Reliability Audit Program Q 2013 Performance. Douglas Blackwood

Transcription

1 Q 2013 Performance Douglas Blackwood 1

2 Table of Contents 1. LOOKUP TABLES Table1: Acronyms Table2: Manufacturing Site Codes 2. DESCRIPTION OF STRESS TESTS 3. ANALOG AND SENSORS 4. AUTOMOTIVE MICROCONTROLLERS 5. CELLULAR PRODUCTS GROUP 6. DIGITAL NETWORKS 7. MICROCONTROLLERS 8. RADIO FREQUENCY 2

3 1. LOOKUP TABLES Table1: Acronyms AC DRB H3T H3TGB HAST HTB HTRB HTS PTHB SD SSOL THB THS TS Autoclave Data Retention Bake High Humidity High Temperature High Humidity High Temperature Gate Bias Highly Accelerated Stress Test High Temperature Bake High Temperature operating Life High temperature Reverse Bias High Temperature Stress Pressure Temperature Humidity Bias Solderability Steady State Operating Life Temperature Cycle Temperature Humidity Bias Temperature Humidity Storage Thermal Shock 3

4 Table2: Manufacturing Site Codes Site FSL-TJN-FM FSL-KLM-FM ATP2 ASECHUNG AITBATAM FSL-TLS-Fab FSL-EKB-Fab FSL-SND-Fab FSL-ATMC FSL-OHT-Fab FSL-TMP-Fab FSL-CHD-Fab TSMC3 TSMC4 UMCI UMC8E SEMIDI CSM CROLS2 Location Freescale Tianjin Final Manufacturing No.15, Xing Hua Avenue, Xiqing Economic Development Area, Tianjin , P.R.China Freescale Kuala Lumpur Final Manufacturing NO.2 Jalan SS 8/2, Free Industrial Zone, Sungai Way, Petaling Jaya, Selangor, Malaysia Amkor Technology Philippines 2 CORPORATE HEADQUARTERS, 1900 South Price Road, Chandler, AZ USA ASE GROUP Chung-Li 550,Chung-Hwa Road, Section 1, Chung-Li, 320, Taiwan, R.O.C Advanced Interconnect Technologies (Batam) Asia Regional Office, No. 1 Maritime Square, #09-80 Harbour Front Centre, Singapore Freescale Toulouse Fab 134 Avenue du General Eisenhower, BP 72329, Toulouse Cedex 1, France Freescale East Kilbride Fab Colvilles Road, East Kilbride, Glasgow, Scotland G75 0TG, UK Freescale Sendai Fab Ake-Dori, Izumi-Ku, Sendai-Shi , Japan Freescale Austin Technology and Manufacturing Centre 3501 Ed Bluestein Boulevard, Austin, Texas 78721, USA Freescale Oak Hill Fab 6501 William Cannon Drive West, Austin, Texas, 78735, USA Freescale Tempe Fab 2100 East Elliot Road, Tempe, Arizona 85284, USA Freescale Chandler Fab 1300 N Alma School Rd, Chandler AZ, 85224, USA Taiwan Semiconductor Manufacturing Company Limited Corporate Headquarters, No. 8, Li-Hsin Rd. VI, Hsinchu Science Park, Hsinchu, Taiwan , R. O. C. Taiwan Semiconductor Manufacturing Company Limited Corporate Headquarters, No. 8, Li-Hsin Rd. VI, Hsinchu Science Park, Hsinchu, Taiwan , R. O. C. United Microelectronics Corporation Singapore Worldwide Offices Headquarters, No. 3, Li-Hsin 2nd Road, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C. United Microelectronics Corporation Taiwan Worldwide Offices Headquarters, No. 3, Li-Hsin 2nd Road, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C. Semi-Dice Taiwan Chartered Semiconductor Manufacturing Ltd Corporate Office, 60 Woodlands Industrial Park, Street Two, Singapore Crolles2 Technology Alliance Freescale Semiconducteurs SAS Centre de Recherche Crolles 2, 870 Rue Jean Monnet, Crolles, France 4

5 2. DESCRIPTION OF STRESS TESTS Early Life Fail Rate (ELFR) - JESD22-A108 The purpose of this stress is to characterise the early failure rate portion of the bathtub curve. Devices used in this test are sampled directly after the standard production final test flow with no pre-screening. A dynamic electrical bias is applied to stimulate the device during the test in much the same way as below. High Temperature Operational Life Test ( or HTRB) - JESD22-A108 This test is performed to accelerate failure mechanisms that are thermally activated through the application of temperature and the use of biased operating conditions. The temperature and voltage will vary with the product being stressed. However, the typical stress ambient is 125 C with the bias applied equal to or greater than the data sheet nominal value. All devices used in the test are sampled directly after final electrical test with no prior burn-in or other pre-screening unless called out in the normal production flow. Testing is performed with dynamic signal applied to the device for a typical duration of 1008hrs. Reject quantities at the test temperature are modified by the Chi_squared distribution function at 60%/90% confidence levels. The failure rates are then calculated and derated to the required temperature using the Arrhenius equation with a 0.54 ev activation energy assumed as an average for the failure mechanisms. Further details are given in the next section 'Calculation of Failure Rates'. Write/Erase Cycling (W/E) - JESD22-A117 This test is used to evaluate the effect of repeated programming and erasing excursions on EEPROM and FLASH devices without corruption of data. It is carried out at 125 C for EEPROM and 125 C for FLASH to the number of specified cycles per device. Program and erase times are according to data book. High Temperature Storage and Data Retention (HTS/DR) - JESD22 - A103 Used to determine the effect on the devices of long-term storage at the maximum specified temperature, also the data retention characteristics of EPROM, EEPROM and FLASH devices. In the case of EEPROM and FLASH devices this follows Write/Erase Cycling. Temperature Cycling () - JESD22-A104 Temperature Cycling testing accelerates the effects of thermal expansion mismatch among the different components within a specific die and packaging system. During temperature cycling, devices are inserted into a cycling system and held at cold dwell temperature for the specified time. Following this cold dwell, the devices are transferred, mechanically, to the hot dwell chamber where they remain for the specified time. The system employs a circulating air environment to assure rapid stabilisation at the specified temperature. Thermal Shock (TS) - JESD22-A104 The objective of Thermal Shock is the same as for Temperature Cycling, however, thermal shock provides additional stress in the increased thermal conductivity of a liquid ambient. Temperature Humidity Bias (THB or H3TRB) - JESD22-A101 5

