The World Leader in High Performance Signal Processing Solutions. QMI2569 Conductive Ag Glass Adhesive Qualification Data
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1 The World Leader in High Performance Signal Processing Solutions QMI2569 Conductive Ag Glass Adhesive Qualification Data
2 QUALIFICATION TEST RESULTS The following tests have been completed on qualification vehicle s REF02 (8ld CD Aero), PM139 (14ld CD Aero), OP27 (10ld Cerpack Aero), AD708 (8ld CD Mil-Icom) and OP470 (14ld CD Mil-Icom) using QMI2569 die attach adhesive. A. IQA Functional Test Results of Raw Materials VISCOSITY RESULT Part name: QMI2569 Batch No.: Viscosity Result: Viscosity Requirements: 25,000 to 35,000 Jar#1 Result: 27,154 Passed Visual Jar#2 Result: 26, 458 Passed Visual
3 B. In-Line Monitors (Reference: Mil-Std 883G) Tests Performed Pre-seal Die Shear Test Wirepull Test Third Optical Inspection Torque Test Particle Impact Noise Detection (PIND) Test Sample Size 5 units per 2 units per 100% inspection 3 units per 100% PIND on Aero Devices 45 units per on Mil- Icom (No. of rejects/sample size) Passed (REF02 Aero : 0/5) Passed (PM139 Aero : 0/5) Passed (OP27 Aero : 0/5) Passed (AD708 Mil-Icom : 0/5) Passed (OP470 Mil-Icom: 0/5) Passed (REF02 Aero : 0/10) Passed (PM139 Aero : 0/10) Passed (OP27 Aero : 0/10) Passed (AD708 Mil-Icom: 0/9) Passed (OP470 Mil-Icom : 0/14) Passed (REF02 Aero: no die-attach material related defect) Passed (PM139 Aero : no die-attach material related defect) Passed (OP27 Aero : no die-attach material related defect) Passed (AD708 Mil-Icom: no die-attach material related defect) Passed (OP470 Mil-Icom : no die-attach material related defect) Passed (REF02 Aero : 0/3) Passed (PM139 Aero : 0/3) Passed (OP27 Aero : 0/3) Passed (AD708 Mil-Icom : 0/3) Passed (OP470 Mil-Icom : 0/3) Passed (REF02 Aero : 0/170) Passed (PM139 Aero : 0/166) Passed (OP27 Aero : 0/170) Passed (AD708 Mil-Icom: 0/45) Passed (OP470 Mil-Icom : 0/45)
4 B. In-Line Monitors (Reference: Mil-Std 883G) Tests Performed Radiographic Inspection Fine Leak Gross Leak Hot Solder Dip (HSD) Visual Inspection Solderability Test Sample Size 100% Inspection on Aero 5 units per Mil-Icom 100% per 100% per 100% Inspection on Aero Device 45 units per Mil-Icom 5 units per (No. of rejects/sample size) Passed (REF02 Aero : 1/170 not die attach related reject) Passed (PM139 Aero : 1/165 not die attach related reject) Passed (OP27 Aero : 1/170 not die attach related reject) Passed (AD708 : 0/5) Passed (OP470 : 0/5) Passed (REF02 Aero : 0 reject) Passed (PM139 Aero : 0 reject) Passed (OP27 Aero : 0 reject) Passed (AD708 : 0 reject) Passed (OP470 : 0 reject) Passed (REF02 Aero : 0 reject) Passed (PM139 Aero : 0 reject) Passed (OP27 Aero : 0 reject) Passed (AD708 : 0 reject) Passed (OP470 : 0 reject) Passed (REF02 Aero : 0 reject) Passed (PM139 Aero : 0 reject) Passed (OP27 Aero : 0 reject) Passed (AD708 : 0/45) Passed (OP470 : 0/45) Passed (REF02 Aero : 0/5) Passed (PM139 Aero : 0/5) Passed (OP27 Aero : 0/5) Passed (AD708 : 0/5) Passed (OP470 : 0/5)
