AEC-Q100G Qualification Results

Transcription

1 Objective: MCU5643LFF2MLQ1 (Leopard) ATMC Cu Wire Qualification On 144LQFP Freescale PN: MCU5643LFF2MLQ1 Customer Name(s): "Varies" Part Name: Leopard PN(s): "Varies" Technology: CMOS90FG Package: LQFP 144 Fab / Assembly / FSL-ATMC / FSL-KLM-FM / FSL-KLM-FM Final Test Sites: Maskset#: N89D Rev#: 3 Plan or : See below revision history Revision # & Date: Design Engr: Not Applicable QUARTZ Tracking #: & Product Engr: Ismail Ikmal-B25207 GAO(Global Assembly Jasmine Lim-B18239 Aperation) Engr: Die Size (in mm) x NPI PRQE: Chew Kim Seong-B36347 W x L Part Operating Temp. Grade: AEC-Q100G Qualification Grade 1-40 C to C Trace/DateCode: LOT A LOT B 8EMHA1YDC3 WEMHA1R3JL00 00 LOT C NA TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY (Signature/Date shown below may be electronic) GAO Approval (for Jasmine Lim-B18239 DIM/BOM results) 7 Nov 2013 NPI PRQE Approval Chew Kim Seong-B Nov 2013 CAB Approval M 8 Nov 2013 Customer Approval May be N/A PC HAST A113 J-STD-020 A101 A110 Preconditioning (PC) : PC required for SMDs only. MSL 260 C, +5/-0 C Highly Accelerated Stress Test (HAST): PC before HAST (for SMDs only): Required HAST = 110 C/85%RH for 264 hrs. Bias = Max Vdd This testing is performed by Freescale Reliability Lab (KLM) unless otherwise noted in the Comments. GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and as required per test conditions. Lot B: 0/ UHST A102 A118 Unbiased HAST (UHST): PC before UHST (for SMDs only): Required UHST = 110 C/85%RH for 264 hrs. Timed RO of 2-48hrs. MAX R TC A104 AEC Q100- Appendix 3 Temperature Cycle (TC): PC before TC (for SMDs only): Required TC = -65 C to 150 C for 500 cycles. For AEC only: WBP after TC on 5 devices from 1 lot; 2 bonds per corner and one mid-bond per side on each device. Record which pins were used. H For AEC: WBP =/> 3 grams WP: minimum > 3.0grams HTSL A103 High Temperature Storage Life (HTSL): Timed RO = 96hrs. MAX HTOL TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS High Temperature Operating Life (HTOL): C 77 A108 AEC Ta = 125 C for 1008 hrs. Devices incorporating NVM shall receive 1X 'NVM endurance preconditioning'(w/e cycling). Test R, ELFR AEC Q Early Life Failure Rate (ELFR): AEC Ta = 125 C for 48 hrs 800 EDR AEC Q Timed RO of 48 hrs MAX NVM Endurance, Data Retention, and Operational Life (EDR): Devices incorporating NVM shall receive 'NVM WBS C 77 TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS AEC Q Wire Bond shear (WBS) Cpk = or > bonds WBP MilStd Wire Bond Pull (WBP): Cond. C or D Cpk = or > bonds SD PD DIM & BOM B102 B100 Solderability (SD): 8hr.(1 hr. for Au-plated leads) Steam age prior to test. If production burn-in is done, samples must also undergo burn-in prior to SD. Physical Dimensions(PD): PD per FSL 98A drawing Dimensional (DIM): GAO to verify PD results against valid 98A drawing. BOM Verification (BOM): GAO to verify qual lot ERF BOM is accurate. >95% lead coverage of critical areas 15 Cpk = or > DIM: Not required BOM: Approved SBS AEC-Q Solder Ball Shear (SBS): Performed on all solder ball mounted packages e.g. PBGA, Chip Scale, Micro Lead Frame (but NOT Flip Chip). Two reflow cycles at MSL reflow temperature before shear. Cpk = or > (5 balls from a min. of 10 devices) For solder ball mounted packages only; NOT for Flip Chips. LI B105 Lead Integrity (LI): Not required for surface mount devices; Only required for through-hole devices. No lead breakage or cracks 5 (10 leads from each of 5 parts)

