BZX84CxxxET1G Series, SZBZX84CxxxET3G. Zener Voltage Regulators. 225 mw SOT 23 Surface Mount

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1 BZX84CxxxETG Series, SZBZX84CxxxETG Series Zener Voltage Regulators 5 mw Surface Mount This series of Zener diodes is offered in the convenient, surface mount plastic package. These devices are designed to provide voltage regulation with minimum space requirement. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. Specification Features 5 mw Rating on FR 4 or FR 5 Board Zener Breakdown Voltage Range.4 V to 75 V Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications ESD Rating of Class (> 6 kv) per Human Body Model Peak Power 5 W (8 X 0 s) AEC Q Qualified and PPAP Capable SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements Pb Free Packages are Available* Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 60C for Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V 0 MAXIMUM RATINGS Rating Symbol Max Unit Peak Power 0 s (Note T L 5C Total Power Dissipation on FR 5 Board, (Note T A 5C Derated above 5C Thermal Resistance, Junction to Ambient Total Power Dissipation on Alumina Substrate, (Note T A 5C Derated above 5C Thermal Resistance, Junction to Ambient P pk 5 W P D R JA P D R JA Junction and Storage Temperature Range T J, T stg 65 to +50 mw mw/c C/W mw mw/c C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Nonrepetitive current pulse per Figure 9.. FR 5.0 X 0.75 X 0.6 in.. Alumina 0.4 X 0. X 0.04 in, 99.5% alumina. *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. C Cathode CASE 8 STYLE 8 MARKING DIAGRAM Anode ORDERING INFORMATION Device Package Shipping BZX84CxxxETG BZX84CxxxETG xxx M xxx Device Code M Date Code* Pb Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. SZBZX84CxxxETG SZBZX84CxxxETG,000 /,000 /,000 /,000 / For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD80/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page of this data sheet. Semiconductor Components Industries, LLC, 0 January, 0 Rev. 8 Publication Order Number: BZX84CV4ET/D

2 BZX84CxxxETG Series, SZBZX84CxxxETG Series ELECTRICAL CHARACTERISTICS (Pinout: -Anode, -No Connection, -Cathode) (T A 5C unless otherwise noted, V F 0.90 V I F ma) Symbol Parameter I F I V Z Reverse Zener I ZT I ZT Reverse Current Z ZT I R V R Maximum Zener I ZT Reverse Leakage V R Reverse Voltage V Z V R I R V F I ZT V I F Forward Current V F Forward I F V Z Maximum Temperature Coefficient of V Z C Max. V R 0 and f MHz Zener Voltage Regulator

3 BZX84CxxxETG Series, SZBZX84CxxxETG Series ELECTRICAL CHARACTERISTICS (Pinout: -Anode, -No Connection, -Cathode) (T A 5C unless otherwise noted, V F 0.90 V I F ma) Device* Device Marking V Z ZT 5mA (Note 4) Z ZT I ZT 5 ma V Z ZT ma (Note 4) Z ZT I ZT ma V Z ZT 0 ma (Note 4) Min Nom Max Min Max Min Max Z ZT I ZT 0 ma Max Reverse Leakage Current VZ I ZT 5 ma I R V R (V) Min Max BZX84CV4ETG BA BZX84CV7ETG BA BZX84CV0ETG BA BZX84CVETG BA BZX84CV6ETG BA BZX84CV9ETG BA BZX84C4VETG BA BZX84C4V7ETG BA BZX84C5VETG BB BZX84C5V6ETG BB BZX84C6VETG BB BZX84C6V8ETG BB BZX84C7V5ETG BB BZX84C8VETG BB BZX84C9VETG BB BZX84CETG BB BZX84CETG BB BZX84CETG BC BZX84CETG BC BZX84C5ETG BC BZX84C6ETG BC BZX84C8ETG BC BZX84C0ETG BC BZX84CETG BC BZX84C4ETG BC Device* Device Marking V ZT ma Z I ZT ma V ZT 0. ma Z I ZT4 0.5 ma V ZT ma Min Nom Max Min Max Min Max Z I ZT ma Max Reverse Leakage Current VZ I ZT ma I R V R (V) Min Max BZX84C7ETG BC BZX84C0ETG BD BZX84CETG BD BZX84C6ETG BD BZX84C9ETG BD BZX84C4ETG BK BZX84C47ETG BD BZX84C5ETG BD BZX84C56ETG BD BZX84C6ETG BD BZX84C68ETG BD BZX84C75ETG BE Zener voltage is measured with a pulse test current I Z at an ambient temperature of 5C * Include SZ-prefix devices where applicable. C V R 0 f MHz C V R 0 f MHz

4 BZX84CxxxETG Series, SZBZX84CxxxETG Series TYPICAL CHARACTERISTICS VZ, TEMPERATURE COEFFICIENT (mv/ C) TYPICAL T C VALUES V I ZT , TEMPERATURE COEFFICIENT (mv/ C) VZ 0 TYPICAL T C VALUES V I ZT 0 Figure. Temperature Coefficients (Temperature Range 55C to +50C) Figure. Temperature Coefficients (Temperature Range 55C to +50C) ZZT, DYNAMIC IMPEDANCE ( ) 00 0 I Z ma 5 ma 0 ma T J 55C I Z(AC) 0. I Z(DC) f khz IF, FORWARD CURRENT (ma) V (MMBZ567BLT) 9 V (MMBZ570BLT) 50C 75C 5C 0C V Z, NOMINAL ZENER VOLTAGE V F, FORWARD VOLTAGE (V).. Figure. Effect of Zener Voltage on Zener Impedance Figure 4. Typical Forward Voltage 4

5 BZX84CxxxETG Series, SZBZX84CxxxETG Series TYPICAL CHARACTERISTICS C, CAPACITANCE (pf) V BIAS V BIAS BIAS AT 50% OF V Z NOM T A 5C I R, LEAKAGE CURRENT ( A) C +5C C Figure 5. Typical Capacitance Figure 6. Typical Leakage Current I Z, ZENER CURRENT (ma) 0 0. T A 5C IZ, ZENER CURRENT (ma) 0 0. T A 5C V Z, ZENER VOLTAGE (V) V Z, ZENER VOLTAGE (V) Figure 7. Zener Voltage versus Zener Current (V Z Up to V) Figure 8. Zener Voltage versus Zener Current ( V to 9 V) % OF PEAK PULSE CURRENT t r t P PEAK VALUE I 8 s PULSE WIDTH (t P ) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY 8 s HALF VALUE I RSM 0 s t, TIME (s) Figure s Pulse Waveform 5

6 BZX84CxxxETG Series, SZBZX84CxxxETG Series PACKAGE DIMENSIONS (TO 6) CASE 8 08 ISSUE AP A E A D e b HE SEE VIEW C L L VIEW C c 0.5 NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 98.. CONTROLLING DIMENSION: INCH.. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A A b c D E e L L H E STYLE 8: PIN. ANODE. NO CONNECTION. CATHODE SOLDERING FOOTPRINT* SCALE : mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 56, Denver, Colorado 807 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative BZX84CV4ET/D