MPC8271/MPC8272/ MPC8247/MPC8248 Product Information:

Transcription

1 Qualification Report MPC8271, MPC8272, MPC8247, MPC8248 ATMC(MOS 13) HiP7AP 516 PBGA PowerQUICC II Communications Processor

2 MPC8271/MPC8272/ MPC8247/MPC8248 Product Information: Package Mask Set Die Coating Name/Location of Wafer Fab Facility Wafer Fab Process Technology Poly / Metal layers Assembly Location Die Attach Type Moisture Sensitivity Level Lead Frame / Substrate Supplier Product / Technology / Fab / Package Description 516 Lead PBGA 27 x 27 mm (ZQ), 1mm pitch, with lead bearing solder spheres (SnPbAg) 516 Lead PBGA 27 x 27 mm (VR), 1mm pitch, with lead free solder spheres (SnAgCu) 1K50M Polyimide Freescale ATMC / Austin, Texas 0.13µm, HiP7AP Single Layer Poly, Six Layer Metal Freescale, KLM Conductive MSL3 260 C Reflow Supplier A, Supplier B and Supplier D 2 nd Assembly Site Qualifications, PBGA Package Additional Assembly Location StatsChipPac, Korea for PBGA package Wire Material / Size Au / 0.8 mils Moisture Sensitivity Level MSL3 / 260 C Substrate Supplier Supplier K Cu Wire Qualification, PBGA Package Assembly Location Freescale, KLM Wire Material / Size Cu / 0.8 mil Moisture Sensitivity Level MSL3 / 260 C Substrate Supplier Supplier V and Supplier B Description: PQ27E Revision A PBGA Qualification Report Report Rev.: G Device: MPC8271,MPC8272, MPC8247, MPC8248 Revision date: 10/18/2011 Kathy Badger Torres Page 2 of 12

3 MPC8272, MPC8248 Product Reliability Data Summary: High Temperature Operating Life Test (HTOL) Vd1 2.0v, Vd2 4.0v, Ta 125ºC Lot / Mask Set 5 Years (120 hours) <100 FITs 10 Years (240 hours) <100 FITs 20 Years (456 hours) <100 FITs For info only D75449/1K50M 0/240 0/240 0/240 Total 0/240 0/240 0/240 Electrical Characterization Lot / Mask Set 40ºC and 105ºC D75449/1K50M 0 / 5 D97544/1K50M 0 / 10 Total 0/15 Electrostatic Discharge and Latch-up Test Lot / Mask Set HBM / 2KV MM / 200V CDM / 500V No Skt Latch-up / 200mA D75449/1K50M 0/3 0 / 3 0 / 3 0 / 3 Total 0/3 0 / 3 0 / 3 0 / 3 High Temperature Operating Life Test (HTOL) Drift Analysis Vd1 2.0v, Vd2 4.0v, Ta 125ºC Qualification Vehicle: MPC8280ZU in 480 TBGA package Lot / Mask Set / Rev 10 Years (240h) D66144 / K49M / Rev / 5 D66145 / K49M / Rev / 5 D66146 / K49M / Rev / 5 Totals 0 / 15 MPC8272, MPC8248 Product Reliability Data Summary: Description: PQ27E Revision A PBGA Qualification Report Report Rev.: G Device: MPC8271,MPC8272, MPC8247, MPC8248 Revision date: 10/18/2011 Kathy Badger Torres Page 3 of 12

4 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 250ºC IR Reflow Substrate Supplier A Lot / Mask Set 200 Cycles 500 Cycles QEBE0417C/1K50M 0/80 0/80 QEBE04162/1K50M 0/80 0/80 QEBE04165/1K50M 0/80 0/80 Total 0/240 0/240 Temperature Humidity / 85ºC, 85%R.H. with MSL3 / 250ºC IR Reflow Substrate Supplier A Lot / Mask Set 168 Hours 504 Hours 1008 Hours QEBE0417C/1K50M 0/80 0/80 0/80 QEBE04162/1K50M 0/80 0/80 0/80 QEBE04165/1K50M 0/80 0/80 0/80 Total 0/240 0/240 0/240 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 250ºC IR Reflow Substrate Supplier B Lot / Mask Set 200 Cycles 500 Cycles QEL104052/0K50M 0/78 0/78 QEL20405C/0K50M 0/90 0/90 QEL104052/0K50M 0/72 0/72 Total 0/250 0/250 Description: PQ27E Revision A PBGA Qualification Report Report Rev.: G Device: MPC8271,MPC8272, MPC8247, MPC8248 Revision date: 10/18/2011 Kathy Badger Torres Page 4 of 12