6 An environmental test performed at 85 C and a relative humidity of 85%To evaluate the resistance of the device to moisture-related failure mechanisms, such as corrosion. A static bias is applied in such a way as to maximise voltage potential gradients across the die while minimising device power dissipation. If moisture does penetrate the package and passivation, an electrolytic cell will be set up and corrosion will be rapid. Additionally, electricallyactivated failure mechanisms, i.e. dielectric breakdown can be encountered. Autoclave (AC) - JESD22-A102 A severe environmental (121 C, 100% Relative Humidity, 15psig) test to establish the integrity of the package and passivation in the presence of moisture and temperature. Pressure Temperature Humidity Stress (HAST) - JESD22-A110 This test is performed to accelerate the effects of moisture penetration with the dominant effect being corrosion. It detects similar failure mechanisms to THB but at a greatly accelerated rate. 6

7 3. Analog and Sensors 7

8 3. RESULTS SUMMARY BY PACKAGE ESOIC *11*2.3 P.65 HAST HAST ESOIC54 7.5*17.9*2.4* HAST LQFP 48 7*7*1.4P0.5 LQFP 80 14*14*1.4P0.65 MSL / 260 C MSL / 240 C LQFP *14*1.4P0.5 AC UHST AC MSL 2 / 245 C UHST LQFP *20*1.4P0.5 HAST UHST LQFP 48 7*7*1.4 P0.5 EP LQFP 64 EP 10*10*1.4P0.5 AC MSL / 260 C LQFP-EP 64 10*10*1.4 P

9 LQFP-EP128 14*20*1.4 P MAPBGA 139 7*7*0.7P UHST MAPBGA *12*0.8P MSL / 260 C UHST HTSL PQFN-EP 23 12*12*2.1 P.9 PRECON PQFN-EP 24 12*12*2.1 P.9 PRECON AC HAST MSL / 260 C PRECON PWR QFN 16 12*12*2.1P MSL / 235 C AC MSL 3 / 235 C MSL 3 / 245 C AC BAKE HTSL

10 PWR QFN 24 12*12*2.1P MSL / 260 C AC MSL 3 / 245 C AC HTSL PWR QFN 32 8SQ*2.1P0.8 AC HAST MSL 3 / 250 C MSL / 250 C PWR QFN 36 12SQ*2.1P0.8 AC PRECON MSL / 245 C PWR QFN 36 9*9*2.1P0.8 AC MSL / 260 C PWR-DI-FLG4.53 DIMPLE-LF AC MSL 3 / 245 C MSL / 245 C AC QFN 16 3*3*0.65 P MSL / 260 C

11 QFN 16 6*6*1.98 P1 HTSL UHST PRECON MSL / 260 C TH UHST N/A DROP 1 N/A UHST QFN 40EP 6SQ*1.0P0.5 AC MSL / 260 C QFN-EP 32 9SQ*2.3P0.65 QFN-EP 56 7SQ1.0P MSL / 260 C HTSL UHST QFN32EP 5SQ*1.0P MSL / 260 C

12 SOIC 16 SOIC 28W AC HAST MSL / 260 C SOIC ML MSL / 260 C SOIC ML 4.7EP AC HAST UHST MSL / 260 C SOIC ML 5.7EP SOIC ML 6.4EP UHST MSL / 260 C SOICN 8 3.9*4.9* UHST

13 4. PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE AMKOR K1 KOREA ASE CL TAIWAN ASE KR KOREA Package Precon Stress QFN 16 6*6*1.98 P1 MSL / 260 C PRECON TH Read Point Samples Qty Rej UHST HTSL UHST DROP UHST Package Precon Stress SOICN 8 3.9*4.9*1.75 LQFP-EP128 14*20*1.4 P.5 Package Precon Stress MAPBGA 139 7*7*0.7P0.5 0 N/A N/A Read Point Samples Qty Rej UHST Read Point Samples Qty Rej UHST

14 CARSEM MALAYSIA KLMFM STATSCHPPC CHINA TJNFM Package Precon Stress QFN-EP 32 9SQ*2.3P0.65 MSL / 260 C Read Point Samples Qty Rej HTSL Package Precon Stress LQFP *14*1.4P0.5 MSL 2 / 245 C UHST Read Point Samples Qty Rej AC UHST AC UHST LQFP 80 14*14*1.4P0.65 MSL / 240 C LQFP *20*1.4P0.5 Package Precon Stress SOIC 16 HAST UHST Read Point Samples Qty Rej AC HAST Package Precon Stress LQFP 48 7*7*1.4P Read Point Samples Qty Rej MSL / 260 C LQFP 64 EP 10*10*1.4P SOIC ML 4.7EP MSL / 260 C LQFP-EP 64 10*10*1.4 P AC HAST UHST

15 TJNFM Package Precon Stress PQFN-EP 24 12*12*2.1 P.9 MSL / 260 C Read Point Samples Qty Rej AC HAST PRECON PRECON SOIC 28W MSL / 260 C PWR QFN 24 12*12*2.1P0.9 MSL / 260 C MSL 3 / 245 C AC AC HTSL QFN 16 3*3*0.65 P0.5 MSL / 260 C SOIC ML 5.7EP PWR QFN 36 12SQ*2.1P0.8 MSL / 245 C PQFN-EP 23 12*12*2.1 P.9 LQFP 48 7*7*1.4 P0.5 EP MSL / 260 C PWR QFN 36 9*9*2.1P0.8 MSL / 260 C UHST AC PRECON PRECON AC AC

