MC Qualification of Kahlua II Rev. D MPC8241/8245 MOS-13 HiP4DP Rev. 1.4 Qualification Report
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1 MC Qualification of Kahlua II MPC8241/8245 MOS-13 HiP4DP Rev. 1.4 Qualification Report Technology:MOS13 HiP4DP Package: 357PBGA/352TBGA Page 1 of 10
2 MPC8241/8245 Product Information: Product / Technology / Fab / Package Description Package MPC8241: 357 PBGA (ZP), 25 x 25 mm MPC8245: 352 TBGA (ZU), 35 x 35 mm Device MPC8241 MPC8245 Mask Set 4K78P 4K78P Die Area 49.2 mm mm 2 Die Coating Hitachi S200 Polyimide Hitachi S200 Polyimide Name/Location of Die Fab Facility MOS-13 / Austin TX MOS-13 / Austin TX Process Technology 0.25µm HiP4DP 0.25µm HiP4DP Poly / Metal layers 1P / 5M 1P / 5M Assembly Location Motorola, KLM Motorola, KLM Mold Compound Shin-Etsu KMC-211-2F Dexter FP4451 dam, Nagase T693/R1001 glob filler Die Attach Material Ablebond 8360 CRM-1525 Wire Material / Diameter Au / 0.98 mil Au / 0.98 mil Solder Ball Material / Diameter 62% Pb, 36% Sn, 2% Ag / 0.75 mm 62% Pb, 36% Sn, 2% Ag / 0.75 mm Pb Free Solder Sphere Material 95.5%Sn, 4.0%Ag, 0.5%Cu 95.5%Sn, 4.0%Ag, 0.5%Cu Moisture Sensitivity Level / Reflow Temp MSL3 / 220ºC MSL3 / 220ºC Substrate Supplier Ibiden Compass / Hitachi MPC8241/8245 Product Reliability Data Summary: HTOL / 2.35V, 125ºC Lot / Mask Set 168 Hours 196 Hours 504 Hours 1008 Hours 0K78P 0 / 93 0 / 93 0 / 93 0 / 93 1K78P 0 / 90 2K78P 0 / 96 HTOL / 2.6V, 125ºC Lot / Mask Set 144 Hours (*) 168 Hours 196 Hours D / 4K78P 0 / 80 0 / 80 0 / 80 D / 4K78P 0 / 77 D / 4K78P 0 / 77 Note: (*) Industrial-tier readpoint based on 10 years operation at 1.8V and 105ºC Tj. ESD / Latch-up Lot HBM / 2KV MM / 200V CDM / 500V No Skt Latch-up / 200mA 0K78P 0 / 3 0 / 3 0 / 3 1K78P 0 / 6 0 / 6 0 / 6 0 / 9 D / 4K78P 0 / 3 0 / 3 0 / 3 0 / 3 Technology:MOS13 HiP4DP Package: 357PBGA/352TBGA Page 2 of 10
3 MPC8241/8245 HiP4DP Process Certification Data (Test Vehicle: XPC745,755A/B Product): HTOL / Vd1-2.5V, Ta - 90ºC, Tj ºC Lot / Mask Set 24 Hours 48 Hours XPC755A HiP4DP 1 / 2199 (0.045%) 0 / 2168 (0.045%) Totals 1 / 2199 (0.045%) 0 / 2168 (0.045%) Failure Comments 24h Unknown fail HTOL / Vd1-2.35V, Ta - 90ºC, Tj ºC Lot / Mask Set 24 Hours 168 Hours 504 Hours 1008 Hours XPC755A/B HiP4DP 0 / / / / 229 Totals 0 / / / / 229 Technology:MOS13 HiP4DP Package: 357PBGA/352TBGA Page 3 of 10
