QUALIFICATION PLAN PCN#: CYER-23NMDN964. Date: Aug 2, Qualification of 4L SOT-143 at MMS (ATES) Assembly Site

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1 QUALIFICATION PLAN PCN#: CYER-23NMDN964 Date: Aug 2, 2010 Qualification of 4L SOT-143 at MMS (ATES) Assembly Site Distribution Surasit P. Rangsun K. Wanphen L. A. Navarro Wichai K. R. Sharma Chalermpon P. Microchip Technology ( Thailand ) Co.,Ltd. 14 Moo 1 T.Wangtakien A. Muangchacherngsao, Chacherngsao, Thailand,24000 Tel. (6638) , ext Fax (6638)

2 Purpose: Qualification of 4L SOT-143 at MMS (ATES) Assembly Site MP code: A7CF1YF7XA29 Part No.: TC1270A CCB No: 991 Package: Type 4L SOT-143 Die thickness: 8 mils Die size: 29.9 x 37.0 mils Lead frame: Paddle size: 0 x 39 mils Material ASM - A194 (Manufacture in China) Surface Ag spot plate Process Stamped Lead Lock No Part Number FI0111 Wire: Material Au Wire Manufacture Heraus (China) Die Attach Epoxy: Part Number Ablestik 84-1LMISR4 (Manufacture in China) Conductive Yes Mold Compound: Material Sumitomo G600FB (Manufacture in China) Reliability Test plan: See attached, STD Package Reliability Test plan on each package.

3 Test Name Conditions Reliability Stress Read Point Pre & Post Reliability Stress Test Temperature ( C) Standard Pb-free Standard SnPB Backward Wire Bond Pull - WBP Wire Bond Shear - WBS JESD22B-102E; Perform 8 hours of steam aging for Matte tin finish and 1 hour steam aging for NiPdAu finish prior to testing. Standard Pb-free: Matte tin/ NiPdAu finish, SAC solder, wetting temp 24 C for both SMD & through hole packages. JESD22B-102E; Perform 8 hour steam aging prior to testing. Standard SnPB: SnPb finish, SnPb solder, wetting temp 21 C for SMD & 24 C for through hole packages. JESD22B-102E; Perform 8 hour steam aging for Matte tin finish and 1 hr steam aging for NiPdAu finish prior to testing. Backward: Matte tin/ NiPdAu finish, SnPb solder, wetting temp 21 C for SMD >9% lead >9% lead >9% lead Standard Pb-free solderability is the requirement. SnPb solderability (backward solderability- SMD reflow soldering) is required for any plating related changes. Mil. Std fails after TC 30 bonds from a min. devices. CDF-AEC-Q bonds from a min. devices. Physical Dimensions Measure per JESD22 B100 and B Lead Integrity JESD22 B (No lead breakage or cracks) 10 leads from each of parts.

4 Test Name Conditions Reliability Stress Read Point Pre & Post Reliability Stress Test Temperature ( C) External Visual Mil. Std /2010 All devices prior to submission for qualification testing 0 3 ALL 0 HTSL (High Temp Storage Life) +17 C 00 hrs Spares should be properly identified. Preconditioning - Required for surface mount devices HAST +10 C Bake for 24 hours, moisture loading requirements per MSL level + 3X reflow at peak reflow temperature per Jedec-STD-020C for package type. Perform SAM analysis using the standard sample size. 260 C +130 C/8% RH for 96 hours. 1 lot to be test at hot temp 8 and 12 C. 96 hrs Spares should be properly identified. 77 parts from each lot to be used for HAST, Autoclave, Temp Cycle test Spares should be properly

5 Reliability Stress Read Point Pre & Post Reliability Stress Test Temperature ( C) Test Name Conditions Autoclave +121 C/1 psig for 96 hours. 96 hrs Spares should be properly Temp Cycle -6 C to +10 C. 3 gram force WBP on devices from 1 lot, test following Temp Cycle stress. 1 lot to be test at hot temp 8 and 12 C. 00 cycles Spares should be properly