Index. Springer International Publishing Switzerland 2015 M. Tehranipoor et al., Counterfeit Integrated Circuits, DOI /
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1 Index A AACF. See Areal autocorrelation function (AACF) Accelerated aging, 103, 159, 160, , 173, 189 Active metering, 176, 226, 251 Additive watermarking, 208, Advanced detection, , Aging, 19, 20, 66, 67, 103, , , 172, 173, , , 188, 189, 199, 230, 246, , 251, 252, Aging-resistant ring oscillator PUF (ARO- PUF), , 252, Antifuse-based CDIR structures, Antifuse memory, , 194, 195 Arbiter PUF, , 252, Areal autocorrelation function (AACF), 147, 148 ARO-PUF. See Aging-resistant ring oscillator PUF (ARO-PUF) Assembly, 18, 22 24, 27, 28, 33, 58, Assessment framework, 106, 111, 114, 115, Asymmetric encryption, 231 Automatic test equipment (ATE), 96, 97, 99, 157, 232, 233 B Ball grid array (BGA), 48, 49, 53, 54 Balls, 20, 43 45, 48, 49, 53, 58, 59, 61, 64, 80, 81, 99 Bench equipment, BGA. See Ball grid array (BGA) Blacktopping, 20, 22, 52, 56, 111, 152, 255 Bond wires, 43, 56 59, 61, 71, 76, 82 86, 89, 98, 99, 101, 135, 136, 150 Burneds markings, 51, 52, 85 Burn-in, 24, 95, , 172, 181, 182, 189, 196, 197 C CAF-based CDIR. See Clock AF-based CDIR (CAF-based CDIR) Capacitive (coating) physical unclonable functions (coating PUF), 243, Cavities, 54, 80 CDC. See Counterfeit defect coverage (CDC) CDIR. See Combating die and IC recycling (CDIR) Center shift, 82, Chip ID, 33, 176, 228, Clock AF-based CDIR (CAF-based CDIR), Clock sweeping, Cloned, 25, 27, 31, 33, 37, 45, 46, 55, 57 59, 63, 67 69, 76, 90, 105, 106, 113, 114, 121, 126, 127, 130, , 227, 229, 238, 245, 260 Cloning, 25, 58, 206, 220, 223, , 244, 245, 251, 260 Coating PUF. See Capacitive (coating) physical unclonable functions (coating PUF) Column grid array (CGA), 48, 53 Columns, 20, 43 45, 48, 49, 53, 58, 64, 80, 85, 99, , 119, 120, 125, 135, 136, 152, 194 Springer International Publishing Switzerland 2015 M. Tehranipoor et al., Counterfeit Integrated Circuits, DOI /
2 266 Index Combating die and IC recycling (CDIR), 33, Component states, 29 Component supply chain, 9, 15, 18, 21, 27, 29, 32, 33, 116, 117, 175, 243, 244, 254, Computed tomography (CT), 82, 147 Confidence level matrix, , 118, 123 Connecticut secure split-test (CSST), 223, 224, Constraint-based watermarking, , 220 Contact windows, 69, 70 Contamination, 64, 65, 71, 76, 85 Convex hull, 170, 171 Corrosion, 63 65, 70, 71, 85 Cost effectiveness, 244, 259, Counterfeit defect coverage (CDC), 109, , , Counterfeit defects, 37 72, 75, 76, 78, 84 Counterfeit detection methods, 76 77, , 157 Counterfeit electronics, 5 13, 16, 18, 19, 30, 31, 39, 152 Counterfeit integrated circuits, 15 34, 109 Counterfeit market, 4, 5, 9 Counterfeit products, 3 4, 9, 12, 33, 90 Counterfeit trade, 1, 4, 5, 11, 12 Counterfeit type coverage (CTC), 109, , , 130 Counterfeit types, 18 26, 31 33, 37, 41, 45, 55, 67, 