5 MPC8272, MPC8248 Product Reliability Data Summary: Temperature Humidity / 85ºC, 85%R.H. with MSL3 / 250ºC IR Reflow Substrate Supplier B Lot / Mask Set 168 Hours 504 Hours 1008 Hours QE /0K50M 0/36 0/36 0/36 QE /0K50M 0/102 0/102 0/102 D754496/1K50M 0/103 0/102* 0/102 Total 0/241 0/240 0/240 Comments *1 unit removed from sample due to EOS Additional Similarity Data MPC8280, MPC8270, MPC8275 Product Reliability Data Summary: High Temperature Operating Life Test (HTOL) Vd1 2.0v, Vd2 4.0v, Ta 125ºC Qualification Vehicle: MPC8280ZU in 480 TBGA package Lot / Mask Set / Rev 2.5 Years (72h) For info only 10 Years (240h) <200 FITs 20 Years (456h) For info only D66144 / K49M / Rev / / / 230 D66145 / K49M / Rev / 80 0 / 79 0 / 75 D66146 / K49M / Rev / 79 0 / 78 0 / 76 Totals 1 / / Ta 55ºC, 60%C.L. 0 / 381 Failure Comments CPM BIST for two single bits in the DRAM array No defect found Description: PQ27E Revision A PBGA Qualification Report Report Rev.: G Device: MPC8271,MPC8272, MPC8247, MPC8248 Revision date: 10/18/2011 Kathy Badger Torres Page 5 of 12

6 MPC8272, MPC8248 Product Reliability Data Summary: Substrate Supplier D MSL3 Moisture Sensitivity Level Characterization Lot Number MSL3 / 260ºC L051010A06 0/22* Totals 0/22 Note: one unit with assignable cause, mishandling Additional Similarity Data MPC8280, MPC8270, MPC8275 Product Reliability Data Summary: MSL3 Moisture Sensitivity Level Characterization Lot Number MSL3 / 260ºC WEMH2014W000 0/22 WEMH2014W100 0/22 WEMH2014W200 0/22 Totals 0/66 Temperature Cycle / -65ºC to 150ºC Air to Air after MSL3 / 260ºC IR Reflow Lot Number 200 Cycles 500 Cycles 1000 Cycles WEMH2014W000 0/80 0/80 0/80 WEMH2014W100 0/80 0/80 0/80 WEMH2014W200 0/80 0/80 0/80 Totals 0/240 0/240 0/240 Temperature Humidity / 85ºC, 85%R.H. after MSL3 / 260ºC IR Reflow Lot Number 504 Hours 1008 Hours WEMH2014W000 0/80 0/80 WEMH2014W100 0/80 0/80 WEMH2014W200 0/80 0/80 Totals 0/240 0/240 Description: PQ27E Revision A PBGA Qualification Report Report Rev.: G Device: MPC8271,MPC8272, MPC8247, MPC8248 Revision date: 10/18/2011 Kathy Badger Torres Page 6 of 12