2 EM TDDB HCI SM NBTI Electro Migration (EM) Time Dependent Dielectric Breakdown (TDDB) Hot Carrier Injection (HCI) Stress Migration (SM) Negative Bias Temperature Instability (NBTI) TEST Pre- and Post Functional / Parametrics (TEST): For AEC, test software shall meet requirements of AEC-Q Testing performed to the limits of device specification in temperature and limit value. TEST GROUP D - DIE FABRICATION RELIABILITY TESTS TEST GROUP E - ELECTRICAL VERIFICATION TESTS Comments 0 Fails All All All See Summary This action refers to Final Testing of all qualification units. HBM AEC-Q / A114E Human Body Model Classification (HBM): Jan /1000/1500/2000 Volts For AEC, see AEC-Q for classification 2KV min. MM AEC-Q or JESD22 Machine Model Classification m(mm): 50/100/200 Volts For AEC, see AEC-Q for classification 200V min. CDM AEC-Q Charged Device Model Classification (CDM): 250/500/750 Volts For AEC, see AEC-Q for classification Timed RO of 96hrs MAX. All pins =/> 500V For AEC, Corner pins =/> 750V; LU ED FG JESD78 plus AEC-Q for AEC AEC-Q , spec Q Latch-up (LU): Test per JEDEC JESD78 with the AEC-Q requirements for AEC. Ta= Maximum operating temperature Vsupply = Maximum operating voltage Electrical Distribution (ED) 6 C For AEC, Cpk target > 1.67 Fault Grading (FG) FG shall be = or > 90% for qual units Pass, Cpk > 1.67 Comparison between ATMC_Cu and ATMC_Au wire units at T0. FG%= No change Production Test requirement: 98% w/o Iddq 95% w/iddq 100% TYPE2 faults detection CHAR Q003 Characterization (CHAR): Ony performed on new technologies and part families per AEC Q003. Not required GL (for information only) Q Electro-Thermally Induced Gate Leakage (GL): 155 C, 2.0 min, +400/-400 V Per AEC Q100 Rev G, this test is performed for information only. Timed RO of 96 hrs MAX. For all failures, perform unbiased bake (4hrs/125 C, or 2hrs/150 C) and retest; recovered units are GL failures. R 6 Freescale does not plan Gate Leakage testing in alignment with the expected revision to AEC Q100 that will eliminate this "for information only" stress. EMC SAE J1752/3 - Radiated Emissions Electromagnetic Compatibility (EMC) (see AEC Q100 Appendix 5 for test applicability; done on case-by-case basis per customer/freescale agreement) <40dBuV 150kHz - 1GHz 1 For Au to Cu wire change, EMC report showing no impact, S12G_Grouper (0N95B), report available upon request. Product Information & FSL-ATMC / Leopard_MCU5643LFF2MLQ x FSL-KLM-FM LQFP 144 List: FSL-ATMC / 1M25V / C90FG Spectrum_MPC5606SF2VLQ x FSL-KLM-FM LQFP 144 SUMITOMO EME-G700LS Revision Date Comments Author Rev O 7-Nov-13 Qualification results update Chew Kim Seong

3 Objective: MCU5643LFF2MLL6 (Leopard) ATMC Cu Wire Qualification On 100LQFP Freescale PN: MCU5643LFF2MLL6 Customer Name(s): "Varies" Part Name: Leopard100 PN(s): "Varies" AEC-Q100G Qualification Plan or : Rev O - Plan Revision # & Date: 8th March 2013 Technology: CMOS90FG Package: LQFP SQ1.4P0.5 C90 (8285) Fab / Assembly / FSL-ATMC / FSL-KLM-FM / FSL-KLM-FM Final Test Sites: Design Engr: Not Applicable QUARTZ Tracking #: Product Engr: Ismail Ikmal-B25207 (Signature/Date shown below may be electronic) Maskset#: N89D Rev#: 3 GAO(Global Assembly Jasmine Lim-B18239 Aperation) Engr: Die Size (in mm) x NPI PRQE: Chew Kim Seong-B36347 W x L Part Operating Grade 1-40 C to C Trace/DateCode: LOT A LOT B Temp. Grade: 8EMHA1YDPG NA 00 LOT C NA GAO Approval (for Jasmine Lim-B18239 DIM/BOM results) 7 Nov 2013 NPI PRQE Approval Chew Kim Seong-B Nov 2013 CAB Approval M EVSA date: Customer Approval May be N/A TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY This testing is performed by Freescale Reliability Lab (KLM) unless otherwise noted in the Comments. GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS A113 J-STD-020 Preconditioning (PC) : PC required for SMDs only. MSL 260 C, +5/-0 C All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and as required per test conditions. PC Lot B: 0/231 HAST A101 A110 Highly Accelerated Stress Test (HAST): PC before HAST (for SMDs only): Required HAST = 110 C/85%RH for 264 hrs. Bias = Max Vdd Pass A102 A118 Unbiased HAST (UHST): PC before UHST (for SMDs only): Required UHST = 110 C/85%RH for 264 hrs. R Pass UHST TC A104 AEC Q100- Appendix 3 Temperature Cycle (TC): PC before TC (for SMDs only): Required TC = -65 C to 150 C for 500 cycles. For AEC only: WBP after TC on 5 devices from 1 lot; 2 bonds per corner and one mid-bond per side on each device. Record which pins were used. H For AEC: WBP =/> 3 grams WP: minimum > 3.0grams A103 High Temperature Storage Life (HTSL): 150 C for 1008 hrs Timed RO = 96hrs. MAX Pass HTSL HTOL A108 High Temperature Operating Life (HTOL): AEC Ta = 125 C for 1008 hrs Devices incorporating NVM shall receive 1X 'NVM TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS C 77 ELFR AEC Q Early Life Failure Rate (ELFR): AEC Ta = 125 C for 48 hrs Timed RO of 48 hrs MAX 800 EDR AEC Q NVM Endurance, Data Retention, and Operational Life (EDR): Devices incorporating NVM shall receive 'NVM C 77

