermarking Activities Reviewed updates fr Rund 3 lasermarking. Rubicn Technlgy wants t jin the next lasermakring telecnference call. HB-1 Revisin: Reviewed SNARF fr changing lasermark t include frnt and/r back side Finalized rughness descriptin Rubicn wants t knw if transmittance target and transmittance variatin shuld be in the specificatin table. T be discussed later Actin Item: Actin Item: 2013Oct#01, The HB-LED Wafer TF meeting n Nvember 13 t review ballt prpsal f Dcument 5684 and send t SEMI by Nvember 15 fr Cycle Oct#02, The HB-LED Wafer TF t write supprting paragraph t explain changes t rughness descriptin in SEMI HB1. Impurities and Defects: The TF updated list f defects. Reviewed Saint Gbain s changes in captins. Changes t be merged. Mdified SNARF and changed Specular surfaces t bare surfaces (see 7.1 f these minutes). Actin Item: Actin Item: Actin Item: 2013Oct#03, The Impurities and t cllect images fr area cntaminatin, particles, and vids. 2013Oct#04, The Impurities and t include scale fr all images. 2013Oct#05, The Impurities and t review Page 1 (Purpse, Scpe, Limitatins, Referenced Standards and Dcuments) in SEMI HB1. Actin Item: 2013Oct#06, The Impurities and t meet n Nvember 12 t review updated dcument. Need t determine which Cycle in 2014 t ballt Dcument Attachment: 05, HB-LED Wafer TF Reprt Fall Patterned Sapphire Substrates (PSS)Task Frce Matt Nvak (Bruker-Nan) and Win Baylies (BayTech Grup) reprted fr the TF. The TF reviewed the PSS survey results and Julie Cha prpsed t add mre questins t it: 1. What type f shape is mst imprtant: cne, pyramid r dme? 2. Is the alignment f the hexagnal shape imprtant in reference t the fiducial (flat r ntch)? 3. What are the tlerances fr parameters A, B and C? N.A. HB-LED Cmmittee 7 Thursday, Octber 31, 2013

8 5.2.2 The TF wuld like Dnggeun K (Rubicn Technlgy) t cmplete the survey fr his cmpany s feedback. The TF drafted a summary table with the survey results and they are pen t implementing additinal survey questins as Julie Cha suggested. The TF reviewed the PSS Wafer Specs (Flatness Requirements) fr 2, 4 and 6 PSS wafers and decided t wait fr the SEMI M1 diagrams t be published, re-d survey after task frce is mre familiar with each definitin. The survey nly yielded 20% f replies despite having 20 members in the TF s the TF wuld like t release an updated PSS survey smetime in Nvember Attachment: 06, PSS Survey Results 5.3 HB-LED Equipment Cmmunicatin Interfaces TF Michael Tran reprted n behalf f Brian Rubw (Cimetrix) fr the TF. The TF plans t have dcument 5529, New Standard: Specificatin f Jb Management and Material Management fr High Brightness LED Manufacturing Equipment (HB-LED JMMM) cmpleted by the end f The TF is als wrking with the NA Infrmatin & Cntrl cmmittee n dcument 5508, Revisins t: SEMI E5, SEMI Equipment Cmmunicatins Standard 2 Message Cntent (SECS-II), SEMI E90, Specificatin fr Substrate Tracking, SEMI E90.1, Specificatin fr SECS-II Prtcl Substrate Tracking. Attachment: 07, HB-LED Equipment Cmmunicatin Interfaces TF Reprt (Fall 2013) 6 Old Business 6.1 Nne. 7 New Business 7.1 New SNARFs and TFOFs # Type SC/TF/WG Details 5629 Revised SNARF Impurities and New Standard, Guide fr Identificatin Defects n Bare Surfaces f Sapphire Wafers Mtin: T apprve revised SNARF #5629. By / 2 nd : Steve Martell (Snscan) / Julie Cha (Silian) Discussin: Nne. Vte: 3-0 in favr. Mtin passed. 7.2 Ballt Authrizatins # Type SC/TF/WG Details 5684 Cycle 8, Cycle 1, 2014 HB-LED Wafer Line Item Revisins t SEMI HB1-0113, Specificatins fr Sapphire Wafers Intended fr TF Use fr Manufacturing High Brightness-Light Emitting Dide Devices Impurities and New Standard, Guide fr Identificatin Defects n Bare Surfaces f Sapphire Wafers Mtin: T apprve the letter ballt f dcument 5684 in Cycle 8, By / 2 nd : Discussin: Vte: Julie Cha (Silian) / Steve Martell (Snscan) Nne. 3-0 in favr. Mtin passed. N.A. HB-LED Cmmittee 8 Thursday, Octber 31, 2013

9 Mtin: T apprve the letter ballt f dcument 5629 in Cycle 1, By / 2 nd : Julie Cha (Silian) / Steve Martell (Snscan) Discussin: Nne. Vte: 3-0 in favr. Mtin passed. 8 Actin Item Review 8.1 Open Actin Items Michael Tran (SEMI N.A.) reviewed the pen actin items. These can be fund in the Open Actin Items table at the beginning f these minutes. 8.2 New Actin Items Michael Tran (SEMI N.A.) reviewed the new actin items. These can be fund in the New Actin Items table at the beginning f these minutes. 9 Next Meeting and Adjurnment 9.1 The next NA Standards HB-LED Task Frce meetings will be in cnjunctin with Strategies in Light in Santa Clara, Califrnia frm February 25 t 27, Exact meeting dates and details as they becme available will be psted t the SEMI Standards Calendar f Events at After Strategies in Light, The NA Standards HB-LED Meetings will be held in cnjunctin with the NA Standards Spring 2014 Meetings at SEMI Headquarters, in San Jse Califrnia. Exact meeting dates and details as they becme available will be psted here: *Tentative Schedule* Wednesday, April 2* Thursday, April 3* Patterned Sapphire Substrate (PSS) TF (08:30 AM - 12:00 PM Nn) HB-LED Equipment Cmmunicatin Interfaces TF (09:00 AM - 2:30 PM) HB-LED Wafer TF / Impurities & (08:00 AM - 3:00 PM) HB-LED Technical Cmmittee (3:00 PM - 5:00 PM) 9.2 Having n further business, a mtin was made t adjurn the N.A. HB-LED cmmittee meeting n July 11, 2013 in cnjunctin with the N.A. Standards SEMICON West 2013 Meetings at the San Francisc Marritt Marquis Htel in San Francisc, Califrnia. Respectfully submitted by: Michael Tran Senir Standards Engineer SEMI Nrth America Phne: mtran@semi.rg N.A. HB-LED Cmmittee 9 Thursday, Octber 31, 2013

10 Minutes apprved by: Chris Mre (---), C-chair Bill Quinn (William Quinn Cnsulting), C-chair David Reid (Silian), C-chair Iain Black (Philips Lumileds), C-chair Table 8 Index f Available Attachments #1 # Title # Title 01 SEMI Standards Required Meeting Elements 05 HB-LED Wafer TF Reprt Fall NA HB-LED (West 2013) 06 PSS Survey Results 03 SEMI NA Staff Reprt Fall HB-LED Equipment Cmmunicatin Interfaces TF Reprt (Fall 2013) 04 Krea HB-LED Wrking Grup Reprt Fall 2013 #1 Due t file size and delivery issues, attachments must be dwnladed separately. A.zip file cntaining all attachments fr these minutes is available at Fr additinal infrmatin r t btain individual attachments, please cntact Michael Tran at the cntact infrmatin abve. N.A. HB-LED Cmmittee 10 Thursday, Octber 31, 2013