MPC8270, MPC8275, MPC8280 Product Information:
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1 Rev A Qualification Report MPC8270, MPC8280 ATMC HiP7AP 480 TBGA 516 PBGA PowerQUICC II Communications Processor
2 MPC8270, MPC8275, MPC8280 Product Information: Product / Technology / Fab / Package Description Package 480 TBGA (ZU/VV), 37.5 x 37.5 mm, 1.27 C5 pitch, Pb and Pb Free Sphere 516 PBGA (ZQ/VR), 27 x 27 mm, 1mm pitch, Pb and Pb Free Sphere Device PowerQUICC 27 Mask Set WB32K49M (516PBGA) and WB13K49M (480TBGA) Die Size 6.879x6.754 (46.46mm 2 ) Die Coating(s) Polyimide - yes Name/Location of Die Fab Facility ATMC / Austin TX Process Technology 0.13um HiP7AP Poly / Metal layers 1P / 5+1M (Dual Inlaid - Layers via 2, 3, and 4 metal 3 thru 5) Assembly Location Freescale, KLM Wire Material / Size Au / 0.8 mils Moisture Sensitivity Level MSL4 / 245 C, 260 C Reflow TBGA; MSL3 / 260 C Reflow PBGA Lead Frame / Substrate Supplier Supplier A TBGA Supplier B TBGA Three PBGA Suppliers are Supplier A / A Green, C and D Assembly Location StatsChipPac, Korea for PBGA package Wire Material / Size Pd-Cu / 0.8 mils Moisture Sensitivity Level MSL3 Substrate Supplier Supplier K Page 2 of 16
3 Electrical Characterization Lot / Mask Set 40ºC and 105ºC D763591/2K49M 0 / 5 D787829/2K49M 0 / 5 D787839/2K49M 0 / 5 D878793/2K49M 0 / 10 DD /3K49M 0 / 5 DD268652/3K49M 0 / 5 Total 0 / 35 Electrostatic Discharge and Latch-up Test/Rev. A Lot / Mask Set HBM / 2KV MM / 200V CDM / 500V No Skt Latch-up / 200mA D757211/2K49M 0/3 0 / 3 0 / 3 0 / 6 Total 0/3 0 / 3 0 / 3 0 / 6 High Temperature Operating Life Test (HTOL) Vd1 2.0v, Vd2 4.0v, Ta 125ºC Lot / Mask Set 10 Years (240 hours) <100 FITs 20 Years (456 hours) <100 FITs 40 Years (1008 hours) <100 FITs For info only D787829/2K49M 0/80 0/80 0/80 D763591/2K49M 0/53 0/53 0/53 D787839/2K49M 0/80 0/80 0/79 DD /3K49M 0/ /80 Total 0/293 0/213 0/292 Page 3 of 16
4 TBGA Supplier A MSL4 Moisture Sensitivity Level Characterization Lot Number MSL4 / 245ºC D722821/1K49M 0/22 D722822/1K49M 0/22 D722823/1K49M 0/22 Totals 0/66 Temperature Cycle / -65ºC to 150ºC Air to Air after MSL4 / 245ºC IR Reflow Lot Number 200 Cycles 500 Cycles 1000 Cycles D722821/1K49M 0/80 0/80 0/80 D722822/1K49M 0/80 0/80 0/80 D722823/1K49M 0/80 0/80 0/80 0/240 Temperature Humidity / 85ºC, 85%R.H. after MSL4 / 245ºC IR Reflow Lot Number 504 Hours 1008 Hours D722821/1K49M 0/80 0/80 D722822/1K49M 0/80 0/80 D722823/1K49M 0/80 0/80 Page 4 of 16
