AEC-Q100G Qualification Results

Transcription

1 Objective: Bolero512K ATMC to TSMC14 Fab Transfer & Cu Wire Qualification Freescale PN: MPC5604BK0MLQ6 Customer Name(s): "Varies" Part Name: Bolero512K PN(s): "Varies" AEC-Q100G Qualification Plan or : Rev 1 - Result Revision # & Date: See revision history below Technology: CMOS90FG-LC flash Design Engr: Not applicable QUARTZ Tracking #: Package: LQFP SQ1.4P0.5 Fab / Assembly / TSMC14 / FSL-KLM-FM / FSL-KLM-FM Product Engr: Mohd. Azli Helmi - B04563 (Signature/Date shown below may be electronic) Final Test s: Maskset#: N68H GAO(Global Assembly Jasmine Lim - B18239 GAO Approval (for Jasmine Lim - B18239 Rev#: 0 Aperation) Engr: DIM/BOM results) 30-Sep-2013 (in mm) NPI PRQE: Chew Kim Seong-B36347 NPI PRQE Approval Chew Kim Seong-B36347 W x L 30-Sep-2013 Part Operating Grade 1-40 C to C Trace/DateCode: LOT A LOT B LOT C CAB Approval M Temp. Grade: 8EMHA1VND N/A N/A 31-Oct-2013 P00 Customer Approval May be N/A TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY This testing is performed by Freescale Reliability Lab (KLM) unless otherwise noted in the Comments. GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS Preconditioning (PC) : All surface mount devices prior to THB, HAST, AC, Pass Generic Data A113 PC required for SMDs only. UHST, TC, PC+PTC and as required per test J-STD-020 MSL 260 C, +5/-0 C conditions. Lot B: 0/231 PC HAST A101 A110 Highly Accelerated Stress Test (HAST): PC before HAST (for SMDs only): Required HAST = 110 C/85%RH for 264 hrs. Bias = Max Vdd Bolero1M5_MPC5604BK0MLL6, (0N69H), 144LQFP 20*20, FSL-KLM-FM, Q222220: Pass Generic Data UHST A102 A118 Unbiased HAST (UHST): PC before UHST (for SMDs only): Required UHST = 110 C/85%RH for 264 hrs. R Pass Generic Data TC A104 AEC Q100- Appendix 3 Temperature Cycle (TC): H PC before TC (for SMDs only): Required For AEC: WBP =/> 3 TC = -65 C to 150 C for 500 cycles. grams For AEC only: WBP after TC on 5 devices from 1 lot; 2 bonds per corner and one mid-bond per side on each device. Record which pins were used Pass Generic Data Bolero1M5_MPC5604BK0MLL6, (0N69H), 144LQFP 20*20, FSL-KLM-FM, Q222220: High Temperature Storage Life (HTSL): Pass Generic Data A C for 1008 hrs Timed RO = 96hrs. MAX HTSL TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS High Temperature Operating Life (HTOL): C Generic Data A108 AEC Ta = 125 C for 1008 hrs. Bolero1M5, (0N69H ), 176LQFP, TSMC14 HTOL AEC Q Early Life Failure Rate (ELFR): Generic Data AEC Ta = 125 C for 48 hrs Bolero1M5, (0N69), 176LQFP, TSMC14 ELFR Timed RO of 48 hrs MAX Lot B: 0/800 Lot C: 0/800 AEC Q NVM Endurance, Data Retention, and C 77 Generic Data Operational Life (EDR): Bolero1M, N13E, 176LQFP 24x24, 150 C for 168 hrs TSMC, : 1008hrs EDR TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS AEC Q Wire Bond shear (WBS) Cpk = or > bonds 1 5 Lot A: 0/5, Cpk>1.67 WBS WBP MilStd Wire Bond Pull (WBP): Cond. C or D Cpk = or > bonds 1 5 Lot A: 0/5, Cpk>1.67 SD PD B102 B100 Solderability (SD): 8hr.(1 hr. for Au-plated leads) Steam age prior to test. If production burn-in is done, samples must also undergo burn-in prior to SD. Physical Dimensions(PD): PD per FSL 98A drawing >95% lead coverage 15 of critical areas Cpk = or > Performed by Assembly during qual lot builds - PE to include the PD requirement in the qual lot build ERF