4 WBS TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS AEC Q Wire Bond shear (WBS) Cpk = or > bonds WBP MilStd Wire Bond Pull (WBP): Cond. C or D Cpk = or > bonds SD PD B102 B100 Solderability (SD): 8hr.(1 hr. for Au-plated leads) Steam age prior to test. If production burn-in is done, samples must also undergo burn-in prior to SD. Physical Dimensions(PD): PD per FSL 98A drawing >95% lead coverage of critical areas 15 Cpk = or > DIM & BOM Dimensional (DIM): GAO to verify PD results against valid 98A drawing. BOM Verification (BOM): GAO to verify qual lot ERF BOM is accurate. DIM: Not required BOM: Approved SBS LI AEC-Q B105 Solder Ball Shear (SBS): Performed on all solder ball mounted packages e.g. PBGA, Chip Scale, Micro Lead Frame (but NOT Flip Chip). Two reflow cycles at MSL reflow temperature before shear. Lead Integrity (LI): Not required for surface mount devices; Only required for through-hole devices. EM Electro Migration (EM) Cpk = or > (5 balls from a min. of 10 devices) No lead breakage or cracks 5 (10 leads from each of 5 parts) For solder ball mounted packages only; NOT for Flip Chips. TEST GROUP D - DIE FABRICATION RELIABILITY TESTS Comments TDDB HCI SM NBTI Time Dependent Dielectric Breakdown (TDDB) Hot Carrier Injection (HCI) Stress Migration (SM) Negative Bias Temperature Instability (NBTI) TEST Pre- and Post Functional / Parametrics (TEST): For AEC, test software shall meet requirements of AEC-Q Testing performed to the limits of device specification in temperature and limit value. TEST GROUP E - ELECTRICAL VERIFICATION TESTS 0 Fails All All All See Summary This action refers to Final Testing of all qualification units. HBM AEC-Q / A114E Human Body Model Classification (HBM): Jan /1000/1500/2000 Volts For AEC, see AEC-Q for classification 2KV min. MM AEC-Q or JESD22 Machine Model Classification m(mm): 50/100/200 Volts For AEC, see AEC-Q for classification 200V min. CDM AEC-Q Charged Device Model Classification (CDM): 250/500/750 Volts For AEC, see AEC-Q for classification Timed RO of 96hrs MAX. All pins =/> 500V For AEC, Corner pins =/> 750V; LU ED JESD78 plus AEC-Q for AEC AEC-Q , spec Latch-up (LU): Test per JEDEC JESD78 with the AEC-Q requirements for AEC. Ta= Maximum operating temperature Vsupply = Maximum operating voltage 6 Electrical Distribution (ED) C For AEC, Cpk target > Pass Comparison between ATMC_Cu and ATMC_Au wire units at T0 using Leopard_MCU5643LFF2MLQ1, (3N89D), 144LQFP: Pass; Cpk>1.67 FG Q Fault Grading (FG) FG shall be = or > 90% for qual units FG%= No change Production Test requirement: 98% w/o Iddq 95% w/iddq 100% TYPE2 faults detection CHAR Q003 Characterization (CHAR): Ony performed on new technologies and part families per AEC Q003. Not required

5 GL (for information only) Q Electro-Thermally Induced Gate Leakage (GL): 155 C, 2.0 min, +400/-400 V Per AEC Q100 Rev G, this test is performed for information only. Timed RO of 96 hrs MAX. For all failures, perform unbiased bake (4hrs/125 C, or 2hrs/150 C) and retest; recovered units are GL failures. R 6 Freescale does not plan Gate Leakage testing in alignment with the expected revision to AEC Q100 that will eliminate this "for information only" stress. EMC SAE J1752/3 - Radiated Emissions Electromagnetic Compatibility (EMC) (see AEC Q100 Appendix 5 for test applicability; done on case-by-case basis per customer/freescale agreement) <40dBuV 150kHz - 1GHz 1 For Au to Cu wire change, EMC report showing no impact, S12G_Grouper (0N95B), report available upon request FSL-ATMC / Leopard_MCU5643LFF2MLL x FSL-KLM-FM LQFP SQ1.4P0.5 (8285) List: FSL-ATMC / 1M25V / C90FG & FSL-ATMC / Spectrum_MPC5606SF2VLQ x FSL-KLM-FM LQFP 144 Leopard_MCU5643LFF2MLQ x FSL-KLM-FM LQFP 144 SUMITOMO EME-G700LS Revision Date Comments Author Rev O 7-Nov-13 Qualification results update Chew Kim Seong