5 Additional Similarity Data Test Vehicle: MPC8360 rev Lead-free Qual vehicle 37.5mm TBGA package MSL3 Moisture Sensitivity Level Characterization Lot Number MSL3 / 260ºC Assembly Lot 1 0/22 Assembly Lot 2 0/22 Assembly Lot 3 0/22 Totals 0/66 Temperature Cycle / -55ºC to 125ºC Air to Air after MSL3 / 260ºC IR Reflow Lot Number 400 Cycles 800 Cycles 1000 Cycles Assembly Lot 1 0/80 0/80 0/80 Assembly Lot 2 0/80 0/80 0/80 Assembly Lot 3 0/80 0/80 0/80 0/240 Temperature Humidity Bias / 85ºC, 85%R.H., 0.9v/3.3v with MSL3 / 260ºC IR Reflow Lot Number 504 Hours 1008 Hours Assembly Lot 1 0/80 0/80 Assembly Lot 2 0/80 0/80 Assembly Lot 3 0/80 0/80 High Temperature Bake / 150ºC Lot Number 504 Hours 1008 Hours Assembly Lot 1 0/80 0/80 Assembly Lot 2 0/80 0/80 Assembly Lot 3 0/80 0/80 Page 5 of 16
6 TBGA Supplier B MSL4 Moisture Sensitivity Level Characterization Lot Number MSL4 / 245ºC D /2K49M 0/11 D /2K49M 0/11 D /2K49M 0/11 Totals 0/33 Temperature Cycle / -65ºC to 150ºC Air to Air after MSL4 / 245ºC IR Reflow Lot Number 200 Cycles 500 Cycles 1000 Cycles D /2K49M 0/80 0/80 0/80 D /2K49M 0/80 0/80 0/80 D /2K49M 0/80 0/80 0/80 0/240 Temperature Humidity / 85ºC, 85%R.H. after MSL4 / 245ºC IR Reflow Lot Number 504 Hours 1008 Hours D /2K49M 0/80 0/80 D /2K49M 0/80 0/80 D /2K49M 0/80 0/80 Page 6 of 16
7 PBGA Supplier A Moisture Sensitivity Level Characterization Product - Package Assy Site / Substrate Supplier / Lots MSL3 / 245ºC MPC PBGA KLM / Substrate Supplier A / 3 assy lots 0 / 66 Totals 0 / 66 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 245ºC IR Reflow Product - Package Assy Site / Substrate Supplier / Lots 200 Cycles 500 Cycles MPC PBGA KLM / Substrate Supplier A / 3 assy lots 0 / / 240 Totals 0 / / 240 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 245ºC IR Reflow 1K49M Die with EAP Bond Pads (Extended Armor Pad) in the 516 PBGA Package Lot / Mask Set 200 Cycles 500 Cycles D /1K49M 0/55 0/55 D /1K49M 0/80 0/80 D /1K49M 0/80 0/80 Total 0/215 0/215 Temperature Humidity / 85ºC, 85%R.H. with MSL3 / 245ºC IR Reflow Product - Package Assy Site / Substrate Supplier / Lots 168 Hours 504 Hours 1008 Hours MPC PBGA KLM / Substrate Supplier A / 3 assy lots 0 / / 240 0/240 Totals 0 / / / 240 Page 7 of 16
8 PBGA Supplier C MSL3 Moisture Sensitivity Level Characterization Lot Number MSL3 / 260ºC QL1 0/22 QL2 0/22 QL3 0/22 Totals 0/66 Temperature Cycle / -65ºC to 150ºC Air to Air after MSL3 / 260ºC IR Reflow Lot Number 200 Cycles 500 Cycles 1000 Cycles QL1 0/80 0/80 0/80 QL2 0/80 0/80 0/80 QL3 0/80 0/80 0/80 0/240 Temperature Humidity / 85ºC, 85%R.H. after MSL3 / 260ºC IR Reflow Lot Number 504 Hours 1008 Hours QL1 0/80 0/80 QL2 0/80 0/80 QL3 0/80 0/80 Page 8 of 16