68, 70, 90, 91, 95, 99, 105, 106, 109, , , 136, 157, 225, 260, 262 Cracks, 55, 62, 70, 76, 82, 85, 89, 136 CSST. See Connecticut secure split-test (CSST) CTC. See Counterfeit type coverage (CTC) Curve tracing, 95, D Date code, 16, 21, 41 43, 79 Decapsulation, 76, 81, 83, 86, 136, 152, 199 Decision index (DI), 111, 113, 114, 116, , 124, 130 Defect frequency, 111, 113, 114, , Defect mapping matrix, Defense industrial base assessment, 9 12 Delamination, 62, 76, 85, 89, 136, 150, 151 Delid, 76, 83 Design, 8, 18, 27, 62, 91, 99, 121, 157, 175, , 203, , 223, 245 Design-for-anti-counterfeit (DFAC), 21, 25, 29, 32 34, 105, 121, 130, 173, 175, 177, 199 Design-for-testability (DFT), 9 DI. See Decision index (DI) Die, 28, 29, 32, 33, 43, 56 63, 70, 71, 75, 76, 78, 82, 83, 85, 86, 89, 92, 98, 99, 135, 136, , , 203, 205, 224, 225, , 234, 243, 245, 252, 257, 260, 262 Die ID, 243, , 257, 258, 260, Digital microscope, 80 Digital photogrammetry, 138 Dimensions, 45, 54, 55, 76, 80, 81, 111, , 143, 150, 165, 171, 227 Distribution, 2, 27, 28, 31, 33, , 164, 166, 167, 175, , 224 DNA marking, 32, 33, 177, 243, , 258, 259 Dynamic assessment, 110, 118, E Early failure rate (EFR), 157, 172 Ease-of-Use, 244, 259 ECID. See Electronic chip ID (ECID) EDS. See Energy dispersive spectroscopy (EDS) Electrical defects, 65 71, 76, 129 Electrical tests, 31, 32, 75, 76, 92, , Electromigration, Electronic chip ID (ECID), 33, 176, 177, 228, 229 Electronic waste (e-waste), 8, 19, 29 Electrostatic discharge (ESD), 20, 21, 40 42, 58, 78, 80 Encrypted QR codes, 243, , End-of-life, 27, 29, 34 Energy dispersive spectroscopy (EDS), 45, 76, 87 88, 143, 152 Environmental defects, ESD. See Electrostatic discharge (ESD) Eucentrically tilting, 138 EVI. See External visual inspection (EVI) E-waste. See Electronic waste (e-waste) External visual inspection (EVI), 75, 78 81, 85, 92, 120, 121, 125 Extraneous markings, 50, 53 54, 63, 80, 86 F Fabless business model,
3 Index 267 Fabrication, 9, 22, 26 28, 33, 34, 62, 69 71, 103, 190, 204, , , 253 F-CDIR. See Fuse-based CDIR (F-CDIR) Field programmable gate arrays (FPGA), 16, 21, 26, 102, 157, 158, , 172, 204, 206, 208, , Firm IPs, 27, 205 Focus correction, Focus Ion Beam (FIB) tomography, 26, 137 Forged documentation, 25 26, 33, 114, 121, 126, 127, 130, 260 Forged paperwork, 41 Four dimensional scanning electron microscopy, Fourier transform infrared (FTIR), 76, 87, 136 FPGA. See Field programmable gate arrays (FPGA) Functional-locking, , 237, 238 Functional tests, 99, 101, 102, 105, 157 Fuse-based CDIR (F-CDIR), 33, 177, G Ghost markings, 50 52, 80, 85 Grinding, 50, 52, 76, 79, 80, 85, 205 H Hamming distance (HD), , 250 Hard IPs, 27, 205, 211, 215 Hardware metering (HM), 33, 34, 176, 177, 238 Hardware Trojan, 18, 26, 223 Hardware watermarking, HCI. See Hot carrier injection (HCI) HD. See Hamming distance (HD) Hermetic, 50, 54, 90 Hermetic seal test, 90 HM. See