16 TJNFM Package Precon Stress QFN 40EP 6SQ*1.0P0.5 MSL / 260 C SOIC ML 6.4EP MSL / 260 C SOIC ML ESOIC *11*2.3 P.65 PWR QFN 32 8SQ*2.1P0.8 ESOIC54 7.5*17.9*2.4*.65 MSL / 260 C Read Point Samples Qty Rej AC MSL / 250 C MSL 3 / 250 C HAST HAST AC HAST HAST QFN-EP 56 7SQ1.0P QFN32EP 5SQ*1.0P0.5 MAPBGA *12*0.8P0.8 PWR QFN 16 12*12*2.1P0.9 MSL / 260 C MSL / 260 C MSL / 235 C UHST HTSL AC MSL 3 / 235 C MSL 3 / 245 C AC BAKE HTSL

17 TJNFM Package Precon Stress PWR-DI-FLG4.53 DIMPLE- LF MSL / 245 C MSL 3 / 245 C Read Point Samples Qty Rej AC AC

18 5. RESULTS SUMMARY BY STRESS TEST AC Techcode Device Read Point Samples Qty Rej % Rej MC33926PNBR C027TXXQ MM912F634CV1AER SC900727EKR SC900784EFR XTMS3NXS MC33888PNBR2 Precon MC10XS3412CPNAR MC10XS3535PNAR O060APTS MC15XS3400DPNAR MC35XS3400DPNAR SC33984CPNAR MC33580BAPNAR U065PTXD MC33874BPNAR MC33887PNBR MC33981BPNAR C027LTXT SC901522EPR C027TXXT SC111528BAF O080APTS SC33480BLPNAFR BAKE Techcode Device Read Point Samples Qty Rej % Rej O060APTS SC33984CPNAR U065PTXD SC33984CPNAR DROP Techcode Device Read Point Samples Qty Rej % Rej O150MWXS MMA6210KWR MMA1725WR2 1 N/A C027TXXT MMA2725JWR2 0 N/A MMA6210KWR SX1534WT HAST Techcode Device Read Point Samples Qty Rej % Rej MC33926PNBR SC07XS6517EK C027TXXQ SC111529AAF SC17XS6500EK SC900727EKR SC900784EFR MC10XS3425EKR SC07XS6517EK F045BXXS SC07XS6517EKR SC17XS6500EK SC17XS6500EKR O060APTS MC10XS3535PNAR

19 Techcode Device Read Point Samples Qty Rej % Rej MC10XS4200FKR MC33926PNBR MM912F634DV2APR C027TXXQ MM912G634CV2AP MM912H634CV1AER MMA6813KWR SC900784EFR E025FXXQ MPXY8500BZK016T F045BXXS MC06XS3517AFKR MC09XS3400AFKR MC10XS3412CPNAR O060APTS MC10XS3535PNAR MC15XS3400DPNAR SC33984CPNAR O150MWXS MMA6210KWR MC06XS4200FKR F045CXXS MC10XS4200FKR MC20XS4200FK MC20XS4200FKR MMA2725JWR MMA6210KWR2 C027TXXT SC111528BAF SX2532KWT O080APTS SC33480BLPNAFR HTSL Techcode Device Read Point Samples Qty Rej % Rej E025FXXQ MPXY8500BZK016T O060APTS MC15XS3400DPNAR SC33984CPNAR H013LHTQ SC900892VLR C027TXXT MMA5124WR

20 Techcode Device Read Point Samples Qty Rej % Rej MC33660EFR MC33926PNBR MCZ33812EK MCZ33904A5EKR MCZ33905BS5EKR MM912F634CV1AER MMA6813KWR C027TXXQ SC111529AAF SC900685AER SC900727EKR SC900771AAER SC900784EFR SC900790BAGR SC900815G7AER SC901524EPR Precon MC33888PNBR XTMS3NXS MC33981ABHFKR MC33981BHFKR MC33981BPNAR MC33982BPNA SC33874BHFKR MC06XS3517AFKR F045BXXS MC10XS3425EKR SC07XS6517EKR SC17XS6500EKR

21 Techcode Device Read Point Samples Qty Rej % Rej MC10XS3412CHFKR MC10XS3412JHFK MC10XS3435BHFKR MC10XS3435DHFKR MC10XS3535HFKR2 Precon MC10XS3535JHFKR MC10XS3535PNAR MC15XS3400CHFKR O060APTS MC15XS3400DHFKR MC15XS3400DPNAR MC33982CHFKR MC33984CHFKR MC33988CHFKR MC35XS3400DHFKR MC35XS3400DPNAR MC35XS3500HFKR SC33984CPNAR SC900740PNAR2 Precon MC33580BAPNAR MC33689DPEWR MC33797BPEWR MC33874BPNAR MC33887PNBR MC33889DPEGR MC33937APEKR U065PTXD MC33981BPNAR MC33984BPNA MCZ33689DEWR SC111525AFB SC900605PEGR SC900739TEKR SCZ900739TEKR O150MWXS MMA6210KWR H013LHTQ MC13892CJVKR SC900892VLR C027LTXT SC901522EPR