9 PBGA Supplier D MSL3 Moisture Sensitivity Level Characterization Lot Number MSL3 / 260ºC WEMH2014W000 0/22 WEMH2014W100 0/22 WEMH2014W200 0/22 Totals 0/66 Temperature Cycle / -65ºC to 150ºC Air to Air after MSL3 / 260ºC IR Reflow Lot Number 200 Cycles 500 Cycles 1000 Cycles WEMH2014W000 0/80 0/80 0/80 WEMH2014W100 0/80 0/80 0/80 WEMH2014W200 0/80 0/80 0/80 0/240 Temperature Humidity / 85ºC, 85%R.H. after MSL3 / 260ºC IR Reflow Lot Number 504 Hours 1008 Hours WEMH2014W000 0/80 0/80 WEMH2014W100 0/80 0/80 WEMH2014W200 0/80 0/80 High Temperature Bake / 150 C Lot Number 504 Hours 1008 Hours WEMH2014W000 0 / 80 0 / 80 WEMH2014W100 0 / 80 0 / 80 WEMH2014W200 0 / 80 0 / 80 Totals 0 / / 240 Page 9 of 16
10 PBGA Green Supplier A Moisture Sensitivity Level Characterization Product - Package Assy Site / Substrate Supplier / Lots MSL3 / 260ºC MPC PBGA KLM / Green Substrate Supplier A / 3 assy lots 0 / 66 Totals 0 / 66 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 260ºC IR Reflow Product - Package Assy Site / Substrate Supplier / Lots 200 Cycles 500 Cycles 850 Cycles 1000 Cycles MPC PBGA KLM / Green Substrate Supplier A / 3 assy lots 0 / / / / 240 Totals 0 / / / / 240 Page 10 of 16
11 StatsChipPac Korea PBGA Assembly Qualification Data Summary Moisture Sensitivity Level Characterization Wafer Lot Trace Code MXMH2056QV00 SXA1UH 0/10 MXMH2056QV00 SXA3UH 0/10 MXMH2056QV00 SXA2UH 0/10 Totals 0/30 Temperature Cycle / -55ºC to 125ºC Air to Air with MSL3 / 260ºC IR Reflow Wafer Lot Trace Code 400 Cycles 700 Cycles 1000 Cycles MXMH2056QV00 SXA1UH 0/25 0/25 0/25 0/25 MXMH2056QV00 SXA3UH 0/25 0/25 0/25 0/25 MXMH2056QV00 SXA2UH 0/25 0/25 0/25 0/25 Totals 0/75 0/75 0/75 0/75 Temperature Cycle / -65ºC to 150ºC Air to Air with MSL3 / 260ºC IR Reflow Wafer Lot Trace Code 200 Cycles 500 Cycles 1000 Cycles MXMH2056QV00 SXA1UH 0/200 1/200 A 0/199 0/79 MXMH2056QV00 SXA3UH 0/80 0/80 0/80 0/80 MXMH2056QV00 SXA2UH 0/80 0/80 0/80 0/80 Totals 0/360 1/360 0/359 0/239 A Failure due to bin 8 opens on 2 pins due to foreign matter. FA report a. Corrective action included improved clean room practices which were validated by Freescale audit of SCK facilities. Additional 120 units from same qual lot stressed through 500 cycles to decrease LTPD. Temperature Humidity / 85ºC, 85%R.H., with MSL3 / 260ºC IR Reflow Wafer Lot Trace Code 504 Hours 1008 Hours MXMH2056QV00 SXA1UH 0/80 0/80 0/80 MXMH2056QV00 SXA3UH 0/80 0/80 0/80 MXMH2056QV00 SXA2UH 0/80 0/80 1/79 B 1/239 B Failure due to EOS. Refer to FA reports a and a. Unbiased HAST / 130 C, 85% RH, 33 psig Wafer Lot Trace Code 96 Hours MXMH2056QV00 SXA1UH 0/25 0/25 MXMH2056QV00 SXA3UH 0/25 0/25 MXMH2056QV00 SXA2UH 0/25 0/25 Totals 0/75 0/75 Page 11 of 16
