LAM Alliance A6 Exelan-HP

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1 LAM Alliance A6 Exelan-HP Tool ID LAM-EXELAN-MIA1 OEM/Model LAM Alliance A6 Exelan-HP Serial Number 8765 Process ETCH - OXIDE Vintage APRIL, 1999 Wafer Size 200 mm AG Semiconductor Services sales@agsemiconductor.com 1

2 1. System Platform, Wafer Size 6 inch 8 inches Platform, Wafer Transport Module Location, Position 2 PM2 Exelan Process Module Position 3 TM Blank-off Plate Position 4 PM3 Exelan Process Module Position 1 PMD Exelan Process Module Platform, Wafer Transport Module Location, Aux Pos 2 Cool-down Station TM Blank-Off Plate Gas Box Standard Gas Box Enhanced Gas Box II Gas Box, Primary Valve Options Standard Primary Valve Lock-out Tag-out Manual Valve Facility Power, System Power Distribution RPM, Stand., 208VAC, WYE RPM, Volt. Sag Enhanced RPM, Complete Sys Trans RPM, Main Sys Trans Only Customer Distributes Power Facility Power, System Power Distribution, TCU Breaker Size 30 amp TCU Breaker 40 amp TCU Breaker Facility Power, Interconnect Cable (Equipment Location), TM to RPM NO Cable found 50 ft 80ft Factory Interface Items, Fab Cleanroom Configuration Bulkhead Configuration Ballroom Configuration AG Semiconductor Services sales@agsemiconductor.com 2

3 Factory Interface Items, Material Interface, Loadlock Seal Lip Seal Bellows Seal Factory Interface Items, Material Interface, Loadlock Types Manual Door Auto Door Tilt Port Interface SMIF Port Interface Kakizaki SPI AGV Port Interface API Load Lock with ULPA Factory Interface Items, Material Interface, Loadlock Enhancements NA TM Diagnostic Ports Loadlock Vent Filters Factory Interface Items, Signal Tower Standard Signal Tower R-O-G Signal Tower R-G-O-B Signal Tower G-O-R Signal Tower Light Tower Removed System Options NA Service Side Light Tower 2m Light Tower base 2m ULPA Height Backing Pumps, TM Exhaust Manifolding Options TM Single Pump TM Dual Pump AG Semiconductor Services 3

4 Backing Pumps, Interconnect Cable (Equipment Location), TM Pump Cables No Cable Found TM to Pump, 50 ft TM to Pump, 80 ft TM to Pump, 30 ft Interconnect Cables, PM to Gas Box PM to Gas Box, 30 ft PM to Gas Box, 20 ft PM to Gas Box, 50 ft Interconnect Cables, PM to PM Peripherals, Pump No Cable found PM to Pump, 50 ft PM to Pump, 30 ft PM to Pump, 80 ft Interconnect Cables, PM to PM Peripherals, TCU PM to TCU, 50 ft PM to TCU, 30 ft PM to TCU, 70 ft Backing Pumps, TM Options No Pump found Customer Supplies Pumps QDP-40 for TM QDP-80 for TM AG Semiconductor Services 4

5 2. Process Module Configurables Chamber Configurables, Chamber Upper Ring OS DEF Upper Ring, 2 Piece SiC/Quartz Upper Ring, Quartz Quartz upper ring with SiC clamp ring to enhance confinement window and maintain low particle levels for different applications. Chamber Configurables, Edge Ring Options DEF OS Hot Edge Ring, Standard Hot Edge Ring, Beveled Silicon Hot Edge Ring with 15 degree Bevel. Silicon Hot Edge Ring with 60 degree Bevel. Used to increase edge etch rate relative to center. Recommended for applications etching 100% open area. Only available with Semi configurations. Chamber Configurables, O-rings Viton Kalrez Chamber Peripherals, Backing Pumps No backing pump set Customer-Supplied Backing Pump QDP-80 w/cntrlr, exhaust encl Chamber Peripherals, Backing Pump Power NA D PM Peripherals, Gas Line Options 8 Gas Configuration 10 Gas Configuration 12 Gas Configuration AG Semiconductor Services sales@agsemiconductor.com 5

6 PM Peripherals, Gas Line Options, Double Containment Std Gas Containment Double Containment Kit PM Peripherals, Gas Line Options, Heated Gas Lines No Heated Gas Lines Heated Gas Line, Pos 1 Heated Gas Line, Pos 2 Heated Gas Line, Pos 3 Heated Gas Line, Pos 4 PM Peripherals, Config MFC by Line. All the Same Line by Line PM Peripherals, Optional Gas Configuration Gas Line MFC Type Gas Type Flow (sccm) Line 1 Unit UFC CHF Line 2 He-O2 50 Line 3 CF4 100 Line 4 C4F8 25 Line 5 N2 100 Line 6 O2 20 Line 7 O Line 8 Ar 1000 PM Peripherals, Inlet Option Spooled Inlet Gas Panel Regulated Inlet Gas Panel PM Peripherals, TCU Plumbing Single Ch Serial TCU Plumbing Single Ch TCU/House Water AG Semiconductor Services sales@agsemiconductor.com 6

7 PM Peripherals, TCU Config No Chillers Customer-Suppld Single Ch TCU Customer-Suppld Dual Ch TCU TCU, Single Ch, FTS - Low Temp TCU, Single Channel FTS TCU, Single channel. PM Peripherals, TCU Peripherals No Service Box TCU Service Box PM Peripherals, TCU Hose Length NA TCU Hose Length 50ft 3. Gas System Gas Box, Mounting Location Conventional In the Floor Gas Box, GIB Options No GIB GIB Gas Box, Standard Stacking Kits No Gas Box Stacking Kit 1 PM Stacking Kit 2 PM Stacking Kit 3 PM Stacking Kit 4 PM Stacking Kit Delta Gas Box Stacking Kit AG Semiconductor Services sales@agsemiconductor.com 7

8 4. Transport Module Configurables TM Core, Wafer Handling Interface Moly/Kalrez End Effector Moly/Kalrez End Eff., 9600PTX Moly/SST End Effector Teflon/SST End Effector Teflon/Kalrez End Effector Thin Moly/SST End Effector Thin Teflon/Kalrez End Effect TM Peripherals, Software, System Control A1.7 AG Semiconductor Services 8

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TEL UNITY85DD EQUIPMENT DATASHEET

TEL UNITY85DD EQUIPMENT DATASHEET TEL UNITY85DD Tool ID RO77 OEM/Model TEL UNITY85DD Serial Number U00815 Process OXIDE ETCH Vintage NOVEMBER, 1997 Wafer Size 200 mm AG Semiconductor Services sales@agsemiconductor.com www.agsemiconductor.com