AQHV Series 200W Discrete Unidirectional TVS Diode

Transcription

1 AQHV Series W Discrete Unidirectional TVS Diode RoHS Pb GREEN Description The AQHV series is designed to provide an option for very fast acting, high performance over-voltage protection devices. Ideally suited for power interfaces, passenger charging interfaces, and well as LED lighting modules, and low speed I/Os. It will protect sensitive equipment from damage due to electrostatic discharge (ESD) and other overvoltage transients. The AQHV series can safely absorb repetitive ESD strikes above the maximum level of the IEC -- international standard (Level, ±kv contact discharge) withouerformance degradation and safely conduct up to A (AQHV) of induced surge current (IEC --5 nd edition, t P =/μs) with very low clamping voltages. Pinout Features ESD, IEC --, ±3kV contact, ±3kV air EFT, IEC --, A (5/5ns) Lightning, A (/ as defined in IEC --5 nd edition) for AQHV Low clamping voltage PPAP capable Low leakage current Small SOD packaging helps save board space AEC-Q qualified Moisture Sensitivity Level(MSL -) Halogen free, lead free and RoHS compliant Functional Block Diagram Applications LED Lighting Modules Portable Instrumentation General Purpose I/O RS3 / RS5 CAN and LIN Bus Automotive application Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. Littelfuse, Inc. Revision: //

2 Absolute Maximum Ratings Symbol Parameter Value Units P pk Peak Pulse Power ( =/μs) W T OP Operating Temperature - to 5 C T STOR Storage Temperature -55 to 5 C Notes: CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. AQHV Electrical Characteristics (T OP =5ºC) Reverse Standoff Voltage WM μa. V =ma 3.3 V =V. μa Clamp Voltage V C =A, =/µs, Fwd 9. V =A, t P =/μs, Fwd 5. V Dynamic Resistance R DYN =ns, I/O to GND.37 Ω =/µs. A ESD Withstand Voltage V ESD IEC -- (Contact Discharge) ±3 kv IEC -- (Air Discharge) ±3 kv Diode Capacitance C D-GND Reverse Bias=V, f=mhz pf AQHV5 Electrical Characteristics (T OP =5ºC) Reverse Standoff Voltage WM μa 5. V =ma.7 V =5V. μa I Clamp Voltage PP =A, =/µs, Fwd. V V C =5A, =/µs, Fwd. V Dynamic Resistance R DYN =ns, I/O to GND. Ω =/µs 5. A ESD Withstand Voltage V ESD IEC -- (Contact Discharge) ±3 kv IEC -- (Air Discharge) ±3 kv Diode Capacitance C I/O-GND Reverse Bias=V, f=mhz pf Littelfuse, Inc. Revision: //

3 AQHV Electrical Characteristics (T OP =5ºC) Reverse Standoff Voltage WM μa. V =ma.7 V =V. μa I Clamp Voltage PP =A, =/µs, Fwd 3. V V C =3A, =/µs, Fwd 5. V Dynamic Resistance R DYN =ns, I/O to GND.5 Ω =/µs 3. A ESD Withstand Voltage V ESD IEC -- (Contact Discharge) ± kv IEC -- (Air Discharge) ±3 kv Diode Capacitance C I/O-GND Reverse Bias=V, f=mhz 3 pf AQHV3 Electrical Characteristics (T OP =5ºC) Reverse Standoff Voltage WM μa 3. V =ma. V =3V. μa I Clamp Voltage PP =A, =/µs, Fwd 5. V V C =A, =/µs, Fwd. V Dynamic Resistance R DYN =ns, I/O to GND. Ω =/µs. A ESD Withstand Voltage V ESD IEC -- (Contact Discharge) ±5 kv IEC -- (Air Discharge) ± kv Diode Capacitance C I/O-GND Reverse Bias=V, f=mhz 5 pf Note: Parameter is guaranteed by design and/or component characterization. Transmission Line Pulse (TLP) with ns width, ns rise time, and average window t=7ns to t= 9ns Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve Peak Pulse Power - Ppk (kw)... Pulse Duration - tp (µs) % of Rated Power Ambient Temperature - T A ( o C) Littelfuse, Inc. Revision: //

4 /μs Pulse Waveform AQHV Transmission Line Pulsing(TLP) Plot Percent of % % 9% % 7% % 5% % 3% % % % Time (μs) AQHV5 Transmission Line Pulsing(TLP) Plot AQHV Transmission Line Pulsing(TLP) Plot AQHV3 Transmission Line Pulsing(TLP) Plot Littelfuse, Inc. Revision: //

5 Temperature TVS Diode Arrays (SPA Diodes) Soldering Parameters Reflow Condition Pre Heat Pb Free assembly - Temperature Min (T s(min) ) 5 C - Temperature Max (T s(max) ) C - Time (min to max) (t s ) secs Average ramp up rate (Liquidus) Temp (T L ) to peak 3 C/second max T P T L T S(max) Preheat Ramp-up t P t L Critical Zone TL to TP Ramp-down T S(max) to T L - Ramp-up Rate 3 C/second max - Temperature (T L ) (Liquidus) 7 C Reflow - Temperature (t L ) 5 seconds Peak Temperature (T P ) +/-5 C T S(min) 5 t S time to peak temperature Time Time within 5 C of actual peak Temperature ( ) seconds Ramp-down Rate C/second max Time 5 C to peak Temperature (T P ) minutes Max. Do not exceed C Part Marking System Product Characteristics Lead Plating Pre-Plated Frame U * : AQHV : SPHV 5: AQHV5 : 5: AQHV SPHV5 : : AQHV3 SPHV : SPHV3 Lead Material Substrate material Body Material Copper Alloy Silicon Molded Compound UL Recognized compound meeting Flammability flammability rating V- Notes :. All dimensions are in millimeters. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. Part Numbering System Ordering Information TVS Diode Arrays (SPA Automotive Grade Diodes) Voltage Number of Channels AQHV ** E T G C Bidirectional G= Green T= Tape & Reel Package E: SOD Part Number Package Marking Min. Order Qty. AQHV-ETG U AQHV5-ETG U5 SOD AQHV-ETG U AQHV3-ETG U Littelfuse, Inc. Revision: //

6 Package Dimensions SOD Cathode by marking Package SOD Symbol JEDEC Millimeters MO-3 Inches Min Typ Max Min Typ Max A B C D E Recommended Soldering Pad Layout F Embossed Carrier Tape & Reel Specification Symbol Millimeters A.7+/-.5 B.+/-.5 C.5+/-.5 d.55+/-. E.75+/-.5 F 3.5+/-.5 P.+/-. P.+/-. P.+/-. W Feeding Direction Top mark and pin direction in Tape and Reel,Ref.,Ref. UX,Ref. mm TAPE AND REEL Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at Littelfuse, Inc. Revision: //