12 High Temperature Bake / 150 C Wafer Lot Trace Code 1008 Hours MXMH2056QV00 SXA1UH 0/80 MXMH2056QV00 SXA3UH 0/80 MXMH2056QV00 SXA2UH 1/80 C Totals 1/240 C Failed JTAG voltage levels due to foreign matter. FA report a. Corrective action included improved clean room practices which were validated by Freescale audit of SCK facilities. Substrate redesign to reduce noise on the VCCSYN1 pin. Changes were minor and included reduced VCCSYN1 wire bond length, rerouting of a VCCSYN1 via in the VSS layer, moving the NVCC via and removal of overlap between the NVCC and VCCSYN1 layer. Temperature Cycle / -55ºC to 125ºC Air to Air with MSL3 / 260ºC IR Reflow Lot number 400 Cycles 700 Cycles 1000 Cycles MQ1133C 0/25 0/25 0/25 0/25 MQ1113D 0/25 0/25 0/25 0/25 MQ1113F 0/25 0/25 0/25 0/25 Totals 0/75 0/75 0/75 0/75 480TBGA PQ27A Center Gate Mold Qualification Summary Temperature Cycle / -55ºC to 125ºC Air to Air with MSL3 / 260ºC IR Reflow Lot number 400 Cycles 700 Cycles 1000 Cycles QUAL LOT A 0/80 0/80 0/80 0/80 QUAL LOT B 0/80 0/80 0/80 0/80 QUAL LOT C 0/80 0/80 0/80 0/80 0/240 0/240 Moisture Sensitivity Level Characterization Wafer Lot QUAL LOT A 0/22 QUAL LOT B 0/22 QUAL LOT C 0/22 Totals 0/66 Unbiased HAST / 130 C, 85% RH, 33 psig Wafer Lot 96 Hours QUAL LOT A 0/80 0/80 QUAL LOT B 0/80 0/80 QUAL LOT C 0/80 0/80 Page 12 of 16
13 High Temperature Bake / 150 C* Wafer Lot 1008 Hours QUAL LOT A 0/30 QUAL LOT B 0/30 QUAL LOT C 0/30 Totals 0/90 * QBS data from 672TBGA 8349 Center Gate Molding Qualification Temperature Humidity / 85ºC, 85%R.H., with MSL3 / 260ºC IR Reflow* Wafer Lot 504 Hours 1008 Hours QUAL LOT A 0/25 0/25 0/25 QUAL LOT B 0/25 0/25 0/25 QUAL LOT C 0/25 0/25 0/25 Totals 0/75 0/75 0/75 * QBS data from 672TBGA 8349 Center Gate Molding Qualification Nanya Substrate Qualification Qual Vehicle: PQ27A / PQ27E (516 PBGA 27x27 mm, 1mm pitch, Pb and Pb Free Sphere) Temperature Cycle / -55ºC to 125ºC Air to Air with MSL3 / 260ºC IR Reflow Lot number 400 Cycles 700 Cycles 1000 Cycles QUAL LOT A 0/80 0/80 0/80 0/80 QUAL LOT B 0/80 0/80 0/80 0/80 QUAL LOT C 0/80 0/80 0/80 0/80 0/240 0/240 Moisture Sensitivity Level Characterization Wafer Lot QUAL LOT A 0/22 QUAL LOT B 0/22 QUAL LOT C 0/22 Totals 0/66 Unbiased HAST / 130 C, 85% RH, 33 psig Wafer Lot 96 Hours QUAL LOT A 0/80 0/80 QUAL LOT B 0/80 0/80 QUAL LOT C 0/80 0/80 High Temperature Bake / 150 C Wafer Lot 1008 Hours QUAL LOT A 0/30 QUAL LOT B 0/30 QUAL LOT C 0/30 Totals 0/90 Page 13 of 16
