Multi-Layer Power Inductors (IP_L Series)
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1 Multi-Layer Power Inductors (IP_L Series) For Choke Application ORDERING CODE IP R2 M P L 9 PRODUCT CODE IP : Multilayer Power Inductor (Lead Free) DIMENSION (L X W) Code Dimension EIA x 0.80 mm X 1.25 mm X 1.6 mm X 2.0 mm 1008 INDUCTANCE CODE Code R47 1R0 1R5 2R2 3R3 4R7 Inductance (uh) TOLERANCE CODE M: ±20% PACKAGING CODE T: Paper tape reel P: Embossed reel SPECIFICATION CODE S: Standard for DC/DC converter L: Light loading current for choke C: High Current Type THICKNESS CODE Code B C Thickness (mm) 1 REV
2 ML Power Inductor Standard External Dimensions Unit: mm Series L W T A (Min/Max) IP2012_L (0805) IP2520_L (1008) Recommended Pad Dimensions Soldering resist Land Pattern SMD Inductor c b a Size mm (EIA) L x W (mm) a (mm) b (mm) c (mm) 2012 (0805) 2.0 x to to to (1008) 2.5 x to to to 2.2 Unit: mm/(inch) 2
3 Power Inductor for Choke Feature 1. Ferrite core and magnetic shielding enables the design of compact circuits with higher mounting density 2. Multilayer block structure yields higher reliability. 3. Low DC resistance 4. RoHS complaint Application 1.Separation of analog and digital circuits 2.Prevents interference between PLL and the other digital circuits Part Numbers & Characteristic IP2012_L Series (EIA 0805) Ordering Code Inductance [uh] Inductance Tolerance Measuring frequency [MHz] DC Resistance [Ω] Rated Current [A] (max) (typ.) (max.) SRF (MHz) Thickness [mm] (max.) Packing IP20122R2MPL ±20% IP20124R7MPL ±20% ± Embossed 3 kpcs IP2520_L Series (EIA 1008) Ordering Code Inductance [uh] Inductance Tolerance Measuring frequency [MHz] DC Resistance [Ω] Rated Current [A] (max) (typ.) (max.) SRF (MHz) Thickness [mm] (max.) Packing IP25201R0MPL ±20% IP25202R2MPL ±20% IP25203R3MPL ±20% IP25204R7MPL ±20% ± Embossed 3 kpcs Rated current specifies that self-heat generation is below 40 during DC loaded (at 20 ) Saturated current specifies that inductance drop is below 50% during DC loaded (at 20 ) 3 REV
4 Power Inductor for DC/DC converter & Choke ML Power Inductor Testing Condition & Requirements (IP Series) No. Item Test Condition Requirements 1 Appearance Inductors shall be visually inspected for visible evidence of defect. 2 Inductance a. Temperature: 25+/- 3 b. Relative Humidity: 45 to 75%RH c. Measuring equipment: HP4291B-RF Impedance / Material Analyzer No harmful defect for piratical use. Within specified tolerance. 3 DC Resistance Measuring instrument: HP4338A/B Milliohm meter 4 Dimension Dimension shall be measured with caliper or micrometer In accordance with electrical specification. In accordance with dimension specification. 5 Solder-ability 1.Solder temperature : 235 ± 5 2.Flux : Rosin 3.DIP time : 5 ± 1 sec 1. More than 95 % of terminal electrode should be covered with new solder 2. No mechanical damage 1. More than 95 % of terminal electrode should be covered with new solder 6 Resistance to Soldering Heat 1.Solder temperature : 260 ± 5 2.Flux : Rosin 3.DIP time : 10 ± 1 sec 2. No mechanical damage Inductance value should be within ± 20 % of the initial value 7 Bending Strength Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time No mechanical damage. 8 Thermal Shock 1. Temp.:- 40 ~ + 85, Dwell time is 30 minutes. Maximum 1. No mechanical damage transfer time is 10 minutes. 2. Inductance should be 2. Cycle:100 cycles within±20% of the initial value 3. Measurement at ambient temperature 24 hrs after test completion. 9 Temperature Cycle 1.Temperature:-40 ~ 85 For 30 minutes each Cycle: 100 cycles 2.Measurement:At ambient temperature 24 hours after test completion 1.No mechanical damage 2.Inductance should be within ±20% of the initial value 10 High Temperature Resistance 1.Temperature: 85 ± 5 2.Testing time: 1000 hrs 3.Measurement: at ambient temperature 24 hours after test completion 1.No mechanical damage 2.Inductance should be within ±20% of the initial value 11 Humidity 1.Temperature: 40 ± 2 2.Humidity: % RH 3.Testing time: 1000 hrs 4.Measurement:At ambient temperature 24 hours after test completion 1.No mechanical damage 2.Inductance should be within ±20% of the initial value 4
5 Temperature ( ) Temperature ( ) Reflow Profile Chart (Reference) Soldering Profile for SMT Process with Lead Free Solder Paste. The rate of preheat should not exceed 4 /sec and a target of 2 /sec is preferred. Ceramic chip components should be preheated to within 100 to 130 of the soldering Soldering 240 to ~ 10 sec. 200 Gradual Natural Cooling Preheating 0 over 1 min over 1 min Over 200,within 90sec Time (sec.) Soldering Profile for SMT Process with SnPb Solder Paste. The rate of preheat should not exceed 4 /sec and a target of 2 /sec is preferred. Ceramic chip components should be preheated to within 100 to 130 of the soldering Soldering 220 to ~ 10 sec. 200 Gradual Natural Cooling Preheating 0 over 1 min over 1 min Over 200,within 40sec Time (sec.) 5 REV
6 Power Inductor for DC/DC converter & Choke ML Power Inductor Packaging Specification Embossed Tape Reel Specifications (mm) W 8.00 ± ± 0.10 P 4.00 ± ± 0.10 E 1.75 ± ± 0.10 F 3.50 ± ± 0.10 D 1.55 ± ± 0.05 D ± ± 0.05 Po 4.00 ± ± Po 40.0 ± ± 0.20 P ± ± 0.10 Ao 1.40 ± ± 0.10 Bo 2.30 ± ± 0.10 Ko(T) 1.35 ± ± 0.10 t 0.22 ± ± 0.05 Unit: mm/(inch) 7 Reel Packaging Quantity PART SIZE (EIA SIZE) 2012 (0805) 2520 (1008) Qty.(pcs) 3,000 3,000 BOX 5 reels / inner box 5 reels / inner box 6
7 Peel Strength of Top Cover Tape The peel speed shall be about 300 mm/min. The peel strength of top cover tape shall be between 0.1 to 1.0N. Cautions Storage 1. The inductor shall be packaged in carrier tapes. 2. To keep storage place temperature from +5 to 35, humidity from 45 to 70% RH. 3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be affected. 4. The solder ability is assured for 12 months from our final inspection date if the above storage condition is followed. Handling Inductor should be handled with care to avoid contamination or damage. The use of vacuum pick-up or plastic tweezers is recommended for manual placement. Tape and reeled packages are suitable for automatic pick and placement machine. 7 REV
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