TPS62153AQRGTTQ1 TPS62150AQRGTTQ1. Texas Instruments Incorporated PCN
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1 PCN Number: PCN Date: Dec. 1, 2016 Title: TPS6213xA/15xA and TPS6216x/17x Robustness Improvement Customer PCN Manager Dept: Quality Services Contact: Proposed 1 st Estimated Sample Date provided at Ship Date: June 1, 2017 Availability: sample request Change Type: Assembly Site Design Wafer Bump Site Assembly Process Data Sheet Wafer Bump Material Assembly Materials Part number change Wafer Bump Process Mechanical Specification Test Site Wafer Fab Site Packing/Shipping/Labeling Test Process Wafer Fab Materials Wafer Fab Process PCN Details Description of Change: Texas Instrumen Incorporated is pleased to announce continuous design improvement effor for robustness of the existing TPS62130A, TPS62133A, TPS62150A, TPS62153A, TPS62160Q, TPS62170Q and TPS62172Q family produc. The modifications consist of: Metal levels modification only. No change in fit, form or function of the devices. No parameter limi in the Electrical Characteristics table in the data sheet will change. Improvemen implemented in the new silicon: Gate driver control logic Output voltage regulation during input voltage transition from 6V to 7V Current limit detection and logic Only applicable for TPS62130A/133A/150A/153A: Add frequency selection feature SS pin leakage Reason for Change: Robustness improvemen. Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): Positive: Quality/Robustness. Changes to product identification resulting from this PCN: None. Affected: TPS62130AQRGTR TPS62130AQRGTT TPS62133AQRGTR TPS62133AQRGTT TPS62150AQRGTR TPS62150AQRGTT TPS62153AQRGTR TPS62153AQRGTT TPS62160QDSGR TPS62160QDSGT TPS62170QDSGR TPS62170QDSGT TPS62172QDSGR TPS62172QDSGT Texas Instrumen Incorporated PCN
2 TI Information Selective Disclosure Automotive New Qualification Summary (As per 00 and Guidelines). TPS62130AQRGTR, TPS62150AQRGTR, TPS62133AQRGTR, and TPS62153AQRGTR Approved 07Sep2016 Attributes Attributes Qual Devices: TPS62130AQRGTR TPS62150AQRGTR TPS62133AQRGTR TPS62153AQRGTR TPS62130AQRGTR TPS62150AQRGTR Process TPS55340QPWPR Package TPS62152QRGTR Operating Temp Range 40 to +125 C 40 to +125 C 40 to +125 C 40 to +125 C 40 to +125 C Automotive Grade Level Grade 1 Grade 1 Grade 1 Grade 1 Function Power Management Wafer Fab Supplier MIHO8 MIHO 8 MIHO 8 MIHO8 MIH0 8 Die Revision A6 A1 A1 PG2.0 F Assembly Site CLARK AT CLARK AT CLARK AT TAI CLARK AT Package Type QFN 3.0 X 3.0 (MM) QFN 3.0 X 3.0 (MM) QFN 3.0 X 3.0 (MM) HTSSOP VQFN Package Designator RGT RGT RGT PWP RGT Ball/Lead Count : Qual By Similarity Qual Device TPS62130AQRGTR is qualified at LEVEL2260CG Qualification Resul Data Displayed as: Number of lo / Total sample size / Total failed Type # PC HAST AC TC TC BP PTC A1 A2 A3 A5 Test Spec JSTD 020 A113 A110 A102 A104 and Appendix 3 MIL A105 Min Qty SS/ Test Name / Condition Duration TPS62130 AQRGTR Test Group A Accelerated Environment Stress Tes Automotive Preconditioning Biased HAST, 130C/85%RH Level 2 260C TPS62130 AQRGTR1 TPS6215 AQRGTR1 Process TPS55340 QPWPR Package TPS62152 QRGTR 1/130/0 1/320/0 96 2/80/0 3/231/0 1/77/0 Autoclave 121C 96 1/77/0 3/231/0 1/77/ Cycle, 65/150C Post Temp. Cycle Bond Pull Power Cycle, 40/125C 500 per MIL STD 883 1/77/0 3/231/0 3/231/0 1/77/0 1/Pass 3/15/0 1/5/0 1/50/0 1/50/0 1/50/0 Texas Instrumen Incorporated PCN