22 Techcode Device Read Point Samples Qty Rej % Rej Precon MMA2725JWR C027TXXT MMA6210KWR SC111528BAF SX2532KWT SC33480BLJHFKR Precon O080APTS SC33480BLPNAFR SC33481BLFHFKR SC33580BAHFKR MC34704AEP C027LTXQ SC34933EPR TH Techcode Device Read Point Samples Qty Rej % Rej Precon C027TXXT MMA2725JWR UHST Techcode Device Read Point Samples Qty Rej % Rej MC33660EFR MCZ33904A5EKR C027TXXQ MCZ33905BS5EKR MMA6813KWR SC111529AAF SX2531WT E025FXXQ MPXY8500BZK016T MC33879TEKR U065PTXD SC900739TEKR SCZ900739TEKR O150MWXS MMA6210KWR H013LHTQ MC13892CJVKR SC900892VLR MMA2725JWR2 Precon MMA5112KWR C027TXXT MMA5124WR MMA6210KWR SC111528BAF SX2531WT SX2532KWT

23 6. RESULTS SUMMARY BY FABRICATION FACILITY ATMC HTSL H013LHTQ UHST

24 CHDFAB AC HAST C027TXXQ UHST U065PTXD AC C027LTXT AC N/A DROP 1 N/A HTSL C027TXXT PRECON TH UHST C027LTXQ

25 OHTFAB XTMS3NXS HAST F045BXXS PRECON O060APTS U065PTXD DROP O150MWXS UHST HTSL H013LHTQ UHST F045CXXS O080APTS C027LTXQ

26 TLSFAB AC PRECON XTMS3NXS AC BAKE HAST O060APTS HTSL AC U065PTXD BAKE AC O080APTS PRECON TSMC FAB U065PTXD UHST TSMC FAB E025FXXQ HTSL UHST

27 7. RESULTS SUMMARY BY DEVICE TYPE MC06XS3517AFKR2 MC06XS4200FKR2 MC09XS3400AFKR2 MC10XS3412CHFKR2 F045BXXS F045CXXS F045BXXS O060APTS MC10XS3412CPNAR2 MC10XS3412JHFK O060APTS AC O060APTS MC10XS3425EKR2 MC10XS3435BHFKR2 MC10XS3435DHFKR2 F045BXXS HAST O060APTS O060APTS MC10XS3535HFKR2 MC10XS3535JHFKR2 O060APTS PRECON O060APTS

28 AC MC10XS3535PNAR2 HAST O060APTS MC10XS4200FKR2 C027TXXQ F045CXXS MC13892CJVKR2 MC15XS3400CHFKR2 MC15XS3400DHFKR2 H013LHTQ UHST O060APTS O060APTS MC15XS3400DPNAR2 MC20XS4200FK MC20XS4200FKR2 AC O060APTS HTSL F045CXXS F045CXXS MC33580BAPNAR2 AC U065PTXD MC33660EFR2 MC33689DPEWR2 MC33797BPEWR2 C027TXXQ UHST U065PTXD U065PTXD

29 MC33874BPNAR2 MC33879TEKR2 U065PTXD AC U065PTXD UHST MC33887PNBR2 AC U065PTXD MC33888PNBR2 MC33889DPEGR2 AC PRECON XTMS3NXS U065PTXD MC33926PNBR2 MC33937APEKR2 MC33981ABHFKR2 MC33981BHFKR2 AC HAST C027TXXQ U065PTXD XTMS3NXS XTMS3NXS MC33981BPNAR2 MC33982BPNA XTMS3NXS U065PTXD AC XTMS3NXS

30 MC33982CHFKR2 MC33984BPNA MC33984CHFKR2 MC33988CHFKR2 MC34704AEP MC35XS3400DHFKR2 O060APTS U065PTXD O060APTS O060APTS C027LTXQ O060APTS MC35XS3400DPNAR2 MC35XS3500HFKR2 MCZ33689DEWR2 MCZ33812EK O060APTS AC O060APTS U065PTXD C027TXXQ MCZ33904A5EKR C027TXXQ UHST MCZ33905BS5EKR C027TXXQ UHST MM912F634CV1AER2 MM912F634DV2APR2 C027TXXQ AC C027TXXQ

31 MM912G634CV2AP C027TXXQ MM912H634CV1AER2 MMA1725WR2 C027TXXQ C027TXXT DROP 1 N/A MMA2725JWR2 DROP 0 N/A C027TXXT PRECON TH UHST MMA5112KWR C027TXXT UHST MMA5124WR HTSL C027TXXT UHST

32 DROP O150MWXS MMA6210KWR2 UHST DROP C027TXXT UHST MMA6813KWR C027TXXQ UHST MPXY8500BZK016T E025FXXQ HTSL UHST SC07XS6517EK C027TXXQ HAST F045BXXS HAST SC07XS6517EKR2 SC111525AFB317 F045BXXS HAST U065PTXD SC111528BAF AC C027TXXT UHST

33 SC111529AAF HAST C027TXXQ UHST SC17XS6500EK C027TXXQ HAST F045BXXS HAST SC17XS6500EKR2 SC33480BLJHFKR2 F045BXXS HAST O080APTS SC33480BLPNAFR2 SC33481BLFHFKR2 SC33580BAHFKR2 SC33874BHFKR2 AC O080APTS PRECON O080APTS O080APTS XTMS3NXS SC33984CPNAR2 AC BAKE O060APTS HTSL U065PTXD BAKE SC34933EPR C027LTXQ

34 SC900605PEGR2 U065PTXD SC900685AER C027TXXQ SC900727EKR2 AC C027TXXQ HAST SC900739TEKR U065PTXD UHST SC900740PNAR2 SC900771AAER2 O060APTS PRECON C027TXXQ SC900784EFR2 SC900790BAGR2 SC900815G7AER2 AC HAST C027TXXQ C027TXXQ C027TXXQ SC900892VLR2 HTSL H013LHTQ UHST

35 AC SC901522EPR2 C027LTXT SC901524EPR C027TXXQ SCZ900739TEKR2 SX1534WT U065PTXD UHST C027TXXT DROP SX2531WT1 C027TXXQ UHST C027TXXT UHST SX2532KWT C027TXXT UHST