14 Temperature Humidity / 85ºC, 85%R.H., with MSL3 / 260ºC IR Reflow Wafer Lot 504 Hours 1008 Hours QUAL LOT A 0/25 0/25 0/25 QUAL LOT B 0/25 0/25 0/25 QUAL LOT C 0/25 0/25 0/25 Totals 0/75 0/75 0/75 PQ27A 480TBGA Conversion to Copper Wire Bond Temperature Cycle / -55ºC to 125ºC Air to Air with MSL3 / 260ºC IR Reflow Lot number 400 Cycles 700 Cycles QUAL LOT A 0/25 0/25 0/25 QUAL LOT B 0/25 0/25 0/25 QUAL LOT C 0/25 0/25 0/25 Totals 0/75 0/75 0/75 Moisture Sensitivity Level Characterization* Lot number QUAL LOT A 0/11 QUAL LOT B 0/11 QUAL LOT C 0/11 Totals 0/33 *QBS to MPC TBGA Unbiased HAST / 110 C, 85% RH, 17.7 psia* Lot number 264 Hours QUAL LOT A 0/80 0/80 QUAL LOT B 0/80 0/80 QUAL LOT C 0/80 0/80 *QBS to MPC TBGA High Temperature Bake / 150 C* Lot number 504 Hours 1008 Hours QUAL LOT A 0/30 0/30 QUAL LOT B 0/30 0/30 QUAL LOT C 0/30 0/29** Totals 0/90 0/90 *QBS to MPC TBGA **1 unit with mechanical damage after HTSL 1008 hours Temperature Humidity / 85ºC, 85%R.H., with MSL3 / 260ºC IR Reflow* Lot number 504 Hours 1008 Hours QUAL LOT A 0/25 0/25 0/25 QUAL LOT B 0/25 0/25 0/25 QUAL LOT C 0/25 0/25 0/25 Totals 0/75 0/75 0/75 *QBS to MPC TBGA Page 14 of 16
15 MTTF (Years) Failure Rate (FIT) MPC8280, MPC8270 Product FIT Rate and MTTF Derated Curves: All values calculated at 1.5 volts, 55C ambient at 60% confidence. FIT Rate vs. Junction Temperature (60% Confidence Level) Voltage Junction Temperature (C) MTTF vs. Junction Temperature (60% Confidence Level) 100,000 10,000 1,000 Voltage Junction Temperature (C) Page 15 of 16
16 Revision History: Revision History Revision Date Comment Author Original 4/22/05 Original Dual Inlaid Qualification Report Noel Arguello Rev. A 5/16/2005 Added ESD results Noel Arguello Rev B 4/3/07 Added PBGA data Dipak Gandhi Rev C 7/23//07 Added TBGA supplier A data of 8360 to QBS 260C reflow & PBGA data compiled Dipak Gandhi Rev D 11/17//07 Added HTOL and Elec CZ data for SIL process implementation (DD ,DD268652) & PBGA Dipak Gandhi Rev E 02/25/08 Updated product info section Dipak Gandhi Rev F 10/30/08 Added PBGA supplier A Green data Dipak Gandhi Rev G 10/05/2010 Added SCK Assembly Qualification Data Kathy Badger Torres Rev H 9/6/2011 Added results from substrate redesign qualification done with material assembled in StatsChipPac-Korea Kathy Badger Torres Rev I 10/17/2011 Added Cu Wire Qualification Results Kathy Badger Torres Rev J 1/19/2012 Added 480TBGA PQ27A Center Gate Mold Qualification Summary Navin Kumar Rev K 3/20/2012 Added Nanya Substrate Qualification Results Navin Kumar Rev L 8/19/2014 Added PQ27A 480TBGA Cu Wire Bond Qualification Data Navin Kumar Page 16 of 16
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