SMD High Frequency Inductors. Characteristics Electrical Q min 100 Hz. Q Typical 800 MHz H1N2S

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1 Type 3671 Series Key Features Frequency to 10GHz Four sizes available Supplied on tape Available via distribution Applications Cellular phones WLAN High Speed Communication Devices TE Connectivity is pleased to introduce this highly reliable and versatile range of ceramic chip inductors which will meet your high frequency design requirements. The 3671 chip inductors have a ceramic material construction that extends the effective frequency range to 10 GHz, and are available in four compact sizes Characteristics Electrical 0201 min Hz Typical SRF () Minimum 36711H1N0S H1N2S H1N5S H1N8S H2N2S H2N7S H3N3S H3N9S H4N7S H4N7S H5N6S S S / K

2 min Hz Typical SRF () Minimum 36711H6N8J H8N2J H10NJ H12NJ H15NJ H18NJ H22NJ H27NJ H33NJ H39NJ H47NJ J / K Characteristics Electrical E1N0S E1N1S E1N2S E1N3S E1N5S E1N6S E1N8S E2N0S E2N2S E2N4S 2.4 min Hz 8 Typical 43 SRF () Minimum E2N7S E3N0S E3N3S E3N6S E3N9S E4N3S E4N7S E5N1S E5N6S E6N2J E6N8J E8N2J E10NJ E12NJ E15NJ E18NJ E22NJ S J

3 36711E27NJ 27 min Hz Typical 36711E56NJ SRF () Minimum E33NJ E39NJ E47NJ E68NJ E82NJ J 36711ER10J ER12J Characteristics Electrical 0603 * at 50 min Hz * at 50 Typic al 36711J1N2S J1N5S J1N8S J2N2S J2N7S J3N3S SRF () Minimu m J3N9S J4N7S J5N6S J6N8J J8N2J J10NJ J12NJ J15NJ J18NJ J22NJ J27NJ J33NJ J39NJ J47NJ J56NJ J68NJ J82NJ JR10J JR12J * JR15J * JR18J *180 * JR22J * JR27J * S J

4 Characteristics Electrical 0805 * at A1N5S 1.5 min Hz * at 50 Typic al A1N8S A2N2S A2N7S 2.7 SRF () Minimu m A3N3S A3N9S A4N7S A5N6S A6N8J A8N2J A10NJ A12NJ A15NJ A18NJ A22NJ A27NJ A33NJ A39NJ A47NJ A56NJ A68NJ A82NJ AR10J AR12J * AR15J *150 * AR18J * AR22J * AR27J *270 * AR33J * AR39J * * AR47J S J Temperature rise should be less than 25 and inductance should be less than ±5% when rated current is applied.

5 Measuring Method / Condition Test Instrument: L, : Agilent 4291B Impedance Analyzer Agilent (For 0805/0603) Agilent 16196B (For 0402) Osc. Level: 500mV SRF: Agilent N5230A Network Analyzer : Agilent 34401A Test Condition: < Unless > Temperature: 15 C to 35 C Humidity: 25% to 85% RH < In case of doubt > Temperature: 25 C ± 2 C Humidity: 60% to 70% RH Product Dimensions Product A B C D 36711H Mechanical Performance 0.6 ± Test ± ± ±0.05 (0201) Item Specification Test Condition Solder: 96.5Sn-3.0Ag-0.5Cu 36711E 1.0 ± ± ± ±0.10 More than 90% of the terminal electrode Solder Temperature: 245 ± 5 (0402) Solderability shall be covered with fresh solder. Flux: Rosin 36711J 1.6 ± ± ± ±0.20 Dip Time: 3 ± 1 Seconds (0603) The chip shall not crack. Solder: 96.5Sn-3.0Ag-0.5Cu Soldering Heat More than 75% of the terminal electrode Solder temperature : 260 ± A 2.0 ± ± ± ±0.30 Resistance shall Flux: Rosin (0805) be covered with solder. Dip time: 10 ± 1 seconds The terminal electrode shall not be broken off TYPE W(KGF) TIME (SEC) nor the ferrite damaged. Terminal Strength ± 5 Recommended PCB Layout ± 5 The terminal electrode shall not be broken off nor the ferrite damaged. TYPE W(KGF) TIME (SEC) Terminal Strength ± 5 Type No mechanical damage. L 0.6 The ferrite shall 1.0 not be damaged Size W Bending Strength A 0.15 ~ ~ ~ ~ 1.2 B 0.20 ~ ~ ~ ~ 1.2 C 0.25 ~ ~ ~ ~ 1.6 TYPE A(MM) P(KGF)

6 Bending Test Vibration Drop shock Appearance: No damage initial value. There shall be no mechanical damage. No apparent damage Substrate: PCB(mm 40mm 1.6mm) Solder: Reflow Speed of Applying Force: 0.5mm / s Deflection: 2mm Hold Duration: 30 s The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm and a frequency of from 10 to 55Hz/1 minute repeated should be applied to the 3 directions (X,Y,Z) for 2 hours each Dropped onto printed circuit board from cm height three times in x, y, z directions. The terminals shall be protected. Climatic test ITEM SPECIFICATION TEST CONDITION Thermal Shock (Temperature Cycle) Humidity Resistance Impedance shall be within ±20% of the initial value. Temperature: -55 ~125 for 30 minutes each cycles. Temperature : 60 Humidity: 95% RH Time: 0 ±12 Hours Temperature : 85 ±2 Time: 0 ±12 Hours Temperature : -40 ±2 Time: 0 ±12 Hours High Temperature Resistance Low Temperature Resistance 1. Operating Temperature Range: -55 TO Storage Condition: The temperature should be within -40 ~85 and humidity should be less than 75% RH. The product should be used within 6 months from the time of delivery.

7 Recommended Reflow solder Profile Profile Feature Preheat ts Tsmin 150 Tsmax 200 Pb-Free 60~180 seconds Average ramp-up rate (Tsmax to TP) 3 /second max. Time main above Temperature (TL) 217 Time (tl) 60~150 seconds Peak temperature (TP) 250~260 Time within 5 of actual peak temperature (tp) 10 seconds Ramp-down rate 6 /sec max. Time 25 to peak temperature 8 minutes max. Packaging Peel-Off Force The force for peeling off cover tape is 10 grams in the arrow direction.

8 Dimension (Unit: mm) A B D E F 178± ±0.2 9 ± ±0.5-0 Size A B W P T Chips / Reel ,000 ±0.03 ±0.03 ±0.20 ± , , ,000 How To Order A 3N9 S Common Part Size Code 1H 0201 S - ±0.3nH E J - ±5% See above tables 1J K - ±10% 2A