7 MPC8272, MPC8248 Product Reliability Data Summary: High Temperature Bake / 150 C Lot Number 504 Hours 1008 Hours WEMH2014W000 0 / 80 0 / 80 WEMH2014W100 0 / 80 0 / 80 WEMH2014W200 0 / 80 0 / 80 Totals 0 / / 240 StatsChipPac Korea PBGA Assembly Qualification Data Summary Reliability Data is from Qual Vehicle PQ27 MPC8270/MPC PBGA Moisture Sensitivity Level Characterization Wafer Lot Trace Code MSL3/260 C MXMH2056QV00 SXA1UH 0/10 MXMH2056QV00 SXA3UH 0/10 MXMH2056QV00 SXA2UH 0/10 Totals 0/30 Temperature Cycle / -55ºC to 125ºC Air to Air with MSL3 / 260ºC IR Reflow Wafer Lot Trace Code MSL3/260 C 400 Cycles 700 Cycles 1000 Cycles MXMH2056QV00 SXA1UH 0/25 0/25 0/25 0/25 MXMH2056QV00 SXA3UH 0/25 0/25 0/25 0/25 MXMH2056QV00 SXA2UH 0/25 0/25 0/25 0/25 Totals 0/75 0/75 0/75 0/75 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 260ºC IR Reflow Wafer Lot Trace Code MSL3/260 C 200 Cycles 500 Cycles 1000 Cycles MXMH2056QV00 SXA1UH 0/200 1/200 A 0/199 0/79 MXMH2056QV00 SXA3UH 0/80 0/80 0/80 0/80 MXMH2056QV00 SXA2UH 0/80 0/80 0/80 0/80 Totals 0/360 1/360 0/359 0/239 A Failure due to bin 8 opens on 2 pins due to foreign matter. FA report a. Corrective action included improved clean room practices which were validated by Freescale audit of SCK facilities. Additional 120 units from same qual lot stressed through 500 cycles to decrease LTPD. Temperature Humidity / 85ºC, 85%R.H., with MSL3 / 260ºC IR Reflow Wafer Lot Trace Code MSL3/260 C 504 Hours 1008 Hours MXMH2056QV00 SXA1UH 0/80 0/80 0/80 MXMH2056QV00 SXA3UH 0/80 0/80 0/80 MXMH2056QV00 SXA2UH 0/80 0/80 1/79 B Totals 0/240 0/240 1/239 B Failure due to EOS. Refer to FA reports a and a. Description: PQ27E Revision A PBGA Qualification Report Report Rev.: G Device: MPC8271,MPC8272, MPC8247, MPC8248 Revision date: 10/18/2011 Kathy Badger Torres Page 7 of 12

8 StatsChipPac Qual data continued Unbiased HAST / 130 C, 85% RH, 33 psig Wafer Lot Trace Code MSL3/260 C 96 Hours MXMH2056QV00 SXA1UH 0/25 0/25 MXMH2056QV00 SXA3UH 0/25 0/25 MXMH2056QV00 SXA2UH 0/25 0/25 Totals 0/75 0/75 High Temperature Bake / 150 C Wafer Lot Trace Code 1008 Hours MXMH2056QV00 SXA1UH 0/80 MXMH2056QV00 SXA3UH 0/80 MXMH2056QV00 SXA2UH 1/80 C Totals 1/240 C Failed JTAG voltage levels due to foreign matter. FA report a. Corrective action included improved clean room practices which were validated by Freescale audit of SCK facilities. Substrate redesign to reduce noise on the VCCSYN1 pin. Qual Vehicle PQ27 MPC8270/MPC PBGA Changes were minor and included reduced VCCSYN1 wire bond length, rerouting of a VCCSYN1 via in the VSS layer, moving the NVCC via and removal of overlap between the NVCC and VCCSYN1 layer. Temperature Cycle / -55ºC to 125ºC Air to Air with MSL3 / 260ºC IR Reflow Lot number MSL3/260 C 400 Cycles 700 Cycles 1000 Cycles MQ1133C 0/25 0/25 0/25 0/25 MQ1113D 0/25 0/25 0/25 0/25 MQ1113F 0/25 0/25 0/25 0/25 Totals 0/75 0/75 0/75 0/75 Description: PQ27E Revision A PBGA Qualification Report Report Rev.: G Device: MPC8271,MPC8272, MPC8247, MPC8248 Revision date: 10/18/2011 Kathy Badger Torres Page 8 of 12

9 Copper Wire Qualification Data Summary KLM Assembly Site Qual Vehicle PQ27 MPC8270/MPC PBGA Moisture Sensitivity Level Characterization Wafer Lot Assy Lot MSL3/260 C DD ZLMHA1ARV400 0/10 DD ZLMHA1AT2K00 0/10 DD ZlMHA1ARV800 0/10 Totals 0/30 Temperature Cycle / -55ºC to 125ºC Air to Air with MSL3 / 260ºC IR Reflow Wafer Lot Assy Lot MSL3/260 C 400 Cycles 700 Cycles 1000 Cycles DD ZLMHA1ARV400 0/80 0/80 0/80 0/80 DD ZLMHA1AT2K00 0/80 0/80 0/80 0/80 DD ZlMHA1ARV800 0/80 0/80 0/80 0/80 Totals 0/240 0/240 0/240 0/240 Temperature Humidity / 85ºC, 85%R.H., with MSL3 / 260ºC IR Reflow Wafer Lot Assy Lot MSL3/260 C 504 Hours 1008 Hours DD ZLMHA1ARV400 0/77 0/77 0/77 DD ZLMHA1AT2K00 0/77 0/77 0/77 DD ZlMHA1ARV800 1/197 A 0/76 0/76 Totals 1/351 0/230 0/230 A Failure due to opens. Root cause undetermined. Additional 120 units stressed to lower LTPD to 2% with 1 failure.. Refer to AIMS FA report A. Unbiased HAST / 130 C, 85% RH, 33 psig Wafer Lot Assy Lot MSL3/260 C 96 Hours DD ZLMHA1ARV400 0/80 0/80 DD ZLMHA1AT2K00 0/80 0/80 DD ZlMHA1ARV800 0/80 0/80 Totals 0/240 0/240 High Temperature Bake / 150 C Wafer Lot Assy Lot 504 Hours 1008 Hours DD ZLMHA1ARV400 0/80 0/80 DD ZLMHA1AT2K00 0/80 0/80 DD ZlMHA1ARV800 0/80 0/80 Totals 0/240 0/240 High Temperature Operating Life Test (HTOL) Description: PQ27E Revision A PBGA Qualification Report Report Rev.: G Device: MPC8271,MPC8272, MPC8247, MPC8248 Revision date: 10/18/2011 Kathy Badger Torres Page 9 of 12