36 4. Automotive Microcontrollers 36

37 3. RESULTS SUMMARY BY PACKAGE 64LQFP10*10* P C90 LQFP 32 7*7*1.4P LQFP 44 10*10*1.4P0.8 AC LQFP 48 7*7*1.4P0.5 AC PRECON PRECON LQFP 52 10*10*1.4P MSL / 260 C LQFP 64 10*10*1.4P0.5 LQFP SQ1.4P0.5 C UHST AC HAST AC DRB HTSL PRECON

38 MAPBGA *17*0.8P1.0 AC HTSL PBGAPGE SQ1.25P1.0 QFN 48 EP 7SQ*1.0P MSL / 260 C SOIC 16W AC MSL / 260 C TSSOP *6.5*1.P.65 TSSOP *5*1.0P AC AC MSL / 260 C PRECON TSSOP *9.7*0.9P.65 AC PRECON MSL / 260 C

39 4. PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE AMKOR P1 PHILIPPINES ASE CL TAIWAN Package Precon Stress TSSOP *5*1.0P0.65 TSSOP *9.7*0.9P.65 MSL / 260 C Read Point Samples Qty Rej AC AC PRECON TSSOP *6.5*1.P.65 Package Precon Stress MAPBGA *17*0.8P1.0 LQFP 44 10*10*1.4P Read Point Samples Qty Rej AC HTSL AC

40 KLMFM Package Precon Stress LQFP SQ1.4P0.5 C90 PBGAPGE SQ1.25P1.0 Read Point Samples Qty Rej AC HAST AC DRB HTSL PRECON

41 TJNFM Package Precon Stress LQFP 52 10*10*1.4P0.65 MSL / 260 C Read Point Samples Qty Rej LQFP 32 7*7*1.4P SOIC 16W LQFP 48 7*7*1.4P0.5 TSSOP *5*1.0P0.65 MSL / 260 C MSL / 260 C LQFP 64 10*10*1.4P0.5 MAPBGA *17*0.8P AC AC PRECON PRECON AC PRECON AC UHST HTSL QFN 48 EP 7SQ*1.0P0.5 MSL / 260 C LQFP10*10* P C

42 5. RESULTS SUMMARY BY STRESS TEST AC Techcode Device Read Point Samples Qty Rej % Rej SC667051MLL H009FXXQ Precon SPC5604BF2MLL E025FXXQ SC667149CFGER S908GZ60H0CFAER Precon S908QC16E0MDTER U050FXXD S908QY4E0MDTER S908QY4H0MDTER SC100690VDRER SC667218VDWE H009FHXQ SC667051MLL H013FHL6 SC560004MVF92R SC560006MMG92R DRB Techcode Device Read Point Samples Qty Rej % Rej Precon H009FXXQ SPC5604BF2MLL HAST Techcode Device Read Point Samples Qty Rej % Rej H009FXXQ SC667051MLL H009FHXQ SC667051MLL Techcode Device Read Point Samples Qty Rej % Rej SC667051MLL Precon SPC5603PEF1MLL6 H009FXXQ SPC5604BF2MLL6 Precon E025FXXQ S9S08SC4E0MTGR I150XXXS SC551899MDWE Precon S908GZ60H0CFAER U050FXXD SC100690VDRER H009FHXQ SC667051MLL U050ARXD SC516726MDTER H013FHL6 SPC5565MVZ U065JXXD SC528588VPBE E018AFHY S9S12GN32F0MLF

43 HTSL Techcode Device Read Point Samples Qty Rej % Rej Precon SPC5603PEF1MLL6 H009FXXQ SPC5604BF2MLL SC560004MVF92R H013FHL6 SC560006MMG92R UHST Techcode Device Read Point Samples Qty Rej % Rej E018AFHY S9S12GA192F0MLHR

44 Techcode Device Read Point Samples Qty Rej % Rej SC667051MLL H009FXXQ Precon SPC5604BF2MLL S9S08SC4E0MTGR S9S08SG16E1MTG S9S08SG16E1VTJR E025FXXQ SC667052VFTR SC667149CFGER SP117018MTGR I150XXXS SC551899MDWE S908GZ60H0CFAER Precon S908GZ60H0CFJE S908QB8E0MDTER S908QC16E0MDTER Precon U050FXXD S908QY4E0MDTER S908QY4H0MDTER Precon SC100690VDRER SC667218VDWE H009FHXQ SC667051MLL SC560004MVF92R H013FHL6 SC560006MMG92R Precon SPC5565MVZ H009FXX6 SPC5604EEF1MLHR U065JXXD SC528588VPBE S9S12GA192F0MLHR S9S12GN32F0MLF E018AFHY S9S12GN32F0VLFR

45 6. RESULTS SUMMARY BY FABRICATION FACILITY ATMC DRB HAST HTSL PRECON AC H009FHXQ HAST AC H013FHL6 HTSL PRECON H009FXX E018AFHY UHST

46 CHDFAB I150XXXS AC U050FXXD U050ARXD U065JXXD OHTFAB AC U050FXXD PRECON SNDFAB AC U050FXXD PRECON TSMC FAB2 AC U050FXXD PRECON

47 7. RESULTS SUMMARY BY DEVICE TYPE S908GZ60H0CFAER S908GZ60H0CFJE S908QB8E0MDTER AC U050FXXD PRECON U050FXXD U050FXXD S908QC16E0MDTER AC U050FXXD PRECON S908QY4E0MDTER AC U050FXXD S908QY4H0MDTER AC U050FXXD S9S08SC4E0MTGR E025FXXQ S9S08SG16E1MTG E025FXXQ S9S08SG16E1VTJR E025FXXQ

48 S9S12GA192F0MLHR E018AFHY UHST S9S12GN32F0MLF E018AFHY S9S12GN32F0VLFR E018AFHY SC100690VDRER AC U050FXXD PRECON SC516726MDTER U050ARXD SC528588VPBE U065JXXD SC551899MDWE I150XXXS SC560004MVF92R2 AC H013FHL6 HTSL

