Rev.A0

Transcription

1 PRIMARY CHARACTERISTICS SMB(DO-214AA) PACKAGE P D V Z 3W 6.2V~200V T J,Max 150 Body Marking Example Marking : Please See Page 2~3 Ex : SMB3EZ5.6D5 Logo Date Code 3H6 VYM Cathode Band Marking Code FEATURES Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation For use in stabilizing and clipping circuits with high power rating Moisture Sensitivity Level 1 V:Product Lines Y:A.D. late code, EX : , M:Month, EX : 1-1,2-2,---10-O,11-N,12-D MECHANICAL DATA Case:Molded plastic,smb(do-214aa) Polarity:As Above Marked Terminals :Plated terminals, solderable per MIL-STD-750,Method 2026 Epoxy : UL94-V0 rated flame retardant MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 ambient temperature unless otherwise specified. Single phase half wave, 60Hz, resistive of inductive load. For capacitive load, derate current by 20% Parameter Symbol Value UNIT DC Power Dissipation at T L = 50 C (Note1) Maximum Forward Voltage at I F = 200 ma. Junction Temperature Range Storage Temperature Range Note: (1) TL = Lead temperature at 3/8 " (9.5mm) from body. P D 3.0 Watts V F 1.5 Volts T J - 55 to C T STG - 55 to C P 1

2 Part No. Nominal Zener Voltage Max. Zener Impedance Max Reverse Leakage Current V I ZT Z I ZT Z I ZK I V R Maximum DC Zener Current Nom. V Min. V Max. V Ω ma Ω ma μa V (ma) IZM Marking Code SMB3EZ D H5 SMB3EZ. D H6 SMB3EZ6.2D A0 SMB3EZ6.8D A1 SMB3EZ7.5D A2 SMB3EZ8.2D A3 SMB3EZ9.1D A4 SMB3EZ10D A5 SMB3EZ11D A6 SMB3EZ12D A7 SMB3EZ13D A8 SMB3EZ14D A9 SMB3EZ15D B0 SMB3EZ16D B1 SMB3EZ17D B2 SMB3EZ18D B3 SMB3EZ19D B4 SMB3EZ20D B5 SMB3EZ22D B6 SMB3EZ24D B7 SMB3EZ27D B8 SMB3EZ28D B9 SMB3EZ30D C0 SMB3EZ33D C1 SMB3EZ36D C2 SMB3EZ39D C3 SMB3EZ43D C4 SMB3EZ47D C5 SMB3EZ51D C6 SMB3EZ56D C7 SMB3EZ62D C8 SMB3EZ68D C9 SMB3EZ75D F0 SMB3EZ82D F1 SMB3EZ91D F2 Notes : (1) The type number listed have a standard tolerance on the nominal zener voltage of ± 5 %. (2) The revese surge current is a non-repetitive, 8.3ms pulse width square wave or equivalent sine-wave superimposed on I ZT per JEDEC Method. P 2

3 Part No. Max Reverse Nominal Zener Voltage Max. Zener Impedance Leakage Current V I ZT Z I ZT Z I ZK I V R Maximum DC Zener Current IZM Marking Code Nom. V Min. V Max. V Ω ma Ω ma μa V (ma) SMB3EZ100D F3 SMB3EZ110D F4 SMB3EZ120D F5 SMB3EZ130D F6 SMB3EZ140D F7 SMB3EZ150D F8 SMB3EZ160D F9 SMB3EZ170D G1 SMB3EZ180D G2 SMB3EZ190D G G4 Notes : (1) The type number listed have a standard tolerance on the nominal zener voltage of ± 5 %. (2) The revese surge current is a non-repetitive, 8.3ms pulse width square wave or equivalent sine-wave superimposed on I ZT per JEDEC Method. P 3

4 Maximum Power Dissipation,PD (Watt) 3.0 AMBIENAVERAGE FORWARD CURRENT, (A) Range Lead Temperature,TL ( ) Temperature Coefficient,ӨVz, (ma/ C) Zener Voltage, Vz, (Volts) ig. 1 - Power Temperature Derating Curv Fig. 2 - Temperature Coefficients v.s. Zener Voltage Junction to Lead Thermal Resistance, ӨJL, ( C/W) Lead Length to Heat Sink, L, (inches) Peak Surge Power, Ppk, (Watts) Pulse Width, PW, (ms) Fig. 3 - Typical Thermal Resistance v.s. Lead Length Fig. 4 - Maximum Surge Power Junction to Lead Triensient Thermal Resistance, ӨJL(t,D), ( C/W) D=0.5 D=0.2 D=0.1 D=0.05 D=0.02 D=0.01 D=0 1E E E E E Note: Below 0.1 second, Thermal response curve is applicable to any lead length (L) Single Pulse T JL =Θ JL (t)p PK Repetitive Pulse T JL =Θ JL (t,d)p PK Pulse Width, PW, (ms) Fig. 5 - Typical Thermal Response L, Lead Length=3/8inch P 4

5 Outline Drawing SMB(DO-214AA).191(4.85).160(4.06).086(2.20).075(1.91).115(3.94).130(3.30).012(0.30).096(2.44).006(0.15).083(2.13).060(1.52).029(0.75).008(0.20).001(0.02).220(5.59).199(5.05) Dimensions in inches and (millimeters) Rev.E P 5

6 Suggested Soldering Pad Layout SMB.071(1.80).090(2.30).098(2.50) Dimensions in inches and (millimeters) Rev A P 6

7 Reel Taping Sepecification - Surface Mount Device Reel Packing PACKAGE PER REEL REEL DIA BOX SIZE PER BOX CARTION PER CARTION GROSS WEIGHT EA (m/m) (m/m) EA (m/m) EA (Kg) SMA 5, *340*40 10, *360*350 80, SMB 3, *340*40 6, *360*350 48, SMC 3, *340*40 6, *360*350 48, P 7

8 Ordering Information: Device PN Packing Part Number T (1) G (2) WS Tape&Reel: 3 Kpcs/Reel Note: (1) Packing code, Tape & Reel Packing (2) RoHS product for packing code suffix G ;Halogen free product for packing code suffix H ***Disclaimer*** WILLAS reserves the right to make changes without notice to any product specification herein, to make corrections, modifications, enhancements or other changes. WILLAS or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Data sheet specifications and its information contained are intended to provide a product description only. "Typical" parameters which may be included on WILLAS data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. WILLAS does not assume any liability arising out of the application or use of any product or circuit. WILLAS products are not designed, intended or authorized for use in medical, life saving implant or other applications intended for life sustaining or other related applications where a failure or malfunction of component or circuitry may directly or indirectly cause injury or threaten a life without expressed written approval of WILLAS. Customers using or selling WILLAS components for use in such applications do so at their own risk and shall agree to fully indemnify WILLAS Inc and its subsidiaries harmless against all claims, damages and expenditures. P 8