Thermal Management of a Generic Transmitter/Receiver (T/R) Module Array
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1 Therma Management of a Generic Transmitter/Receiver (T/R) Modue Array Mechanica Engineering Department The University of Mississippi
2 Singe T/R Modue
3 Singe T/R Modue on the Base Pate (Stick)
4 One Stick with Four T/R Modues (1 X 4 Array)
5 4 x 4 Modue Array
6 Objectives for 4 x 4 Modue Array Anayze Modue Array for Different Power Leves and Ambient Conditions Predict 3-D Temperature Fied Predict Fow Fied Behavior Determine Critica Hot Spots Deveop Effective Cooing Schemes Reach a Load of 42W on Power Chips Whie Maintaining Temperature Vaues Beow 150 C Predict the Temperature Vaues in Load Range of 6W-42W for Each Cooing Scheme
7 Design Constraints for the Modue Array Must Operate in Three Different Ambient Conditions ( 20 C, 52 C, -25 C) 3 mm from Front Side of Cabinet Wa 2.0 cm Spacing Between Sticks
8 Packing Density
9 THERMAL ANALYSIS TOOL 3-D ICEPAK ( Fuent ) Finite Voume Based Transient/Steady State Fexibe Geometry Industry Empoyed
10 Deveopment of Cooing Schemes Forced Convection Cooing by Fans (Preiminary Anaysis 1) Modue Array Pacement (Preiminary Anaysis 2) Determining Vent Size and Location (Case 1-a) Aternative Materia for Base Pate (Case 1-b) Base Pate as Heat Sink (Case 2) 2.54 cm Lip, Instead of 1.27 cm Lip on Front Side Between the Modue and the Base Pate (Case 3) Fins Beneath Sticks (Case 4) Heat Sinks on Top of Modue (Case 5) Defector Pate in Conjunction with Heat Sinks (Case 6)
11 Organization of Cases Case 1-a Case 1-b Case 2 Case 3 Case 4 Case 5 Case 6 Ambient 20 C Ambient 52 C Ambient -25 C 6 W 18 W 30 W 42 W 6 W 18 W 30 W 42 W 6 W 18 W 30 W 42 W
12 Simuation Parameters Load on each Power Chip 42W Ambient Temperature 20 C Steady State Turbuent Fow Radiation On
13 Preiminary Anaysis 1
14 Case 1-a1
15 Tabe 1-a1 L Temperature Vaues on Power Chip ( C ) o a d First Stick Second Stick Third Stick Fourth Stick W W W 42 W Ambient Temperature 20 C Radiation On Steady State Turbuent Fow
16 Case 3
17 Tabe 3 L Temperature Vaues on Power Chip ( C ) o a d First Stick Second Stick Third Stick Fourth Stick W W W 42 W Ambient Temperature 20 C Radiation On Steady State Turbuent Fow
18 Case 6
19 Tabe 6 L Temperature Vaues on Power Chip ( C ) o a d First Stick Second Stick Third Stick Fourth Stick W W W 42 W Ambient Temperature 20 C Radiation On Steady State Turbuent Fow
20 Cases Comparison Among Different Cases, (Ambient Temperature 20 C) Temperature Vaues on Power Chip ( C ) First Stick Second Stick Third Stick Fourth Stick Case 1-b Case 1-a Case Case Case Case Case Load on each Power Chip: 42 W Radiation On Steady State Turbuent Fow
21 Cases Comparison Among Different Cases, (Ambient Temperature 52 C) Temperature Vaues on Power Chip ( C ) First Stick Second Stick Third Stick Fourth Stick Case 1-b Case 1-a Case Case Case Case Case Load on each Power Chip: 42 W Radiation On Steady State Turbuent Fow
22 Comparison Among Different Cases, (Ambient Temperature -25 C) Temperature Vaues on Power Chip ( C ) Cases First Stick Second Stick Third Stick Fourth Stick Case 1-b Case 1-a Case Case Case Case Case Load on each Power Chip: 42 W Radiation On Steady State Turbuent Fow
23 Performance of Cases 1 ( Ambient 20 C) Faiure Temperature Max Temperature ( C ) CASE 1-b CASE 1-a CASE 2 CASE 3 CASE 4 CASE 5 CASE Therma Load ( W )
24 Performance of Cases ( Ambient 52 C) Faiure Temperature 150 Max Temperature ( C ) CASE 1-b CASE 1-a CASE 2 CASE 3 CASE 4 CASE 5 CASE Therma Load ( W )
25 Performance of Cases ( Ambient 25 C) Max Temperature ( C ) CASE 1-b CASE 1-a CASE 2 CASE 3 CASE 4 CASE 5 CASE Therma Load ( W )
26 Maximum Temperature for Different Cases Ambient 20 C Case 1-b: 148 C Case 1-a: 143 C Case 2 : 127 C Case 3 : 124 C Case 4 : 122 C Case 5 : 100 C Case 6 : 97 C Ambient 52 C Case 1-b : 178 C Case 1-a : 174 C Case 2 : 158 C Case 3 : 155 C Case 4 : 153 C Case 5 : 132 C Case 6 : 128 C Ambient 25 C Case 1-b : 104 C Case 1-a : 100 C Case 2 : 83 C Case 3 : 80 C Case 4 : 79 C Case 5 : 56 C Case 6 : 52 C
27 Key Concusions Case 1-a to Case 4 were successfu in meeting the design goas in mid and artic cimatic conditions Case 5 and Case 6 were successfu in meeting the design goas for a the three different ambient conditions
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