3 HTSL HTSL HTOL ELFR EDR WBS WBP SD SD PD LI A6 A6 B2 B3 C1 C2 C3 C3 C4 C6 A103 A103 A MIL and High Temp. Storage Bake, 150C High Temp. Storage Bake, 175C 500 Test Group B Accelerated Lifetime Simulation Tes Life Test, 125C Grade 1 1/50/0 1/50/0 1/77/0 1/77/0 3/231/0 Early Life Failure Rate, 125C 48 3/2400/0 NVM Endurance, Data Retention, and N/A Operational Life Test Group C Package Assembly Integrity Tes Bond Shear (Ppk>1.67 and Wires 1/76/0 1/76/0 Cpk>1.33) Bond Pull (Ppk>1.67 and Cpk>1.33) Surface Mount Solderability Surface Mount Solderability Physical Dimensions (Cpk>1.33 Ppk>1.67) Wires 1/76/0 1/76/0 Pb 1/44/0 Pb Free 1/44/0 1/10/0 1/30/ Lead Integrity Leads Test Group D Die Fabrication Reliability Tes Per EM D1 JESD61 Electromigration Process Time Dependant Per TDD D2 JESD35 Dielectric Process B Breakdown HCI D3 JESD60 & 28 NBTI D4 Hot Injection Carrier Negative Bias Instability SM D5 Stress Migration HBM CDM LU ED E2 E3 E4 E Per Process Per Process Per Process Test Group E Electrical Verification Tes 1 3 ESD HBM 3000V 1/3/0 1 3 ESD CDM 1500 V 1/3/0 1/3/0 1/3/0 1 6 Latchup 3 30 Electrical Distributions (Per 004) Cpk>1.6 7 Room, hot, and 2/12/0 1/6/0 1/6/0 1/6/0 3/90/0 3/90/0 1/30/0 1/30/0 1/30/0 Texas Instrumen Incorporated PCN
4 cold test A1 (PC): Preconditioning: Performed for THB, Biased HAST, AC, uhast &TC samples, as applicable. Ambient Operating by Automotive Grade Level: Grade 0 (or E): 40 C to +150 C Grade 1 (or Q): 40 C to +125 C Grade 2 (or T): 40 C to +105 C Grade 3 (or I) : 40 C to +85 C E1 (TEST): Electrical test temperatures of Qual samples (High temperature according to Grade level): Room/Hot/Cold : HTOL, ED Room/Hot : THB / HAST, TC / PTC, HTSL, ELFR, ESD & LU Room : AC/uHAST Green/Pbfree Status: Qualified PbFree(SMT) and Green Automotive New Qualification Summary (As per 00 and Guidelines). TPS62160QDSG[R T], TPS62170QDSG[R T],TPS62172QDSG[R T] metal spins TI Information Selective Disclosure Attributes Operating Temp Range Automotive Grade Level Function Wafer Fab Supplier TPS62160QDSGR TPS62170QDSGR TPS62172QDSGR Approved 09Aug2016 Attributes TPS62160QDSGT TPS62170QDS GT TPS62172QDSG T Process SN PW Process SN PW B2 40 to +125 C 40 to +125 C 40 to +125 C 40 to +125 C 40 to +125 C 40 to +125 C 40 to +125 C 40 to +125 C Grade 1 Grade 1 Grade 1 Grade 1 Grade 1 Grade 1 Grade 1 Grade 1 Power Management Power Management Power Management MIHO8 MIHO8 MIHO8 MIHO8 MIHO8 MIHO8 MIHO8 MIHO8 Die Revision D1Z D1Z D1Z D0 (PG2.0) D0 (PG2.0) D0 (PG2.0) B2 Assembly Site TI MALAYSIA (MLA) TI MALAYSIA (MLA) TI