49 AC SC560006MMG92R HTSL H013FHL6 PRECON SC667051MLL SC667052VFTR AC H009FXXQ HAST AC H009FHXQ HAST E025FXXQ SC667149CFGER AC E025FXXQ SC667218VDWE AC U050FXXD SP117018MTGR E025FXXQ SPC5565MVZ H013FHL SPC5603PEF1MLL HTSL H009FXXQ PRECON

50 SPC5604BF2MLL6 AC DRB HTSL H009FXXQ PRECON SPC5604EEF1MLHR H009FXX

51 5. Cellular Products Groups 51

52 3. RESULTS SUMMARY BY PACKAGE LQFP *14*1.4P0.5 MABGAPGE SQ0.7P0.4 AC

53 4. PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE KLMFM TJNFM Package Precon Stress LQFP *14*1.4P0.5 Package Precon Stress MABGAPGE SQ0.7P0.4 Read Point Samples Qty Rej AC Read Point Samples Qty Rej

54 5. RESULTS SUMMARY BY STRESS TEST AC Techcode Device Read Point Samples Qty Rej % Rej I100XXXS MC68HC11FL0AFR Techcode Device Read Point Samples Qty Rej % Rej I100XXXS MC68HC11FL0AFR Techcode Device Read Point Samples Qty Rej % Rej I100XXXS MC68HC11FL0AFR H006HLX7 SC29262VKR

55 6. RESULTS SUMMARY BY FABRICATION FACILITY CHDFAB AC I100XXXS SNDFAB AC I100XXXS TSMC FAB 14 H006HLX

56 7. RESULTS SUMMARY BY DEVICE TYPE MC68HC11FL0AFR2 SC29262VKR2 AC I100XXXS H006HLX

57 6. Digital Networks 57

58 3. RESULTS SUMMARY BY PACKAGE FCCBGA SQ*1.2P FCCBGA SQ*3.2P1.27 PRECON UHST FCPBGA SQ3.55P1 PRECON UHST FCPBGA SQ*3.7P PRECON FCPBGA SQ*3.9P1.0 PRECON UHST FCPBGA SQ3.55P HTSL PRECON FTBGA *37*1.7P1.27 MSL 4 / 245 C MSL 4 / ---- TH HTSL PRECON TH MABGA-FW SQ0.8P MSL / 260 C PRECON

59 PBGA *23*1.22P PBGA *25*1.2P1.27 PRECON PBGA *29*1.2P1.0 PRECON PBGA-FW SQ1.2P HTSL PRECON UHST PBGA-PGE SQ1.2P1.0 TBGA SQ*1.7P1.27 HTSL PRECON UHST TBGA *35*1.5P1.0 PRECON UHST PRECON TBGA *37.5*1.69P HTSL PRECON TEPBGA SQ

60 TEPBGA PGE *27 P HTSL PRECON UHST

61 4. PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE ASE KH TAIWAN EFM AMKOR TAIWAN FMG Package Precon Stress FCPBGA SQ*3.7P1.0 Package Precon Stress FCPBGA SQ3.55P1 Read Point 1008 Samples Qty Rej PRECON Read Point Samples Qty Rej PRECON UHST IBM CANADA IBM TURN KEY Package Precon Stress FCPBGA SQ3.55P1.0 HTSL Package Precon Stress FCPBGA SQ3.55P1.0 Read Point Samples Qty Rej PRECON HTSL Read Point Samples Qty Rej PRECON KLMFM Package Precon Stress FCPBGA SQ*3.9P1.0 Read Point Samples Qty Rej PRECON UHST TBGA SQ*1.7P TBGA *35*1.5P1.0 PRECON UHST PRECON

62 KLMFM Package Precon Stress TEPBGA SQ TBGA *37.5*1.69P1 FCCBGA SQ*3.2P1.27 PBGA *25*1.2P1.27 PBGA *29*1.2P1.0 PBGA-FW SQ1.2P1.27 FCPBGA SQ*3.7P1.0 TEPBGA PGE *27 P1 FCCBGA SQ*1.2P1.0 Read Point Samples Qty Rej HTSL PRECON PRECON UHST PRECON PRECON HTSL PRECON UHST PRECON HTSL PRECON UHST

63 KLMFM TJNFM Package Precon Stress FTBGA *37*1.7P1.27 MSL 4 / ---- MSL 4 / 245 C TH HTSL PRECON PBGA *23*1.22P1.27 PBGA-PGE SQ1.2P1.0 TH HTSL PRECON Package Precon Stress MABGA-FW SQ0.8P1.0 MSL / 260 C Read Point 1008 Samples Qty Rej UHST Read Point Samples Qty Rej PRECON

64 5. RESULTS SUMMARY BY STRESS TEST Techcode Device Read Point Samples Qty Rej % Rej H009HQW7 MPC8548EVTAUJC MPC8569EVTAUNLB MSC8156SVTB H004HQWA P1023SSE5CFB H013HQX6 MPC8360EVVAJDGA H030XXX5 XPC8260CZUIFBC H023HQX5 MPC8241LZQ200D C032XXXT MPC850DSLCZQ50BU C016HXXT MPC852TVR100A H009HXX7 MPC8321VRAFDC HTSL Techcode Device Read Point Samples Qty Rej % Rej H004HQWA MPC8569EVTAUNLB MSC8156SVTB H013HQX6 MPC8358EZQAGDDA MPC8360EVVAJDGA H013HXX6 MPC8270ZUUPEA C016HXXT MPC885VR H009HXX7 MPC8321EVRADDC MPC8321VRAFDC