10 HTOL conditions: Ta=125 C, Vd1 = 2.0V, Vd2 = 4.0V Wafer Lot Assy Lot 5 years (120 hours) 10 years (240 hours) DD ZLMHA1ARV400 0/80 0/80 DD ZLMHA1AT2K00 0/80 0/80 DD ZlMHA1ARV800 0/80 0/80 Totals 0/240 0/240 High Temp Bake Data from MPC8271, 8272, 8247, 8248 High Temperature Bake / 150 C Wafer Lot Assy Lot 504 Hours 1008 Hours MXDD ZLMHA1C98P00 0/80 0/80 Totals 0/80 0/80 Description: PQ27E Revision A PBGA Qualification Report Report Rev.: G Device: MPC8271,MPC8272, MPC8247, MPC8248 Revision date: 10/18/2011 Kathy Badger Torres Page 10 of 12

11 MTTF (in Years) FIT Rate MPC8272, MPC8248, MPC8280, MPC8270, MPC8275 Product FIT Rate and MTTF Derated Curves: All values calculated at 1.5 volts, 55C ambient at 60% confidence FIT Rate vs. Junction Temperature (60% Confidence Level) Tj (in Celsius) MTTF vs. Junction Temperature (60% Confidence Level) Tj (in Celsius) Revision History: Revision History Description: PQ27E Revision A PBGA Qualification Report Report Rev.: G Device: MPC8271,MPC8272, MPC8247, MPC8248 Revision date: 10/18/2011 Kathy Badger Torres Page 11 of 12

12 Revision Date Comment Author Original 7/06/04 Original PQ27E PBGA Qualification Report Heather Rando A 8/19/04 Updated additional stress results Heather Rando B 10/18/04 Updated TH data for substrate supplier B Heather Rando C 12/04/07 Updated data for substrate supplier D Dipak Gandhi D 11/24/2010 Added StatsChipPac 2 nd source Assembly Site qualification Kathy Badger Torres data from Qual Vehicl MPC8279 E 9/1/2011 Added results from substrate redesign qualification done with Kathy Badger Torres PQ27A material assembled in StatsChipPac-Korea F 9/6/2011 Added clarification that the substrate redesign data is from Kathy Badger Torres PQ27A, the qual vehicle for PQ27E G 10/18/2011 Added Cu wire qualification data. With the exception of 1 lot of High Temp Bake data, the data is from PQ27A, the qual vehicle Kathy Badger Torres Description: PQ27E Revision A PBGA Qualification Report Report Rev.: G Device: MPC8271,MPC8272, MPC8247, MPC8248 Revision date: 10/18/2011 Kathy Badger Torres Page 12 of 12

13 Rev A Qualification Report MPC8270, MPC8280 ATMC HiP7AP 480 TBGA 516 PBGA PowerQUICC II Communications Processor MPC8280ZUxxxA MPC8280CZUxxxA MPC8270ZUxxxA MPC8270CZUxxxA MPC8280VVxxxA MPC8280CVVxxxA MPC8270VVxxxA MPC8270CVVxxxA MPC8275VR MPC8275ZQ MPC8270VR MPC8270ZQ