Hardware metering (HM) Horizontal business model, 22, 28, 223, 225, 238 Hot carrier injection (HCI), 66, 158, 160, 167, 168, 178, 180, 248, 249 I IC piracy, 223, 228, 229, 238 Identification number, 38, 243, 244 Intellectual property (IP), 1, 4, 22, 25, piracy, 203, , 223, 238 reuse, 203, , 220, 223 Intellectual property rights (IPR), 4, 5, 25 K Key electrical parameters, Kurtosis, L Laser marking, 22 Lead dress, 58, 83 frame, 58, 60, 64, 83, 152 Leakage current, 68, 71, 102, 160, 218 Lifetime, 19, 29, 158, 176, 179, 230, 231, 244 Lot code, 20, 38, 50, 135, 244, M Manufacturability, 244, 258, 259, Manufacturing defects, 65, 69 71, 98, 99 testing, 101 tests, 23, 24, 101, 103, 167, 169, 192 Markings, 18, 38, 42 43, 45, 50 54, 60, 62, 63, 76, 79, 80, 83, 85 87, 135, 146, 177, 243, , 260 Mechanical defects, 43 63, 71 Microblasting, 19 Microprocessors, 10, 17, 18, 26, 96, 102, 183, 232 Misprediction, Moisture sensitive devices (MSD), 42 N Nanorods, 33, 177, 243, 256, 258, 259,, 262 NBTI. See Negative bias temperature instability (NBTI) NBTI-aware RO-CDIR, 177, , 199 NCDs. See Not-covered defects (NCDs) Negative bias temperature instability (NBTI), 66, 158, 167, 168, 178, 180, 248, 249 Not-covered defects (NCDs), 109, 117, 118, 120, 121, , 127, 130 O Obfuscation, 206, 215, 226, 236 One-class SVM, 157, , 172 One-time-programmable (OTP) memory, 176, , 195, , 237, 245 Original component manufacturer (OCM), 8 10, 12, 14, 18, 19, 22, 25, 26, 28, 30, 38, 40 42, 61, 62, 71, 75, 78, 101, 105, 106, 243, 252, 255, 260
4 268 Index Out-of-spec/defective, 58, 59, 67, 69, 70, 76, 90, 106, 114, 127, 223, 225, 227, 229 Overproduced, 22 23, 28, 31, 34, 37, 45, 46, 55, 59, 67 70, 76, 90, 105, 106, 113, 114, 116, 121, 126, 127, 130, , 227, 238, 260 Overproduction, 22, 23, 223, 227, 229, 236, 251, 260 Oxidation, 49, 63, 64, 76, 85 P Package ID, 177, 243, 244, mold, 55 Packaging, 22, 24, 28, 32, 38 42, 48, 50, 58, 69, 71, 78, 153, 227, 228, 244, 254, 260, 262 labels, Parametric defects, 65 69, 71, 99, 178 Parametric measurement unit (PMU), 99 Parasitic transistors, 69, 70 Part or identifying number (PIN), 20, 21, 42 Part orientation, 41 Passivation layer, 70, 256 Path delay, 157, , 175, 208, 246 fingerprinting, , 175 PCA. See Principle component analysis (PCA) Physical inspection, 76, 78 91, 103 Physically unclonable function (PUF), 158, 226, 231, 243, , , Physical tests, 31, 75 92, 95, 98, 103, , 157, 175 Piazzesi algorithm, 142 PIN. See Part or identifying number (PIN) Power-based watermarking, 208, Principle component analysis (PCA), 157, 165, Procedural defects, 38 43, 71 Process variations, 103, 105, 106, 160, 167, 170, 173, 176, 178, 179, 181, , 189, 247, 248 PUF. See Physically unclonable function (PUF) Q Quantitative metrics, 91, 153 R Recycled, 8, 19 22, 28, 29, 31, 33, 34, 37, 41, 45, 48, 50, 55, 57 59, 67 69, 71, 76, 88, 90, 99, 105, 106, 114, 116, 121, 126, 127, 130, , 175, , 