65 Techcode Device Read Point Samples Qty Rej % Rej H013HLX6 MCS52MTVMC H009HQW9 MC8641DVU1500KE H013HQX7 MPC8541EPXAPF Precon H009HQW7 MPC8548EVTAUJC Precon MPC8569EVTAUNLB Precon H004HQWA Precon MSC8156SVTB P1023SSE5CFB MPC8349EVVAJFB Precon H013HQX6 MPC8358EZQAGDDA Precon MPC8360EVVAJDGA Precon E013HLX5 MCS52MTVMC Precon Precon H013HXX6 MPC8270ZUUPEA C032XXXT MPC860SRCZQ50D4 Precon C016HXXT MPC885VR80 Precon H009HXX7 MPC8315VRAGDA Precon MPC8321EVRADDC Precon TH Techcode Device Read Point Samples Qty Rej % Rej Precon H013HXX6 MPC8270ZUUPEA

66 UHST Techcode Device Read Point Samples Qty Rej % Rej H013HQW9 MC7447ATHXNB Precon H013HQX7 MPC8540VT667LC Precon H004HQWA P5020NSE1TNB Precon H013HQX6 MPC8349EVVAJFB Precon MPC8358EZQAGDDA Precon C016HXXT MPC885VR H009HXX7 MPC8321EVRADDC Precon

67 6. RESULTS SUMMARY BY FABRICATION FACILITY ATMC H013HQW9 PRECON UHST PRECON H013HQX UHST H009HQW7 PRECON HTSL PRECON H013HQX UHST H030XXX HTSL PRECON H013HXX TH HTSL C016HXXT PRECON UHST CHDFAB H013HLX E013HLX

68 GF FAB7 SGP H009HQW HTSL H004HQWA PRECON UHST IBMFABFK H004HQWA HTSL PRECON OHTFAB H013HQX6 HTSL PRECON H030XXX H023HQX C032XXXT PRECON TSMC FAB HTSL H009HXX7 PRECON UHST TSMCFAB6 TAIWAN 8IN PRECON E013HLX

69 7. RESULTS SUMMARY BY DEVICE TYPE MC7447ATHXNB MC8641DVU1500KE H013HQW9 PRECON UHST H009HQW MCS52MTVMC MPC8241LZQ200D H013HLX E013HLX5 PRECON H023HQX MPC8270ZUUPEA HTSL PRECON H013HXX TH MPC8315VRAGDA PRECON H009HXX MPC8321EVRADDC HTSL PRECON H009HXX UHST MPC8321VRAFDC H009HXX7 HTSL

70 MPC8349EVVAJFB PRECON H013HQX UHST MPC8358EZQAGDDA HTSL PRECON H013HQX UHST MPC8360EVVAJDGA H013HQX6 HTSL PRECON MPC850DSLCZQ50BU MPC852TVR100A C032XXXT C016HXXT MPC8540VT667LC PRECON H013HQX7 UHST MPC8541EPXAPF PRECON H013HQX MPC8548EVTAUJC H009HQW7 PRECON

71 MPC8569EVTAUNLB HTSL H004HQWA PRECON MPC860SRCZQ50D4 PRECON C032XXXT MPC885VR80 HTSL C016HXXT PRECON UHST MSC8156SVTB H004HQWA HTSL PRECON P1023SSE5CFB H004HQWA P5020NSE1TNB XPC8260CZUIFBC H004HQWA PRECON UHST H030XXX

72 7. Microcontrollers 72

73 3. RESULTS SUMMARY BY PACKAGE LQFP 32 7*7*1.4P AC MSL / 260 C UHST HTSL LQFP 48 7*7*1.4P0.5 AC LQFP 64 10*10*1.4P0.5 HAST HTSL LQFP 80 14*14*1.4P0.65 HAST HTSL LQFP *20*1.4P HAST LQFP SQ1.4P0.5 C90 MABGAPGE SQ0.8P0.8 MSL / 260 C HAST UHST MAPBGA *13*1.7 P1 MAPBGA *17*1.7P1.0 MSL / 260 C HAST ELFR MSL / 260 C

74 MAPBGA *17*0.8P0.8 AC MSL / 260 C MAPBGA *17*0.8P UHST MAPBGA *19*.8P UHST MAPBGA *21*1.6 P UHST HTSL PDIP 20 PDIP 28 PDIP PLCC 52 PSDIP 42 QFN 40 6*6*0.75 P0.5 QFN MAP 24 4*4*1 P HTSL MSL / 260 C

75 QFP 64 14*14*2.2P0.8 HAST HAST MSL / 260 C AC HAST PRECON QFP44 10*10*2.0P MSL / 260 C SOIC 20W MSL / 260 C SOIC 28W TMAP *14*0.7P0.5 AC MSL / 260 C

76 4. PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE AMKOR P1 PHILIPPINES Package Precon Stress PDIP 20 Read Point Samples Qty Rej ASE CL TAIWAN Package Precon Stress LQFP 32 7*7*1.4P0.8 SOIC 20W MAPBGA *21*1.6 P.8 MSL / 260 C Read Point Samples Qty Rej UHST HTSL

77 KLMFM Package Precon Stress QFP 64 14*14*2.2P0.8 MSL / 260 C LQFP SQ1.4P0.5 C90 MSL / 260 C LQFP *20*1.4P0.65 LQFP 80 14*14*1.4P0.65 PLCC 52 Read Point Samples Qty Rej HAST AC HAST PRECON HAST HAST HAST HTSL HTSL NFME CHINA Package Precon Stress LQFP 64 10*10*1.4P0.5 HTSL Read Point Samples Qty Rej STATSCHPPC SINGAPORE Package Precon Stress Read Point Samples Qty Rej TMAP *14*0.7P TJNFM Package Precon Stress Read Point Samples Qty Rej 77