14 MPC8270, MPC8275, MPC8280 Product Information: Product / Technology / Fab / Package Description Package 480 TBGA (ZU/VV), 37.5 x 37.5 mm, 1.27 C5 pitch, Pb and Pb Free Sphere 516 PBGA (ZQ/VR), 27 x 27 mm, 1mm pitch, Pb and Pb Free Sphere Device PowerQUICC 27 Mask Set W02K49M and W03K49M Die Size 6.879x6.754 (46.46mm 2 ) Die Coating(s) Polyimide - yes Name/Location of Die Fab Facility ATMC / Austin TX Process Technology 0.13um HiP7AP Poly / Metal layers 1P / 5+1M (Dual Inlaid - Layers via 2, 3, and 4 metal 3 thru 5) Assembly Location Freescale, KLM Wire Material / Size Au / 0.8 mils Moisture Sensitivity Level MSL4 / 245 C, 260 C Reflow TBGA; MSL3 / 260 C Reflow PBGA Substrate Supplier Supplier A TBGA Supplier B TBGA Three PBGA Suppliers are Supplier A / A Green, C and D 2 nd Assembly Site Qualification, PBGA package Assembly Location StatsChipPac, Korea for PBGA package Wire Material / Size Au / 0.8 mils Moisture Sensitivity Level MSL3 / 260 C Substrate Supplier Supplier K Cu Wire Qualification, PBGA Package Assembly Location Freescale, KLM Wire Material / Size Cu / 0.8 mil Moisture Sensitivity Level MSL3 / 260 C Substrate Supplier Supplier V and Supplier B Kathy Badger Torres Page 2 of 15

15 Electrical Characterization Lot / Mask Set 40ºC and 105ºC D763591/2K49M 0 / 5 D787829/2K49M 0 / 5 D787839/2K49M 0 / 5 D878793/2K49M 0 / 10 DD /3K49M 0 / 5 DD268652/3K49M 0 / 5 Total 0 / 35 Electrostatic Discharge and Latch-up Test/Rev. A Lot / Mask Set HBM / 2KV MM / 200V CDM / 500V No Skt Latch-up / 200mA D757211/2K49M 0/3 0 / 3 0 / 3 0 / 6 Total 0/3 0 / 3 0 / 3 0 / 6 High Temperature Operating Life Test (HTOL) Vd1 2.0v, Vd2 4.0v, Ta 125ºC Lot / Mask Set 10 Years (240 hours) <100 FITs 20 Years (456 hours) <100 FITs 40 Years (1008 hours) <100 FITs For info only D787829/2K49M 0/80 0/80 0/80 D763591/2K49M 0/53 0/53 0/53 D787839/2K49M 0/80 0/80 0/79 DD /3K49M 0/ /80 Total 0/293 0/213 0/292 Kathy Badger Torres Page 3 of 15

16 TBGA Supplier A MSL4 Moisture Sensitivity Level Characterization Lot Number MSL4 / 245ºC D722821/1K49M 0/22 D722822/1K49M 0/22 D722823/1K49M 0/22 Totals 0/66 Temperature Cycle / -65ºC to 150ºC Air to Air after MSL4 / 245ºC IR Reflow Lot Number 200 Cycles 500 Cycles 1000 Cycles D722821/1K49M 0/80 0/80 0/80 D722822/1K49M 0/80 0/80 0/80 D722823/1K49M 0/80 0/80 0/80 Totals 0/240 0/240 0/240 Temperature Humidity / 85ºC, 85%R.H. after MSL4 / 245ºC IR Reflow Lot Number 504 Hours 1008 Hours D722821/1K49M 0/80 0/80 D722822/1K49M 0/80 0/80 D722823/1K49M 0/80 0/80 Totals 0/240 0/240 Kathy Badger Torres Page 4 of 15

17 Additional Similarity Data Test Vehicle: MPC8360 rev Lead-free Qual vehicle 37.5mm TBGA package MSL3 Moisture Sensitivity Level Characterization Lot Number MSL3 / 260ºC Assembly Lot 1 0/22 Assembly Lot 2 0/22 Assembly Lot 3 0/22 Totals 0/66 Temperature Cycle / -55ºC to 125ºC Air to Air after MSL3 / 260ºC IR Reflow Lot Number 400 Cycles 800 Cycles 1000 Cycles Assembly Lot 1 0/80 0/80 0/80 Assembly Lot 2 0/80 0/80 0/80 Assembly Lot 3 0/80 0/80 0/80 Totals 0/240 0/240 0/240 Temperature Humidity Bias / 85ºC, 85%R.H., 0.9v/3.3v with MSL3 / 260ºC IR Reflow Lot Number 504 Hours 1008 Hours Assembly Lot 1 0/80 0/80 Assembly Lot 2 0/80 0/80 Assembly Lot 3 0/80 0/80 Totals 0/240 0/240 High Temperature Bake / 150ºC Lot Number 504 Hours 1008 Hours Assembly Lot 1 0/80 0/80 Assembly Lot 2 0/80 0/80 Assembly Lot 3 0/80 0/80 Totals 0/240 0/240 Kathy Badger Torres Page 5 of 15