4 MPC8241 Pb Free Package Reliability Data (Test Vehicle: 357-pin PBGA with MPC860P Product, 95.5%Sn, 4.0%Ag, 0.5%Cu): Moisture Sensitivity Level Characterization Assembly Site /Substrate Supplier MSL3 / 245ºC MSL3 / 260ºC KLM / Substrate Supplier A / 3 assy lots 0 / 72 0 / 72 KLM / Substrate Supplier B / 3 assy lots 0 / 66 0 / 66 Totals 0 / / 138 Autoclave / 121ºC, 100% RH, 15 PSIG with MSL3 / 245ºC IR Reflow Lot / Mask Set 48 Hours 96 Hours 144 Hours KLM / Substr. Supplier A / 3 assy lots 0 / / / 246 Totals 0 / / / 246 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 245ºC IR Reflow Lot / Mask Set 200 Cycles 500 Cycles KLM / Substr. Supplier A / 3 assy lots 0 / / 246 KLM / Substr. Supplier B / 3 assy lots 0 / / 240 Totals 0 / / 486 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 260ºC IR Reflow Lot / Mask Set 200 Cycles 500 Cycles KLM / Substr. Supplier A / 3 assy lots 0 / / 246 KLM / Substr. Supplier B / 3 assy lots 0 / / 240 Totals 0 / / 486 Technology:MOS13 HiP4DP Package: 357PBGA/352TBGA Page 4 of 10
5 MPC8241 Pb Free Package Reliability Data (Test Vehicle: 357-pin PBGA with MPC860P Product, 95.5%Sn, 4.0%Ag, 0.5%Cu) cont d: Temperature Humidity Bias / 85ºC, 85%R.H., Nominal Bias with MSL3 / 245ºC IR Reflow Assembly Site /Substrate Supplier 504 Hours 1008 Hours KLM / Substr. Supplier A / 3 assy lots 0 / / 217 Totals 0 / / 219 Temperature Humidity / 85ºC, 85%R.H. with MSL3 / 260ºC IR Reflow Assembly Site /Substrate Supplier 504 Hours 1008 Hours KLM / Substr. Supplier A / 3 assy lots 0 / / 240 KLM / Substr. Supplier B / 3 assy lots 0 / 240 Totals 0 / / 240 High Temperature Bake (HTB) 150 C Assembly Site /Substrate Supplier 504 Hours 1008 Hours KLM / Substr. Supplier A / 3 assy lots 0 / / 240 KLM / Substr. Supplier B / 3 assy lots 0 / / 240 Totals 0 / / 480 Technology:MOS13 HiP4DP Package: 357PBGA/352TBGA Page 5 of 10
6 MPC8245VV 352 Lead 35 x 35 TBGA Pb Free Product Reliability Data Summary: Test Vehicle MPC8260VV 37.5 x Lead TBGA Pb Free (95.5%Sn, 4.0%Ag, 0.5%Cu) Moisture Sensitivity Level Characterization Product - Package Assy Site / Substrate Supplier / Lots MSL3 / 245ºC KLM / Substrate Supplier A / 3 assy lots 0 / 66 KLM / Substrate Supplier B / 3 assy lots 0 / 65 Totals 0 / 131 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 245ºC IR Reflow Preconditioning Product - Package Assy Site / Substrate Supplier / Lots 200 Cycles 500 Cycles KLM / Substrate Supplier A / 3 assy lots 0 / / 239 KLM / Substrate Supplier B / 3 assy lots 0 / / 240 Totals 0 / / 479 Temperature Humidity / 85ºC, 85%R.H. with MSL3 / 245ºC IR Reflow Preconditioning Product - Package Assy Site / Substrate Supplier / Lots 168 Hours 504 Hours 1008 Hours KLM / Substrate Supplier A / 3 assy lots 0 / / / 240 KLM / Substrate Supplier B / 3 assy lots 0 / / / 239 Totals 0 / / / 479 Technology:MOS13 HiP4DP Package: 357PBGA/352TBGA Page 6 of 10