2 HBM AEC-Q / ElectroStatic Discharge/ A114E Human Body Model Classification (HBM): Jan /1000/1500/2000 Volts For AEC, see AEC-Q for classification 2KV min Lot A: 1000V: 0/ V: 0/3 MM AEC-Q ElectroStatic Discharge/ or JESD22 Machine Model Classification m(mm): 50/100/200/400 Volts For AEC, see AEC-Q for classification 200V min. CDM AEC-Q ElectroStatic Discharge/ Charged Device Model Classification (CDM): 250/500/750 Volts For AEC, see AEC-Q for classification Timed RO of 96hrs MAX. All pins =/> 500V For AEC, Corner pins =/> 750V; 1 9 Lot A: 250V: 0/3 750V: 0/3 (Corner pins) LU ED Dimensional (DIM): DIM: Not required DIM GAO to verify PD results against valid 98A BOM: Approved & drawing. BOM BOM Verification (BOM): GAO to verify qual lot ERF BOM is accurate. AEC-Q Solder Ball Shear (SBS): Cpk = or > For solder ball mounted packages only; NOT for Performed on all solder ball mounted packages (5 balls from a Flip Chips. e.g. PBGA, Chip Scale, Micro Lead Frame (but min. of 10 SBS NOT Flip Chip). devices) Two reflow cycles at MSL reflow temperature before shear. Lead Integrity (LI): No lead breakage or 5 B105 Not required for surface mount devices; cracks (10 leads from LI Only required for through-hole devices. each of 5 parts) TEST GROUP D - DIE FABRICATION RELIABILITY TESTS Comments Electro Migration (EM) EM Time Dependent Dielectric Breakdown (TDDB) TDDB Hot Carrier Injection (HCI) HCI Stress Migration (SM) SM Negative Bias Temperature Instability (NBTI) NBTI TEST GROUP E - ELECTRICAL VERIFICATION TESTS Freescale 48A Pre- and Post Functional / Parametrics (TEST): 0 Fails All All All See Summary This action refers to Final Testing of all qualification For AEC, test software shall meet requirements of units. AEC-Q TEST Testing performed to the limits of device specification in temperature and limit value. JESD78 Latch-up (LU): Lot A: 0/6 plus Test per JEDEC JESD78 with the AEC-Q AEC-Q100- requirements for AEC. 004 for AEC Ta= Maximum operating temperature Vsupply = Maximum operating voltage AEC-Q , Electrical Distribution (ED) C AEC: Pre & Post HTOL Freescale 48A Pass, Cpk > 1.67 spec For AEC, Cpk target > 1.67 FG Q Fault Grading (FG) FG shall be = or > 90% for qual units FG%= No change Production Test requirement: 98% w/o Iddq 95% w/iddq 100% TYPE2 faults detection CHAR Q003 Characterization (CHAR): Ony performed on new technologies and part families per AEC Q003. Not required GL (for information only) Q Electro-Thermally Induced Gate Leakage (GL): R 6 Freescale does not plan Gate Leakage testing in 155 C, 2.0 min, +400/-400 V alignment with the expected revision to AEC Q100 Per AEC Q100 Rev G, this test is performed for that will eliminate this "for information only" stress. information only. Timed RO of 96 hrs MAX. For