18 TBGA Supplier B MSL4 Moisture Sensitivity Level Characterization Lot Number MSL4 / 245ºC D /2K49M 0/11 D /2K49M 0/11 D /2K49M 0/11 Totals 0/33 Temperature Cycle / -65ºC to 150ºC Air to Air after MSL4 / 245ºC IR Reflow Lot Number 200 Cycles 500 Cycles 1000 Cycles D /2K49M 0/80 0/80 0/80 D /2K49M 0/80 0/80 0/80 D /2K49M 0/80 0/80 0/80 Totals 0/240 0/240 0/240 Temperature Humidity / 85ºC, 85%R.H. after MSL4 / 245ºC IR Reflow Lot Number 504 Hours 1008 Hours D /2K49M 0/80 0/80 D /2K49M 0/80 0/80 D /2K49M 0/80 0/80 Totals 0/240 0/240 Kathy Badger Torres Page 6 of 15

19 PBGA Supplier A Moisture Sensitivity Level Characterization Product - Package Assy Site / Substrate Supplier / Lots MSL3 / 245ºC MPC PBGA KLM / Substrate Supplier A / 3 assy lots 0 / 66 Totals 0 / 66 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 245ºC IR Reflow Product - Package Assy Site / Substrate Supplier / Lots 200 Cycles 500 Cycles MPC PBGA KLM / Substrate Supplier A / 3 assy lots 0 / / 240 Totals 0 / / 240 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 245ºC IR Reflow 1K49M Die with EAP Bond Pads (Extended Armor Pad) in the 516 PBGA Package Lot / Mask Set 200 Cycles 500 Cycles D /1K49M 0/55 0/55 D /1K49M 0/80 0/80 D /1K49M 0/80 0/80 Total 0/215 0/215 Temperature Humidity / 85ºC, 85%R.H. with MSL3 / 245ºC IR Reflow Product - Package Assy Site / Substrate Supplier / Lots 168 Hours 504 Hours 1008 Hours MPC PBGA KLM / Substrate Supplier A / 3 assy lots 0 / / 240 0/240 Totals 0 / / / 240 Kathy Badger Torres Page 7 of 15

20 PBGA Supplier C MSL3 Moisture Sensitivity Level Characterization Lot Number MSL3 / 260ºC QL1 0/22 QL2 0/22 QL3 0/22 Totals 0/66 Temperature Cycle / -65ºC to 150ºC Air to Air after MSL3 / 260ºC IR Reflow Lot Number 200 Cycles 500 Cycles 1000 Cycles QL1 0/80 0/80 0/80 QL2 0/80 0/80 0/80 QL3 0/80 0/80 0/80 Totals 0/240 0/240 0/240 Temperature Humidity / 85ºC, 85%R.H. after MSL3 / 260ºC IR Reflow Lot Number 504 Hours 1008 Hours QL1 0/80 0/80 QL2 0/80 0/80 QL3 0/80 0/80 Totals 0/240 0/240 Kathy Badger Torres Page 8 of 15

21 PBGA Supplier D MSL3 Moisture Sensitivity Level Characterization Lot Number MSL3 / 260ºC WEMH2014W000 0/22 WEMH2014W100 0/22 WEMH2014W200 0/22 Totals 0/66 Temperature Cycle / -65ºC to 150ºC Air to Air after MSL3 / 260ºC IR Reflow Lot Number 200 Cycles 500 Cycles 1000 Cycles WEMH2014W000 0/80 0/80 0/80 WEMH2014W100 0/80 0/80 0/80 WEMH2014W200 0/80 0/80 0/80 Totals 0/240 0/240 0/240 Temperature Humidity / 85ºC, 85%R.H. after MSL3 / 260ºC IR Reflow Lot Number 504 Hours 1008 Hours WEMH2014W000 0/80 0/80 WEMH2014W100 0/80 0/80 WEMH2014W200 0/80 0/80 Totals 0/240 0/240 High Temperature Bake / 150 C Lot Number 504 Hours 1008 Hours WEMH2014W000 0 / 80 0 / 80 WEMH2014W100 0 / 80 0 / 80 WEMH2014W200 0 / 80 0 / 80 Totals 0 / / 240 Kathy Badger Torres Page 9 of 15

