DS12C887, Batangas Bent Frame Assembly, Pb-Free. Maxim Integrated Products
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1 1/9/29 RELIABILITY REPORT FOR DS12C887, Batangas Bent Frame Assembly, Pb-Free Maxim Integrated Products 441 South Beltwood Parkway Dallas, TX Prepared by: Ken Wendel Director, Reliability Engineering Maxim Integrated Products 441 South Beltwood Pkwy. Dallas, TX ken.wendel@maxim-ic.com ph: fax: mbl:
2 Conclusion: The following qualification successfully meets the quality and reliability standards required of all Dallas Semiconductor products and processes: DS12C887, Batangas Bent Frame Assembly, Pb-Free In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. The current status of the reliability monitor program can be viewed at /dsreliability.html.* Module Description A description of this Module can be found in the product data sheet. You can find the product data sheet at Reliability Derating: A module device consists of one or more IC's in a single, upward integrated, package. This package is assembled to include batteries, crystals, and other piece parts that make up the configuration of the Module. Because of either the complexity of the package or the included piece parts, standard high temperature reliability testing is not possible. Therefore, in order to determine the reliability of module products, the reliability of each of the piece parts is individually determined, then summed to determine the reliability of the integrated module product. If there are "n" significant components in the module then: Fr (module) = Fr (1) + Fr (2) + Fr (3) Fr (n) Fr (module) = Failure rate of module Fr(n) = Failure rate of the nth component Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate is related to MTTF by: MTTF = 1/Fr NOTE: MTTF is frequently used interchangeably with MTBF. The calculated failure rate for this module/assembly is: Module Device: Module Units: Quantity: Fails: Ea: Beta: MTTF (Yrs): FITs: BR CRYSTAL DS12C Totals: The parameters used to calculate the module failure rate are as follows Cf: 6% Tu: 25 C Vu: 5.5 Volts
3 The reliability data follows. At the start of this data is the module assembly information. This is a description of the module. The next section is the detailed reliability data for each stress found in the qualification / monitor. If there are additional processes or assemblies used as part of this report, a description of each will follow which includes the respective reliability data for that process/ assembly. The reliability data section includes the latest data available. Some of this data may be generic with other packages or products. * Some proprietary products may be excepted from this requirement Assembly Information: Assembly Site: Batangas Assembly Pin Count: 24 Package Type: Module Bent Frame (Pb- Body Size: 72 Mold Compound: Amicon Lead Frame: Stamped Alloy 42 Lead Finsh: Sn Dip 1% Die Attach: 84-1 LMISR4 Epoxy Silverfilled Ablebond Bond Wire / Size: Au / 1.3 mil Flammability: UL 94-V Moisture Sensitivity NA (JEDEC J-STD2A) Date Code Range: 713 to MG3657-QUAL DS12CR VISUAL INSPECTION 713 X-RAY FLUORESCENCE 713 SOLDERABILITY (Sn/Pb) 713 SOLDERABILITY (Pb- 85/85, 5.5 VOLTS 1 HRS 77 WHISKERS < 5uM TO BE DONE BY F/A 12 JESD22-B12, COND C (215C) 6 JESD22-B12, COND C (245C) VISUAL INSPECTION 713 TEMP CYCLE, 5' RAMP, 713 1' DWELL VISUAL INSPECTION C 1 HRS 77 WHISKERS < 5uM 77-4 TO 85C 1 CYS 77 WHISKERS < 5uM 77
4 Assembly Information: Assembly Site: Batangas Assembly Pin Count: 24 Package Type: Module Bent Frame (Pb- Body Size: 72 Mold Compound: Amicon Lead Frame: Stamped Copper CDA194 Lead Finsh: Sn Dip 1% Die Attach: 84-1 LMISR4 Epoxy Silverfilled Ablebond Bond Wire / Size: Au / 1.3 mil Flammability: UL 94-V Moisture Sensitivity NA (JEDEC J-STD2A) Date Code Range: 914 to MG QUAL 914 VISUAL INSPECTION 914 SOLDERABILITY (Pb- 914 SOLDERABILITY (Sn/Pb) 914 X-RAY 914 PHYSICAL DIMENSIONS 914 MARK PERMANENCY 914 LEAD INTEGRITY /85, 5.5 VOLTS 1 HRS 77 WHISKERS < 5uM 3 JESD22-B12, COND C (245C) 3 JESD22-B12, COND C (245C) 3 MIL-STD : TOP & SIDE VIEW 6 JESD22-B1 6 JESD22-B17 6 JESD22-B15, COND B VISUAL INSPECTION 914 TEMP CYCLE, 5' RAMP, 914 1' DWELL VISUAL INSPECTION C 1 HRS 77 WHISKERS < 5uM 3-4 TO 85C 1 CYS 77 WHISKERS < 5uM MG QUAL 914 VISUAL INSPECTION /85, 5.5 VOLTS 1 HRS 75 WHISKERS < 5uM 3
5 SOLDERABILITY (Sn/Pb) 914 X-RAY 914 PHYSICAL DIMENSIONS 914 MARK PERMANENCY 914 LEAD INTEGRITY 914 JESD22-B12, COND C (245C) 3 MIL-STD : TOP & SIDE VIEW 6 JESD22-B1 6 JESD22-B17 6 JESD22-B15, COND B VISUAL INSPECTION 914 TEMP CYCLE, 5' RAMP, 914 1' DWELL VISUAL INSPECTION C 1 HRS 77 WHISKERS < 5uM 3-4 TO 85C 1 CYS 77 WHISKERS < 5uM MG QUAL 914 VISUAL INSPECTION 914 SOLDERABILITY (Pb- 914 SOLDERABILITY (Sn/Pb) 914 X-RAY 914 PHYSICAL DIMENSIONS 914 MARK PERMANENCY 914 LEAD INTEGRITY 914 X-RAY FLUORESCENCE /85, 5.5 VOLTS 1 HRS 7 WHISKERS < 5uM 3 JESD22-B12, COND C (245C) 3 JESD22-B12, COND C (245C) 3 MIL-STD : TOP & SIDE VIEW 6 JESD22-B1 6 JESD22-B17 6 JESD22-B15, COND B 6 TO BE DONE BY F/A VISUAL INSPECTION 914 TEMP CYCLE, 5' RAMP, 914 1' DWELL VISUAL INSPECTION C 1 HRS 77 WHISKERS < 5uM 3-4 TO 85C 1 CYS 77 WHISKERS < 5uM 3
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