all failures, perform unbiased bake (4hrs/125 C, or 2hrs/150 C) and retest; recovered units are GL failures. EMC SAE J1752/3 - Radiated Emissions Electromagnetic Compatibility (EMC) (see AEC Q100 Appendix 5 for test applicability; done on case-by-case basis per customer/freescale agreement) <40dBuV 150kHz - 1GHz 1 a. For TSMC14, EMC data is represented by Bolero1M (0N69H). b. For Au to Cu wire change, EMC report showing no impact, S12G_Grouper (0N95B), report available upon request. Product Information TSMC14 FSL-KLM LQFP 144 ABLEBOND MC 20SQ1.4P EPOXY Parts Qualified By Similarity Quartz# Fab/Mask Set/Tech Product-Qual Description/Part Number (s) Die Area (mm) Assembly Pkg (Code) Die Attach Mold Compound Wire Description 2M27V / C90FG Bolero512K / SPC5604BF2MLQ x 4.29 FSL-KLM-FM LQFP 144 ABLEBOND Y Die Generic Data List: 0N13E Bolero 1M / MPC5606BK0MLU6 / x mm Package Generic Data List: Q M25V Spectrum / MPC5606SF2VLQ6 / x mm TSMC14 ASECL LQFP 176 EN-4900G HITACHI CEL9240HF16AK 20um Cu TSMC14 ASECL LQFP 176 EN-4900G CEL9200THF-U-AK (low alpha) 23um Au TSMC14 FSL-KLM LQFP 144 ABLEBOND EME-G700LS FSL-ATMC FSL-KLM LQFP 144 ABLEBOND EME-G700LS Revision Date Comments Author Rev 1 25-Sep-13 Qualification Update Chew Kim Seong

3 Objective: Bolero512K ATMC to TSMC14 Fab Transfer & Cu Wire Qualification Freescale PN: MPC5604BK0MLL6 Customer Name(s): "Varies" Part Name: Bolero512K PN(s): "Varies" AEC-Q100G Qualification Plan or : Rev 1 - Result Revision # & Date: See revision history below Technology: CMOS90FG-LC flash Package: LQFP SQ1.4P0.5 C90 Fab / Assembly / TSMC14 / FSL-KLM-FM / FSL-KLM-FM Final Test s: Design Engr: Not applicable QUARTZ Tracking #: Product Engr: Mohd. Azli Helmi - B04563 (Signature/Date shown below may be electronic) Maskset#: N68H GAO(Global Assembly Jasmine Lim - B18239 Rev#: 0 Aperation) Engr: (in mm) NPI PRQE: Chew Kim Seong-B36347 W x L Part Operating Grade 1-40 C to C Trace/DateCode: LOT A LOT B Temp. Grade: 8EMHA1VND N/A M00 LOT C N/A GAO Approval (for Jasmine Lim - B18239 DIM/BOM results) 30-Sep-2013 NPI PRQE Approval Chew Kim Seong-B Sep-2013 CAB Approval M 31-Oct-2013 Customer Approval May be N/A TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY This testing is performed by Freescale Reliability Lab (KLM) unless otherwise noted in the Comments. GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS End Point Requirements Minimum Sample Size # of Lots including A113 J-STD-020 Preconditioning (PC) : PC required for SMDs only. MSL 260 C, +5/-0 C All surface mount devices prior to THB, HAST, AC, Pass Generic Data UHST, TC, PC+PTC and as required per test conditions. Lot B: 0/231 PC Bolero1M5_MPC5604BK0MLL6, (0N69H ), 100LQFP 14*14, FSL-KLM-FM, Q222605: HAST A101 A110 Highly Accelerated Stress Test (HAST): PC before HAST (for SMDs only): Required HAST = 110 C/85%RH for 264 hrs. Bias = Max Vdd Pass Generic Data UHST A102 A118 Unbiased HAST (UHST): PC before UHST (for SMDs only): Required UHST =110 C/85%RH for 264 hrs. R Pass Generic Data TC A104 AEC Q100- Appendix 3 Temperature