22 PBGA Green Supplier A Moisture Sensitivity Level Characterization Product - Package Assy Site / Substrate Supplier / Lots MSL3 / 260ºC MPC PBGA KLM / Green Substrate Supplier A / 3 assy lots 0 / 66 Totals 0 / 66 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 260ºC IR Reflow Product - Package Assy Site / Substrate Supplier / Lots 200 Cycles 500 Cycles 850 Cycles 1000 Cycles MPC PBGA KLM / Green Substrate Supplier A / 3 assy lots 0 / / / / 240 Totals 0 / / / / 240 Kathy Badger Torres Page 10 of 15

23 StatsChipPac Korea PBGA Assembly Qualification Data Summary Moisture Sensitivity Level Characterization Wafer Lot Trace Code MSL3/260 C MXMH2056QV00 SXA1UH 0/10 MXMH2056QV00 SXA3UH 0/10 MXMH2056QV00 SXA2UH 0/10 Totals 0/30 Temperature Cycle / -55ºC to 125ºC Air to Air with MSL3 / 260ºC IR Reflow Wafer Lot Trace Code MSL3/260 C 400 Cycles 700 Cycles 1000 Cycles MXMH2056QV00 SXA1UH 0/25 0/25 0/25 0/25 MXMH2056QV00 SXA3UH 0/25 0/25 0/25 0/25 MXMH2056QV00 SXA2UH 0/25 0/25 0/25 0/25 Totals 0/75 0/75 0/75 0/75 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 260ºC IR Reflow Wafer Lot Trace Code MSL3/260 C 200 Cycles 500 Cycles 1000 Cycles MXMH2056QV00 SXA1UH 0/200 1/200 A 0/199 0/79 MXMH2056QV00 SXA3UH 0/80 0/80 0/80 0/80 MXMH2056QV00 SXA2UH 0/80 0/80 0/80 0/80 Totals 0/360 1/360 0/359 0/239 A Failure due to bin 8 opens on 2 pins due to foreign matter. FA report a. Corrective action included improved clean room practices which were validated by Freescale audit of SCK facilities. Additional 120 units from same qual lot stressed through 500 cycles to decrease LTPD. Temperature Humidity / 85ºC, 85%R.H., with MSL3 / 260ºC IR Reflow Wafer Lot Trace Code MSL3/260 C 504 Hours 1008 Hours MXMH2056QV00 SXA1UH 0/80 0/80 0/80 MXMH2056QV00 SXA3UH 0/80 0/80 0/80 MXMH2056QV00 SXA2UH 0/80 0/80 1/79 B Totals 0/240 0/240 1/239 B Failure due to EOS. Refer to FA reports a and a. Unbiased HAST / 130 C, 85% RH, 33 psig Wafer Lot Trace Code MSL3/260 C 96 Hours MXMH2056QV00 SXA1UH 0/25 0/25 MXMH2056QV00 SXA3UH 0/25 0/25 MXMH2056QV00 SXA2UH 0/25 0/25 Totals 0/75 0/75 Kathy Badger Torres Page 11 of 15

24 High Temperature Bake / 150 C Wafer Lot Trace Code 1008 Hours MXMH2056QV00 SXA1UH 0/80 MXMH2056QV00 SXA3UH 0/80 MXMH2056QV00 SXA2UH 1/80 C Totals 1/240 C Failed JTAG voltage levels due to foreign matter. FA report a. Corrective action included improved clean room practices which were validated by Freescale audit of SCK facilities. Substrate redesign to reduce noise on the VCCSYN1 pin. Changes were minor and included reduced VCCSYN1 wire bond length, rerouting of a VCCSYN1 via in the VSS layer, moving the NVCC via and removal of overlap between the NVCC and VCCSYN1 layer. Data below is for material assembled in StatsChipPac Korea. Temperature Cycle / -55ºC to 125ºC Air to Air with MSL3 / 260ºC IR Reflow Lot number MSL3/260 C 400 Cycles 700 Cycles 1000 Cycles MQ1133C 0/25 0/25 0/25 0/25 MQ1113D 0/25 0/25 0/25 0/25 MQ1113F 0/25 0/25 0/25 0/25 Totals 0/75 0/75 0/75 0/75 Kathy Badger Torres Page 12 of 15