MALAYSIA (MLA) MLA / TIM MLA / TIM MLA / TIM TAI TAI Package Type WSON WSON WSON SON, 2 x 2 MM SON, 2 x 2 MM SON, 2 x 2 MM TSSOP TSSOP Package Designator Ball/Lead Count Type # Test Spec PC HAS T AC TC A1 A2 A3 DSG DSG DSG DSG DSG DSG PW PW : Qual By Similarity Qual Device TPS62160QDSGR is qualified at LEVEL2260C J STD020 A113 A110 A102 A104 and Min Qty SS/ Test Name / Condition Qualification Resul Data Displayed as: Number of lo / Total sample size / Total failed Automotive Preconditionin g Biased HAST, 130C/85%RH Autoclave 121C Cycle, 65/150C Duration Qual Device: TPS62160 QDSGR Qual Device: TPS62170 QDSGR Qual Device: TPS62172 QDSGR Test Group A Accelerated Environment Stress Tes Level 2 260C TPS62160 QDSGT TPS62170 QDSGT TPS6217 2QDSGT Process SN PW Process SN PWB2 2/44/0 96 3/231/0 3/231/0 96 3/231/0 3/230/ /231/0 3/231/0 Texas Instrumen Incorporated PCN
5 TC BP PTC HTSL HTO L HTO L ELFR EDR WBS WBP PD LI A5 A6 B2 B3 C1 C2 C4 C6 Appendix 3 MIL A105 A103 A108 A MIL 00 and EM D1 JESD61 TDD B HCI D2 JESD35 D3 JESD60 & 28 Post Temp. Cycle Bond Pull Power Cycle, 40/125C High Temp. Storage Bake, 150C Life Test, 140C Life Test, 150C Early Life Failure Rate, 140C NVM Endurance, Data Retention, and Operational Life Bond Shear (Cpk>1.67) Bond Pull (Cpk>1.67) Physical Dimensions (Cpk>1.33 Ppk>1.67) per MIL STD 883 1/5/0 1/5/0 1/45/0 1/50/0 3/224/0 Test Group B Accelerated Lifetime Simulation Tes /150 C / 17V 3/229/0 1/77/0 1/77/0 48 3/2409/0 N/A N/A N/A Test Group C Package Assembly Integrity Tes Wires Wires 3/30/ Lead Integrity Leads NBTI D4 SM D5 HBM CDM LU E2 E3 E Electromigratio n Time Dependant Dielectric Breakdown Hot Injection Carrier Negative Bias Instability Stress Migration Test Group D Die Fabrication Reliability Tes Test Group E Electrical Verification Tes 1 3 ESD HBM 4000 V 1/3/0 1/3/0 1/3/0 1 3 ESD CDM V 1 6 Latchup (Per 2/12/0 1/6/0 1/6/0 Texas Instrumen Incorporated PCN
6 004) ED ED E5 E Electrical Distributions Electrical Characterizatio n Cpk>1.6 7 Room, hot, and cold test Per Datasheet Paramete rs 1/30/0 1/30/0 1/30/0 3/90/0 1/30/0 1/30/0 3/90/0 3/90/0 A1 (PC): Preconditioning: Performed for THB, Biased HAST, AC, uhast &TC samples, as applicable. Ambient Operating by Automotive Grade Level: Grade 0 (or E): 40 C to +150 C Grade 1 (or Q): 40 C to +125 C Grade 2 (or T): 40 C to +105 C Grade 3 (or I) : 40 C to +85 C E1 (TEST): Electrical test temperatures of Qual samples (High temperature according to Grade level): Room/Hot/Cold : HTOL, ED Room/Hot : THB / HAST, TC / PTC, HTSL, ELFR, ESD & LU Room : AC/uHAST Green/Pbfree Status: Qualified PbFree(SMT) and Green For questions regarding this notice, s can be sent to the regional contac shown below or your local Field Sales Representative. Location USA Europe Asia Pacific Japan PCNAmericasContact@list.ti.com PCNEuropeContact@list.ti.com PCNAsiaContact@list.ti.com PCNJapanContact@list.ti.com Texas Instrumen Incorporated PCN
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