Resistors Product Change Notification

Transcription

1 Resistors Product Change Notification PCN Number PCN-2016-RBU04 PCN Title PCN Date Type of Change Thickfilm Front End Product Line Re-location from Corpus Christi (USA) to Mexicali (Mexico) End of Life Notification Manufacturing Facility Change or Addition Datasheet Specification Change Other: Material Change Process Change Design Change Manufacturing Location(s) Affected TT electronics Corpus Christi, TT electronics Mexicali Date of Change Implementation January 2017 Products Affected Product Series Product Type(s) Datasheet Link LR (F) Series Low Value Flat Chip Resistor LRF3W Series Low Range 3 Watt SMT Chip Resistor HVC Series High Voltage Chip Resistors PWC Series Pulse Withstanding Chip Resistors LRZ Series High Current Jumper SCR Series High Power Chip Resistor All commercial LR(F) product All commercial LRF3W product All commercial HVC product All commercial PWC product All commercial LRZ product All commercial SCR product Description of Change Change Detail TT electronics is relocating the front end processes from our facility in Corpus Christi, USA to our facility in Mexicali, MX. This relocation is a continuation of the back end process relocation to TT electronics, Mexicali in Page 1 of 3

2 Reason for Change Implementation Plan Customer Impact The relocation helps mitigate rising production costs for the Thickfilm Product Line Series. TT electronics will build 3 months of safety stock through December 31, Dual site capability, dual site safety stock build, training and validation will be established in Mexicali prior to the Corpus disconnect date. Corpus will temporarily retain process capability for key processes throughout the move as risk mitigation. Dual site capability and dual site safety stock build in Mexicali and Corpus minimize risk for this transfer. On January 4, 2017, equipment will be disconnected and relocated to Mexicali. TT electronics will conduct product validation in Mexicali as per AEC - Q200 REV D specifications and requirements. TT electronics will notify customers via PCN-2016-RBU04. The 3 month safety stock, dual site capability, standardized training and integrated Program Management teams will prevent any supply chain disruptions to the customer. Recommendations NA Availability of Previously Manufactured Product NA Availability of Approval Samples Sales Contacts Upon formal request via normal ordering process. Americas: Mike Graham mike.graham@ttelectronics.com Asia: Janson Chuen janson.chuen@ttelectronics.com Europe (EMEA): Klaus Zwerschina klaus.zwerschina@ttelectronics.com Approval Name Title Date Issued by David Peters Product Line Manager Approved by Barry Peters VP R&D Approved by Klaus Zwerschina Global Sales Director Page 2 of 3

3 Additional Information TT electronics Welwyn, UK Commercial Thickfilm product is not affected by this relocation. All validation will be done as per AEC-Q200 REV D specifications and requirements. Page 3 of 3

4 Test Validation Plan Part Types: LRC, LRF, LRZ, PWC Original Site of Manufacture: 4222 S Staples St. Corpus Christi TX 78411, USA Current Site of Manufacture: Circulo de la Amistad #102 PIMSA IV Mexicali B.C México C.P Testing Site: TT Electronics 4222 S Staples St. Corpus Christi TX 78411, USA Test Plan Created By: Joe Alvirde

5 Purpose: The following test plan will be conducted in or to validate the transfer of manufacturing locations from Corpus Christi TX to Mexicali B.C México. Source of samples: Material from both respective sites will be tested in order to ensure both comparable functionality and reliability between the two sites. Test Test Specification Sample Size Part Size 1 High Temp Exposure (Storage) MIL STD 202 Method Temperature Cycling JESD22 Method JA Moisture Resistance MIL STD 202 Method Biased Humidity MIL STD 202 Method Operational Life MIL STD 202 Method External Visual MIL STD 883 Method Physical Dimension JESD22 Method JB Resistance to Solvents MIL STD 202 Method Resistance to Solder MIL STD 202 Method Thermal Shock MIL STD ESD AEC Q Electrical Characterization IRC 13 Board Flex AEC Q Terminal Strength AEC Q TCR MIL STD Solderability MIL STD

6 PCN RBU04 Product Line Transfer TT electronics Corpus, USA to TT electronics, Mexicali, MX 1. Project Description 2. Schedule 3. Safety Stock / Validation 4. High Level Process Flow 1 TT Electronics plc

7 Project Description PCN is the relocation of the front end Thickfilm processes from TT electronics IRC, Corpus Christi to TT electronics IRC, Mexicali. This relocation is a continuation of the back end Thickfilm process relocation to TT electronics IRC, Mexicali in 2015 as part of Phases 1 & 2. The project is in Execution phase and both sending and receiving sites are developing their schedule of deliverables and action items. The ultimate intended outcome of the project is to transfer Thickfilm (Product Line) to Mexicali with absolute minimum interruption to our customers within our timeline and on budget. Project has been initially announced in June of Sending and Receiving teams have been kicked off to deliver a quality transition. 2 TT Electronics plc

8 Schedule Safety Stock and Training of Engineers, Technicians, key personnel at the Sending Site (Corpus) will take place from July 2016 through December 2016 Disconnect & relocate equipment (pending review from PM Team, training status, safety stock status etc.) Q Facilitate and train personnel in Mexicali while burning safety stock Q1 & Q FAI / Product Validation / Process Verification Q1 & Q Start of Production - Q1 & Q TT Electronics plc

9 Safety Stock / Validation Safety Stock TT electronics will build 3 months of safety stock for this relocation Validation Product will be validated as per AEC Q200 Rev D. Process will be verified as per internal TT electronics criteria 4 TT Electronics plc

10 High Level Process Flow 5 TT Electronics plc