25 Copper Wire Qualification Data Summary KLM Assembly Site Moisture Sensitivity Level Characterization Wafer Lot Assy Lot MSL3/260 C DD ZLMHA1ARV400 0/10 DD ZLMHA1AT2K00 0/10 DD ZlMHA1ARV800 0/10 Totals 0/30 Temperature Cycle / -55ºC to 125ºC Air to Air with MSL3 / 260ºC IR Reflow Wafer Lot Assy Lot MSL3/260 C 400 Cycles 700 Cycles 1000 Cycles DD ZLMHA1ARV400 0/80 0/80 0/80 0/80 DD ZLMHA1AT2K00 0/80 0/80 0/80 0/80 DD ZlMHA1ARV800 0/80 0/80 0/80 0/80 Totals 0/240 0/240 0/240 0/240 Temperature Humidity / 85ºC, 85%R.H., with MSL3 / 260ºC IR Reflow Wafer Lot Assy Lot MSL3/260 C 504 Hours 1008 Hours DD ZLMHA1ARV400 0/77 0/77 0/77 DD ZLMHA1AT2K00 0/77 0/77 0/77 DD ZlMHA1ARV800 1/197 A 0/76 0/76 Totals 1/351 0/230 0/230 A Failure due to opens. Root cause undetermined. Additional 120 units stressed to lower LTPD to 2% with 1 failure. Refer to AIMS FA report A. Unbiased HAST / 130 C, 85% RH, 33 psig Wafer Lot Assy Lot MSL3/260 C 96 Hours DD ZLMHA1ARV400 0/80 0/80 DD ZLMHA1AT2K00 0/80 0/80 DD ZlMHA1ARV800 0/80 0/80 Totals 0/240 0/240 High Temperature Bake / 150 C Wafer Lot Assy Lot 504 Hours 1008 Hours DD ZLMHA1ARV400 0/80 0/80 DD ZLMHA1AT2K00 0/80 0/80 DD ZlMHA1ARV800 0/80 0/80 Totals 0/240 0/240 High Temperature Operating Life Test (HTOL) HTOL conditions: Ta=125 C, Vd1 = 2.0V, Vd2 = 4.0V Wafer Lot Assy Lot 5 years (120 hours) 10 years (240 hours) DD ZLMHA1ARV400 0/80 0/80 DD ZLMHA1AT2K00 0/80 0/80 DD ZlMHA1ARV800 0/80 0/80 Totals 0/240 0/240 Kathy Badger Torres Page 13 of 15

26 MTTF (Years) Failure Rate (FIT) MPC8280, MPC8270 Product FIT Rate and MTTF Derated Curves: All values calculated at 1.5 volts, 55C ambient at 60% confidence. FIT Rate vs. Junction Temperature (60% Confidence Level) Voltage Junction Temperature (C) MTTF vs. Junction Temperature (60% Confidence Level) 100,000 10,000 1,000 Voltage Junction Temperature (C) Kathy Badger Torres Page 14 of 15

27 Revision History: Revision History Revision Date Comment Author Original 4/22/05 Original Dual Inlaid Qualification Report Noel Arguello Rev. A 5/16/2005 Added ESD results Noel Arguello Rev B 4/3/07 Added PBGA data Dipak Gandhi Rev C 7/23//07 Added TBGA supplier A data of 8360 to QBS 260C reflow & PBGA data compiled Dipak Gandhi Rev D 11/17//07 Added HTOL and Elec CZ data for SIL process implementation(dd ,dd268652) & PBGA Dipak Gandhi Rev E 02/25/08 Updated product info section Dipak Gandhi Rev F 10/30/08 Added PBGA supplier A Green data Dipak Gandhi Rev G 10/05/2010 Added SCK Assembly Qualification Data Kathy Badger Torres Rev H 9/6/2011 Added results from substrate redesign qualification done with material assembled in StatsChipPac-Korea Kathy Badger Torres Rev J 10/17/2011 Added results from Cu wire qualification. Skipped Rev I Kathy Badger Torres Kathy Badger Torres Page 15 of 15