78 TJNFM Package Precon Stress LQFP 48 7*7*1.4P0.5 MAPBGA *17*0.8P0.8 SOIC 28W MAPBGA *17*0.8P0.8 MSL / 260 C Read Point Samples Qty Rej AC AC MSL / 260 C AC UHST PSDIP PDIP PDIP LQFP 32 7*7*1.4P0.8 QFP44 10*10*2.0P0.8 MSL / 260 C MSL / 260 C QFP 64 14*14*2.2P0.8 MSL / 260 C AC UHST HTSL HAST QFN MAP 24 4*4*1 P MAPBGA *13*1.7 P1 MSL / 260 C HAST ELFR QFN 40 6*6*0.75 P0.5 MSL / 260 C MAPBGA *17*1.7P1.0 MSL / 260 C

79 TJNFM Package Precon Stress LQFP 64 10*10*1.4P0.5 MABGAPGE SQ0.8P0.8 MAPBGA *19*.8P.8 Read Point Samples Qty Rej HAST HTSL UHST UHST

80 5. RESULTS SUMMARY BY STRESS TEST AC Techcode Device Read Point Samples Qty Rej % Rej E025FXXQ MC56F8006VWLR MC9S08AC8CFJE U050FXXD MC908AZ60ACFUER Precon H009FTN4 MKL05Z32VLF H013HXX6 MC9328MX21CVM ELFR Techcode Device Read Point Samples Qty Rej % Rej H009FTN4 MK60DN512ZVMD HAST Techcode Device Read Point Samples Qty Rej % Rej MC9S08AC128CLKE MC9S08AC60CFUE E025FXXQ MC9S08AC60CPUE MC9S08AW60CFUER MC9S08JM60CLH Precon MC908AZ60ACFUER U050FXXD MC912DG128CCPVE H009FTN4 MK60DN512ZVLQ MK60DN512ZVMD Techcode Device Read Point Samples Qty Rej % Rej U050FXXD MC908AZ60ACFUER Precon I120JXXS SC109953FNER I120EJXS MC68711E20CFNE

81 HTSL Techcode Device Read Point Samples Qty Rej % Rej MC9S08AC128CLKE MC9S08AC48CPUE E025FXXQ MC9S08AC60CPUE MC9S08AC8CFJE MC9S08JM60CLH SC116009ACLH EN40LXX7 MCIMX6S5DVM10AB I120EJXS MC68711E20CFNE Techcode Device Read Point Samples Qty Rej % Rej MC68HC705C9ACFBE MC705C8ACPE MC705C9ACPE MC705JJ7CDWER I120EXXS MC705JP7CPE MC705P6ACDWE MC705P6AMDWER MCHC705JJ7CPE SC667171MDWER

82 Techcode Device Read Point Samples Qty Rej % Rej MC9S08AC128CLKE MC9S08AC48CPUE MC9S08AC60CFUE MC9S08AC60CPUE MC9S08AC8CFJE E025FXXQ MC9S08AW60CFUER MC9S08GT32ACFBE MC9S08JM60CLH MC9S08MM128CLH SC667165CFJE SC9S08ER48CGT SCS8AC60RCFUER MC908AZ60ACFUER Precon MC908GP32CBE U050FXXD MC908GP32CFBE MC912DG128CCPVE SP124202CDWE MCIMX251AJM4A H009HLX6 MCIMX31DVKN5D MCIMX351AVM4BR SCIMX31LCVMF4CR MK60DN512ZVLQ H009FTN4 MK60DN512ZVMD MKL05Z32VFK MKL05Z32VLF H009FTN6 MK60FN1M0VLQ MK70FN1M0VMJ EN40LXX7 MCIMX6S5DVM10AB

83 Techcode Device Read Point Samples Qty Rej % Rej MC9S08PA32VLH E018AFX5 MC9S08PA60VLH MC9S08PT60VLH MC9S08PT60VQH H013HXX6 MC9328MX21CVM UHST Techcode Device Read Point Samples Qty Rej % Rej E025FXXQ MC9S08AC8CFJE MCIMX251AJM4A H009HLX6 MCIMX351AVM4BR SCIMX31LCVMF4CR EN40LXX7 MCIMX6S5DVM10AB H006HLX7 MCIMX514AJM6CR

84 6. RESULTS SUMMARY BY FABRICATION FACILITY ATMC E025FXXQ H013HXX6 AC CHDFAB I120EXXS AC HAST HTSL E025FXXQ UHST HAST U050FXXD I120JXXS I120EJXS HTSL GF FAB7 SGP AC H009FTN4 ELFR HAST H009FTN OHTFAB HAST U050FXXD SNDFAB I120EXXS U050FXXD

85 TSMC FAB H009HLX UHST H006HLX7 UHST TSMC FAB 14 HTSL EN40LXX UHST TSMC FAB2 AC HAST U050FXXD PRECON TSMC FAB3 E018AFX UMCI LTD, SINGAPORE H009HLX6 UHST

86 7. RESULTS SUMMARY BY DEVICE TYPE MC56F8006VWLR E025FXXQ AC MC68711E20CFNE I120EJXS HTSL MC68HC705C9ACFBE MC705C8ACPE MC705C9ACPE I120EXXS I120EXXS I120EXXS MC705JJ7CDWER MC705JP7CPE MC705P6ACDWE I120EXXS I120EXXS I120EXXS MC705P6AMDWER MC908AZ60ACFUER I120EXXS AC HAST U050FXXD PRECON

87 MC908GP32CBE U050FXXD MC908GP32CFBE U050FXXD MC912DG128CCPVE HAST U050FXXD MC9328MX21CVM AC H013HXX MC9S08AC128CLKE HAST HTSL E025FXXQ MC9S08AC48CPUE HTSL E025FXXQ MC9S08AC60CFUE MC9S08AC60CPUE HAST E025FXXQ HAST HTSL E025FXXQ MC9S08AC8CFJE AC HTSL E025FXXQ UHST