Cycle (TC): H PC before TC (for SMDs only): Required For AEC: WBP =/> 3 TC = -65 C to 150 C for 500 cycles. grams For AEC only: WBP after TC on 5 devices from 1 lot; 2 bonds per corner and one mid-bond per side on each device. Record which pins were used Pass Generic Data Bolero1M5_MPC5604BK0MLL6, (0N69H ), 100LQFP 14*14, FSL-KLM-FM, Q222605: HTSL A103 High Temperature Storage Life (HTSL): 150 C for 1008 hrs Timed RO = 96hrs. MAX Pass Generic Data TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS High Temperature Operating Life (HTOL): C Pass Generic Data A108 AEC Ta = 125 C for 1008 hrs. Bolero1M5, (0N69H ), 176LQFP, TSMC14 : HTOL : ELFR AEC Q Early Life Failure Rate (ELFR): AEC Ta = 125 C for 48 hrs Timed RO of 48 hrs MAX Pass Generic Data Bolero1M5, (0N69), 176LQFP, TSMC14 Lot B: 0/800 Lot C: 0/800 EDR AEC Q NVM Endurance, Data Retention, and C Pass Generic Data Operational Life (EDR): Bolero1M, N13E, 176LQFP 24x24, TSMC14,

4 TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS AEC Q Wire Bond shear (WBS) Cpk = or > bonds 1 5 Lot A: 0/5, Cpk>1.67 Generic Data Bolero 1.5M_SPC5607BK0MLL, (0N69H), WBS 100LQFP, FSL-KLM-FM, Q222605: Lot A: 0/5, Cpk > 1.67 WBP MilStd Wire Bond Pull (WBP): Cond. C or D Cpk = or > bonds 1 5 Lot A: 0/5, Cpk>1.67 Generic Data Bolero 1.5M_SPC5607BK0MLL, (0N69H), 100LQFP, FSL-KLM-FM, Q222605: Lot A: 0/5, Cpk > 1.67 SD B102 Solderability (SD): 8hr.(1 hr. for Au-plated leads) Steam age prior to test. If production burn-in is done, samples must also undergo burn-in prior to SD. >95% lead coverage of critical areas 15 PD B100 Physical Dimensions(PD): PD per FSL 98A drawing Cpk = or > DIM: Not required BOM: Approved Cpk = or > For solder ball mounted packages only; NOT for (5 balls from a Flip Chips. min. of 10 devices) No lead breakage or 5 cracks (10 leads from each of 5 parts) TEST GROUP D - DIE FABRICATION RELIABILITY TESTS Comments TDDB Time Dependent Dielectric Breakdown (TDDB) HCI Hot Carrier Injection (HCI) SM Stress Migration (SM) NBTI Negative Bias Temperature Instability (NBTI) Freescale 48A Pre- and Post Functional / Parametrics (TEST): For AEC, test software shall meet requirements of AEC-Q TEST Testing performed to the limits of device specification in temperature and limit value. TEST GROUP E - ELECTRICAL VERIFICATION TESTS 0 Fails All All All See Summary This action refers to Final Testing of all qualification units. HBM AEC-Q / ElectroStatic Discharge/ A114E Human Body Model Classification (HBM): Jan /1000/1500/2000 Volts For AEC, see AEC-Q for classification 2KV min. 0 0 Pass Generic Data Lot A: 1000V: 0/ V: 0/3 MM AEC-Q ElectroStatic Discharge/ or JESD22 Machine Model Classification m(mm): 50/100/200 Volts For AEC, see AEC-Q for classification 200V min. CDM AEC-Q ElectroStatic Discharge/ Charged Device Model Classification (CDM): 250/500/750 Volts For AEC, see AEC-Q for classification Timed RO of 96hrs MAX. All pins =/> 500V For AEC, Corner pins =/> 750V; 1 9 Lot A: 250V: 0/3 750V: 0/3 (Corner pins) LU ED Dimensional (DIM): DIM GAO to verify PD results