7 MPC8245ZU Pb Bearing Package Reliability Data (Test Vehicle: 480-pin TBGA with XPC8260 Product): Moisture Sensitivity Level Characterization Lot / Mask Set MSL4 MSL3 KLM / Substrate Supplier A 0 / 45 0 / 45 KLM / Substrate Supplier B 0 / 45 0 / 45 ASAT - 3 lots / HiP3 0 / 45 0/ 45 (2 lots) Product Totals 0 / / 135 Failure Comments Autoclave / 121ºC, 100% RH, 15 PSIG with MSL4 / 220ºC VPR* Lot / Mask Set 48 Hours 144 Hours KLM / Substrate Supplier A 0 / / 231 KLM / Substrate Supplier B 0 / / 231 ASAT - 3 lots / HiP3 0 / / 230 Product Totals 0 / / 692 Failure Comments Temperature Cycle / -65ºC 150ºC Air to Air with MSL4 / 220ºC VPR* Lot / Mask Set 100 Cycles 500 Cycles KLM / Substrate Supplier A 0 / / 231 KLM / Substrate Supplier B 0 / / 231 ASAT - 3 lots / HiP3 0 / / 230 Product Totals 0 / / 693 Failure Comments Temperature Humidity Bias / 85ºC, 85%R.H., Nominal Bias with MSL4 / 220ºC VPR* Lot / Mask Set 504 Hours 1008 Hours KLM / Substrate Supplier A 0 / 231 ASAT - 3 lots / HiP3 0 / / 231 Product, * w/ MSL5 PC Totals 0 / / 231 Failure Comments Technology:MOS13 HiP4DP Package: 357PBGA/352TBGA Page 7 of 10
8 MPC8241 Product FIT Rate and MTBF Derated Curves: FITs vs Junction Temperature: MPC8241 Thermal and Voltage Acceleration ea = 0.7 ev, Beta = 6.67, 60% Confidence Fit Rate (Failures/1E9 Device Hours) V 1.8 V 1.9 V Tj 1.7 V 1.8 V 1.9 V 65 C C C Junction Temperature ( C) 1.00E+07 MTBF vs Junction Temperature: MPC8241 Thermal and Voltage Acceleration ea = 0.7 ev, Beta = 6.67, 60% Confidence 1.00E E+05 MTBF (years) 1.00E E E E+01 Tj 1.7 V 1.8 V 1.9 V 65 C 7.5E+4 3.8E+4 2.0E+4 85 C 2.0E+4 1.0E+4 5.1E C 5.9E+3 3.0E+3 1.5E V 1.8 V 1.9 V 1.00E Junction Temperature ( C) Technology:MOS13 HiP4DP Package: 357PBGA/352TBGA Page 8 of 10
9 MPC8245 Product FIT Rate and MTBF Derated Curves: FITs vs Junction Temperature: MPC8245 Thermal and Voltage Acceleration ea = 0.7 ev, Beta = 6.67, 60% Confidence Fit Rate (Failures/1E9 Device Hours) V 2 V 2.2 V 0.10 Tj 1.7 V 2 V 2.2 V 65 C C C Junction Temperature ( C) 1.00E+07 MTBF vs Junction Temperature: MPC8245 Thermal and Voltage Acceleration ea = 0.7 ev, Beta = 6.67, 60% Confidence 1.00E E+05 MTBF (years) 1.00E E E E+01 Tj 1.7 V 2 V 2.2 V 65 C 7.5E+4 1.0E+4 2.7E+3 85 C 2.0E+4 2.6E+3 6.9E C 5.9E+3 7.9E+2 2.1E V 2 V 2.2 V 1.00E Junction Temperature ( C) Technology:MOS13 HiP4DP Package: 357PBGA/352TBGA Page 9 of 10
10 Revision History: Revision History Revision Date* Comment Author Original 1/23/03 MC Qual Release Leo Loc A 3/31/03 Update 357PBGA (MPC860P) rel data Leo Loc B 4/22/04 Added Pb free package qual data. Aaron Chapa C 3/4/05 Corrected FIT rate title to reflect MC. Aaron Chapa D 8/24/05 Created separate 8241 and 8245 FIT and MTBF charts. Aaron Chapa Update Revision Date in Footer Technology:MOS13 HiP4DP Package: 357PBGA/352TBGA Page 10 of 10
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