183, , 198, 199, 260, 262 FPGA, , 172 Recycler, 19 Recycling process, 19, 20, 44, 48, 49, 54, 58, 62 65, 89, 90, 99, 189, 255 Reliability, 5, 9, 12, 15, 16, 18, 20, 23, 30, 95, 103, 104, 136, 150, 172, 189, 225, 226, 244, 248, , 258, 259, Remarked, 11, 21 22, 29, 31, 33, 41, 42, 45, 50, 51, 55, 60, 68, 69, 76, 79, 80, 90, 105, 106, 114, 116, 121, 126, 127, 130, 136, 144, , 199, 260 Resolution at a distance (Raad), 81, 149 Resurfacing, 20, 22, 54, 56, 80 81, 121, 133, 134, 255 Reverse engineering, 18, 25, 195, 205, 206, 215, 220, 225 Reworked, 16, 20, 45 46, 59, 63, 76, 82, 85, 86 Ring-oscillator-based CDIR (RO-CDIR), 33, , 195, 199 Ring oscillator PUF (RO-PUF), , 251, 252, RMS roughness, 145 RO-CDIR. See Ring-oscillator-based CDIR (RO-CDIR) RO-PUF. See Ring oscillator PUF (RO-PUF) S SAM. See Scanning acoustic microscopy (SAM) Sampling, 79, 83, 90 92, 167, 219, 258 Sanding, 19, 50, 52, 54, 56, 79, 80, 85, 92, 133, 143, 144, 146, 147, 152, 153 Scan-locking, , , Scanning acoustic microscopy (SAM), 78, 83 85, 91, 92, 136, 152 Scanning electron microscopy (SEM), 85 87, 91, 134, Secure split test (SST), 23, 33, 34, 177, 223, Signal AF-based CDIR (SAF-based CDIR), 189, Soft IPs, 27, 204, 205, 215 SRAM. See Static random access memory (SRAM) SST. See Secure split test (SST) Static assessment, 109, ,
5 Index 269 Static random access memory (SRAM), 101, 102, 249, 252, SRAM PUF, 246, 249, 252, Stereo-photogrammetry, 137 Supply chain, 5, 9, 12, 13, 15 19, 21, 23 29, 32 34, 38, 67, 69, 75, 111, 116, 117, 170, , , 229, 235, 238, 243, 244, 252, 254, 255,, 262 vulnerabilities, 27 29, Support vector machine (SVM), 157, , 172, 175 System integration, 29 T Tampered, 26, 27, 29, 33, 75, 105, 106, 114, 121, 126, 127, 193, 214, 220, 260 Target confidence (TC), 111, 112, 114, 117, 118, , 129 Temperature cycling, profile, 68, 71, 88, 89 Test cost, 31, 109, 114, 122, 125, 127 coverage, , 237 equipment, 96 97, 99, 105, 232 methods, 31, 37, 75, 90 92, 95, 99, 102, 103, metrics, 31, 72, 111, , 126, 130 time, 31, 32, 87, 91, 95, 98, 103, 105, 106, 114, 118, 120, , 127, 130, 157, 175, 230, 237 Texture variations, 133, 134, 145 Threshold, 66 68, 101, 158, 164, 165, 168, 178, 185, 211, 249, 258 Tier level (TL), , 114, , 123, 124, 127 Time-dependent dielectric breakdown (TDDB), 66, 67 Tooling marks, 46 48, 80 Traceability, 243, Transient current, 66, 68 True random number generator (TRNG), , Two phase detection, U Unclonability, 244, Under-covered defects (UCDs), 109, 112, 117, 118, 120, 121, , 127, 129 Uniqueness, 244, 250, 258, 259, Unpredictability, 250 Untrusted assembly, 28, 226, 233 Untrusted foundries, 9, 28, 238, 260 W Watermarking, 25, Working distance, 138, 139, 141, 143, 147, 149 Workload, 67, 68, 160, 162, 168, 169, 188 X X-ray fluorescence (XRF), 76, 87, 121, 136, 152 X-ray imaging, 76, 78, 81 84, 92, 135 X-ray microscopy, 133,
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