against valid 98A & drawing. BOM BOM Verification (BOM): GAO to verify qual lot ERF BOM is accurate. AEC-Q Solder Ball Shear (SBS): Performed on all solder ball mounted packages e.g. PBGA, Chip Scale, Micro Lead Frame (but SBS NOT Flip Chip). Two reflow cycles at MSL reflow temperature before shear. Lead Integrity (LI): B105 Not required for surface mount devices; LI Only required for through-hole devices. Electro Migration (EM) EM JESD78 Latch-up (LU): Pass Generic Data plus Test per JEDEC JESD78 with the AEC-Q AEC-Q100- requirements for AEC. 004 for AEC Ta= Maximum operating temperature Lot A: 0/6 Vsupply = Maximum operating voltage AEC-Q , Electrical Distribution (ED) C Pass Generic Data Freescale 48A spec For AEC, Cpk > 1.67 Cpk target > 1.67 FG Q Fault Grading (FG) FG shall be = or > 90% for qual units FG%= No change Production Test requirement: 98% w/o Iddq 95% w/iddq 100% TYPE2 faults detection CHAR Q003 Characterization (CHAR): Ony performed on new technologies and part families per AEC Q003. Not required GL (for information only) Q Electro-Thermally Induced Gate Leakage (GL): R 6 Freescale does not plan Gate Leakage testing in 155 C, 2.0 min, +400/-400 V alignment with the expected revision to AEC Q100 Per AEC Q100 Rev G, this test is performed for that will eliminate this "for information only" stress. information only. Timed RO of 96 hrs MAX. For all failures, perform unbiased bake (4hrs/125 C, or 2hrs/150 C) and retest; recovered units are GL failures. EMC SAE J1752/3 - Radiated Emissions Electromagnetic Compatibility (EMC) (see AEC Q100 Appendix 5 for test applicability; done on case-by-case basis per customer/freescale agreement) <40dBuV 150kHz - 1GHz 1 a. For TSMC14, EMC data is represented by Bolero1M (0N69H). b. For Au to Cu wire change, EMC report showing no impact, S12G_Grouper (0N95B), report available upon request.

5 Product Information TSMC14 FSL-KLM LQFP 100 ABLEBOND MC Parts Qualified By Similarity Quartz# Fab/Mask Set/Tech Product-Qual Description/Part Number (s) Die Area (mm) Assembly Pkg (Code) Die Attach Mold Compound Wire Description 1M18Y / C90FG 2M27V / C90FG 0M22Y / C90FG 0N69H / C90FG 1M03Y / C90FG Bolero256K / SPC5602DF1MLL4R x FSL-KLM-FM LQFP 100 ABLEBOND Bolero512K / SPC5604BF2MLL6R 4.50 x 4.29 FSL-KLM-FM LQFP 100 ABLEBOND Pictus256K / SPC5602PEF0MLL6R x FSL-KLM-FM LQFP 100 ABLEBOND Pictus512K / SPC5604PEF1MLL6R x FSL-KLM-FM LQFP 100 ABLEBOND Bolero1M5 / SPC5605BF1MLL x FSL-KLM-FM LQFP 100 ABLEBOND Die Generic Data List: 0N13E Bolero 1M / MPC5606BK0MLU6 / x mm Package Generic Data List: Q N69H Bolero 1.5M / SPC5607BK0MLL / Q M25V Spectrum / MPC5606SF2VLQ6 / x mm TSMC14 FSL-KLM LQFP 144 ABLEBOND MC 20SQ1.4P EPOXY TSMC14 ASECL LQFP 176 EN-4900G HITACHI CEL9240HF16AK 20um Cu TSMC14 ASECL LQFP 176 EN-4900G CEL9200THF-U-AK (low alpha) 23um Au TSMC14 FSL-KLM LQFP 144 ABLEBOND EME-G700LS TSMC14 FSL-KLM LQFP 100 ABLEBOND EME-G700LS 14SQ1.4P0.5 C EPOX FSL-ATMC FSL-KLM LQFP 144 ABLEBOND EME-G700LS Revision Date Comments Author Rev 1 25-Sep-13 Qualification Update Chew Kim Seong