5 B. In-Line Monitors (Reference: Mil-Std 883G) Tests Performed Electrical Test Residual Gas Analysis Sample Size 100% testing per 3 units per Aero 2 units per Mil-Icom (No. of rejects/sample size) Passed (REF02 Aero : obtained more than the minimum test yield requirement) Passed (PM139 Aero : obtained more than the minimum test yield requirement) Passed (OP27 Aero : rejects are product related and not attributed to the new die attach material) Passed (AD708 : higher than the control lot) Passed (OP470 : higher than the control lot) Passed (REF02 Aero : 0/3 reject) Passed (PM139 Aero : 0/3 reject) Passed (OP27 Aero : 0/3 reject) Passed (AD708 : 0/2 reject) Passed (OP470 : 0/2 reject)
6 C. Reliability Tests (Reference: Mil-Std 883G) Sub-group 3 Test Flow Conditions Pre-Electrical Test (25ºC) Thermal Shock (15 cycles minimum) Temp. Cycle (100 cycles) Moisture resistance Visual Exam Sample Size (No. of rejects/sample size)
7 C. Reliability Tests (Reference: Mil-Std 883G) Sub-group 3 Test Flow Conditions Electrical Test (25ºC) Fine Leak Gross Leak Sample Size (No. of rejects/sample size)
8 C. Reliability Tests (Reference: Mil-Std 883G) Sub-group 4 Test Flow Conditions Pre-Electrical Test (25ºC) Mechanical Shock (Method 2002 Condition B minimum) Vibration Variable Frequency (Method 2007 Condition A minimum) 100 cycles Centrifuge Fine Leak Sample Size (No. of rejects/sample size)
9 C. Reliability Tests (Reference: Mil-Std 883G) Sub-group 4 Test Flow Conditions Gross Leak Visual Exam Electrical Test (25ºC) Sample Size (No. of rejects/sample size)
10 D. Post-reliability Test Data: Tests Performed Residual Gas Analysis Post-seal Die Shear Test Sample Size 3 units per Aero 2 units per Mil-Icom 5 units per (No. of rejects/sample size) Passed (REF02 Aero : 0/3) Passed (PM139 Aero : 0/3) Passed (OP27 Aero : 0/3) Passed (AD708 : 0/2) Passed (OP470 : 0/2) Passed (REF02 Aero : 0/5) Passed (PM139 Aero : 0/5) Passed (OP27 Aero : 0/5) Passed (AD708 : 0/5) Passed (OP470 : 0/5)
11 The World Leader in High Performance Signal Processing Solutions QMI2569 CONDUCTIVE SILVER GLASS ADHESIVE TECHNICAL DATA
12 A. Material properties comparison between QMI2419 and QMI2569 Conductive silver adhesive material Material Properties Comparison Typical Properties QMI-2419 QMI-2569 Test Method Viscosity C, cp 27,000 35,800 TM 503 Thixotropic Index (1:20 rpm) TM 503 Percent Ag (By weight in fired film) TM 425 Metal to Glass Ratio (By weight in fired film) 4:1 4:1 TM 425 / TM 506 Average Tensile Adhesion, lbs f Si to Au plated 25 C > 80 (300 mil 2 ) > 100 (500 mil 2 ) TM 533 Package cavity headspace moisture Concentration as measured by Residual Gas Analysis (RGA) ppm < 1500 < 2000 MIL SPEC 5011 Extractable Ion Content, ppm TM 402 Na+, K+ < 20 ppm < 20 ppm Cl-, F - < 10 ppm < 10 ppm Glass Transition Temperature (Tg), C TM 433 Coefficient of Thermal Expansion (TMA) α1, ppm/ C TM 433 Volume Resistivity, microhm-cm < 15 < 15 TM 512 Thermal Conductivity, W/m K > 60 > 60 ASTM 1461 DMA 25 C, Gpa TM 458 DMA 25 C, psi 2,190,000 2,190,000 Shelf 25 C, months TM 589 Storage Temp 15ºC - 28ºC 15ºC - 28ºC NA Roller Requirement 1-4 rpm for 16 hrs 1-4 rpm for 16 hrs NA
13 C. Curing requirement comparison between QMI2419 and QMI2569 Conductive silver adhesive material QMI 2419 Temperature Typical Profile Requirement Temperature Ramp rates Time (ºC/min) (min) ºC ºC ºC > 320ºC not critical not critical Peak Temp 450ºC Dwell Time 6 min QMI 2569 Temperature Typical Profile Requirement Temperature Ramp rates Time (ºC/min) (min) ºC < 30 > ºC < 40 > ºC < 65 > 1.23 > 280ºC not critical not critical Peak Temp 440ºC Dwell Time 7 min
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