Multilayer Chip Inductor High Frequency LCH LCH0603. Features. Applications. Constructions and Dimensions
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1 Multilayer Chip Inductor High Frequency Multilayer Chip Inductor High Frequency Features A ceramic material construction for high frequency application to 10GHZ Tight tolerance physical dimensions(+/-0.05mm) Tight inductance tolerance and excellent Q Value Available in two compact sizes of 0402, 0603 RoHS compliant Applications High Frequency Application Cellular Phone, Pagers EMI Countermeasure in High Frequency Circuits and Computer Communication etc. WLAN and RF module Constructions and Dimensions Item Material Ceramic Material Through Hole Inner Electrode (Ag) End-termination (Ag/Ni/Sn) Direction Mark TAITRON COMPONENTS INCORPORATED Tel: (800)-TAITRON (800) (661) Fax: (800)-TAITFAX (800) (661) Page 1 of 9
2 Type Size Inch (mm) L W T Min. A Max. Unit: mm Average Weight (mg) LCH (1005) 1.0 ± ± ± LCH (1608) 1.6 ± ± ± Electrical Specifications LCH0402 Type: (nh) Tolerance (nh or %) L/Q Frequency (MHz) Q (Typical) Quality Freq.(MHZ) Factor Min SRF Min. (GHz) DCR Max. (Ω) IDC Max. (ma) 1.0 ±0.3nH ±0.3nH ±0.3nH ±0.3nH ±0.3nH ±0.3nH Page 2 of 9
3 (nh) Tolerance (nh or %) L/Q Frequency (MHz) Q (Typical) Quality Freq.(MHZ) Factor Min SRF Min. (GHz) DCR Max. (Ω) IDC Max. (ma) LCH0603 Type: (nh) Tolerance (nh or %) L/Q Frequency (MHz) Q (Typical) Quality Freq.(MHZ) Factor Min SRF Min. (GHz) DCR Max. (Ω) IDC Max. (ma) 1.0 ±0.3nH ±0.3nH ±0.3nH ±0.3nH ±0.3nH ±0.3nH Page 3 of 9
4 (nh) Tolerance (nh or %) L/Q Frequency (MHz) Q (Typical) Quality Freq.(MHZ) Factor Min SRF Min. (GHz) DCR Max. (Ω) IDC Max. (ma) Page 4 of 9
5 Environment Characteristics Electrical Characteristic Test Test Item Test Condition Requirement Q Value DC Resistance Temperature Characteristics 1).Temperature 25±1 C 2).Relative Humidity:45% to 85%RH 3).Atmospheric pressure:86 to 106Kpa 4).Measuring equipment and fixture 0402:HP4291 B+ Agilent 16193A 0603:HP4291 B+ Agilent 16192A 1).Temperature 25±1 C 2).Relative Humidity:45% to 85%RH 3).Atmospheric pressure: 86 to 106Kpa 1).Temperature 25±1 C 2).Relative Humidity:45% to 85%RH 3).Atmospheric pressure: 86 to 106Kpa 4).Measuring equipment:hp4338 1).Temperature -30 to +85 C 2).Reference Temperature: 25 C Within the specified tolerance In accordance with electrical specification In accordance with electrical specification Within the specified tolerance Mechanical Characteristic Test Test Item Test Condition Requirement Solder the chip to test jig then apply a force in the direction shown in the below.the soldering shall be done with the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock. Bending Strength No Mechanical damage shall be observed Page 5 of 9
6 Test Item Test Condition Requirement Solderability Resistance to Soldering Heat Appearance Dimension Immerse a test sample into a methanol solution containing rosin, Preheat it at 150 to 180 C for 3 to 5 seconds and immerse into molten solder of 245±5 C for 5±0.5 seconds. Immerse a test sample into a methanol solution containing rosin, Preheat it at 150 to 180 C for 2 to 3 minutes and immerse into molten solder of 260±5C for 10±0.5 seconds so that both terminal electrodes are completely submerged. Inductors shall be visually inspected for visible evidence of the defect Dimension should be measured with caliper or micrometer More than 75% of the terminal electrode part shall be covered with flesh solder In accordance with specification In accordance with dimension specification Environmental Characteristic Test Test Item Test Condition Requirement Thermal Shock Solder a test sample to a printed circuit board, and conduct 100 cycles of test under the conditions shown as below. Cycle: variation within 10% High Humidity State Life High Humidity Load Life High Temperature State Life High Temperature Load Keep a test sample in an atmosphere with a temperature of 70±2 C, 90%~95% RH for 500±12 hours. After the test, keep the test sample at a normal temperature for 1 to 2 hours, and then carry out measurement. Solder a test sample to printed circuit board then keep the test sample in an atmosphere with a temperature of 70±2 C, 90%~95% RH for 500±12 hours while supplying the rated current. After the test, keep the test sample at a normal temperature for 1 to 2 hours, and then carry out measurement. Keep a test sample in an atmosphere with a temperature of 100±2 C for 500±12 hours. After the test, keep the test sample at a normal temperature for 1 to 2 hours, and then carry out measurement. Solder a test sample to printed circuit board then keep the test sample in an atmosphere with a temperature of 100±2 C for 500±12 hours while applying the rated current. After the test, keep the test sample at normal temperature for 1 to 2 hours, and then carry out measurement. Storage Temperature: 25±3 C; Humidity < 80% variation within 10% variation within 10% variation within 10% variation within 10% Page 6 of 9
7 Packing Information: Carrier Tape Dimensions Unit: mm Type A B T W P F K LCH LCH Reel Dimensions Type A B C W T Unit: mm Quantity (EA) LCH ±1 60.2±0.5 13± ±0.5 12± LCH ±1 60.0±0.5 13± ±0.5 12± Page 7 of 9
8 How to Order LCH 0603 T 3N9 S- xx -TR70 Packing Code TR70:7 Reel, RoHS Factory Location Code Tolerance Code: J: ±5%; K: ; S: ±0.3nH Code: 3N9: 3.9nH; 27N: 27nH R10: 100nH; R22: 220nH T: Material Code Size Code in inch(mm) 0402(1005); 0603(1608) Taitron High Frequency Multilayer Chip Inductor Page 8 of 9
9 How to contact us: US HEADQUARTERS WEST HARRISON PARKAWAY, VALENCIA, CA Tel: (800) TAITRON (800) (661) Fax: (800) TAITFAX (800) (661) TAITRON COMPONENTS MEXICO, S.A.DE C.V. BOULEVARD CENTRAL 5000 INTERIOR 5 PARQUE INDUSTRIAL ATITALAQUIA, HIDALGO C.P MEXICO Tel: Fax: TAITRON COMPONETS INCORPORATED E REPRESENTAÇÕES DO BRASIL LTDA RUA DOMINGOS DE MORAIS, 2777, 2.ANDAR, SALA 24 SAÚDE - SÃO PAULO-SP BRAZIL Tel: Fax: TAITRON COMPONETS INCORPORATED, SHANGHAI REPRESENTATIVE OFFICE METROBANK PLAZA, 1160 WEST YAN AN ROAD, SUITE 1503, SHANGHAI, , CHINA Tel: Fax: Page 9 of 9
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Features: Very strong solderability by flow soldering, soldering iron or wave soldering. Highly accurate dimensions, can be mounted automatically. Terminals are highly resistant to pull forces. Highly
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