Wire Wound Chip Inductors Ferrite SMD

Transcription

1 GmbH Mathildenstr. 10A Starnberg Germany Wire Wound Chip Inductors Ferrite SMD 5/10/2018 1/13 GmbH

2 SPECIFICATION Part Number * 101 * J * E02 _ * Type Size Value Packing Current (Optional) 095 : SMD Wire Wound Chip Inductor Ferrite 05 : : 1008 The value is given in µh N indicates the decimal point for nh and U indicates the decimal point for µh. When higher than 100 µh the last digit is the multiplier which denotes the number of zero following J : ±5% K : ±10% 10 : 1210 Example: M : ±20% 12 : U3 : 3300 nh 23 : 2220 U68 : 680 nh 151 : 150 µh All products according to RoHS (2011/65/EU) E0A: tape and reel, for 500pcs, embossed plastic tape (7 reel), 1812 size L01: tape and reel, for 1kpcs, embossed plastic tape (13 reel), 2220 size E02: tape and reel, for 2kpcs, embossed plastic tape (7 reel), 0805, 1008 and 1210 size C : Large Current L : Low Profile * not all combination is possible 5/10/2018 2/13

3 Dimensions and recommended PCB pattern for reflow soldering: Figure A Figure B Figure C A B C D Size Figure max. max. max. Ref. E F G H I J K 0805 A 2,29 1,71 1,45 0,51-0,44 1,02 1,78 1,02 0,76 1, A 2,92 2,79 2,10 1,20-0,45 1,52 2,54 1,02 1,27 2, B 3,50 2,80 2,50 1,60 0, ,00 1,20 1, B 4,80 3,50 3,50 1,80 1, ,80 1,50 3, C 5,90 5,20 4,30 4±0,2 0,7±0, ,50 2,00 4, A 2,29 1,73 1,00 0,51-0,44 1,02 1,78 1,02 0,76 1, A 2,92 2,79 2,10 1,20-0,45 1,52 2,54 1,02 1,27 2, B 4,80 3,50 3,50 1,40 1, ,80 1,50 3, C 5,90 5,20 4,30 4±0,2 0,7±0, ,50 2,00 4,00 - Unit: mm Standard 0805 Test Freq. (MHz) 5/10/2018 3/13 Q min. SRF (MHz) min. DCR (Ω) max. IDC (ma) max. U12 0, , U15 0, , U18 0, , U22 0, , U27 0, , U33 0,33 25, , U39 0, , U47 0, , U56 0, , U68 0, , U82 0, , , ±5, ±10% 1U2 1, , U5 1, , U8 1, , U2 2, , U7 2, , , U3 3, , U9 3, , U7 4, , U6 5, , U8 6, , U2 8, , , ,50 180

4 Standard 1008 Test Freq. (MHz) Q min. SRF (MHz) min. DCR (Ω) max. IDC (ma) max. U12 0, , U15 0, , U18 0, , U22 0, , U27 0, , U33 0,33 25, , U39 0, , U47 0, , U56 0, , U68 0, , U82 0, , , U2 1, , U5 1, , U8 1, , U2 2, , U7 2,7 70 1, , U3 3,3 55 1, U9 3,9 ±5, ±10% 48 1, U7 4,7 43 1, U6 5,6 42 1, U8 6,8 39 1, U2 8,2 36 1, , , , , , , , , , , , , , , /10/2018 4/13

5 Standard 1210 Test Freq. Q SRF DCR IDC (MHz) min. (MHz) min. (Ω) max. (ma) max. U18 0, , U22 0, , U27 0, , U33 0, , U39 0,39 ±20% 25, , U47 0, , U56 0, , U68 0, , U82 0, , , U2 1, , U5 1,5 85 0, U8 1,8 80 0, U2 2,2 75 1, U7 2,7 70 1, ,96 3U3 3,3 60 1, U9 3, , U7 4,7 50 1, U6 5,6 45 1, U8 6,8 40 1, U2 8,2 35 2, , , ±10% 20 2, , , , , , , , , , , , , , , , , /10/2018 5/13

6 Standard 1812 Test Freq. Q SRF DCR IDC (MHz) min. (MHz) min. (Ω) max. (ma) max. U18 0, , U22 0, , U27 0, , U33 0, , U39 0,39 ±20% 25, , U47 0, , U56 0, , U68 0, , U82 0, , , U2 1,2 80 0, U5 1,5 70 0, U8 1,8 60 0, U2 2,2 55 0, U7 2,7 50 0, ,96 3U3 3,3 45 0, U9 3,9 40 0, U7 4,7 35 1, U6 5,6 33 1, U8 6,8 27 1, U2 8,2 25 1, , , , , , , ±10% 2, , , , , , , , , , , , ,0 92 0, ,5 15, , , , , ,5 43,0 30 5/10/2018 6/13

7 Standard 2220 (mh) 122 1,2 Test Freq. (MHz) Q min. SRF DCR IDC (MHz) min. (Ω) max. (ma) max. 1, ,5 1, ,8 1, ,2 1, ,7 1, ,3 0, , ±5, ±10% 392 3,9 1, ,7 0, ,6 0, ,8 0, ,2 0, , , Standard 0805 Low Profile Type Q Test Freq. SRF DCR IDC min. (MHz) (MHz) min. (Ω) max. (ma) max. 15 L: 7,96 / Q: 25, , U3 3, , U7 4, , U8 6,8 ±5, ±10% , , , , , Standard 1008 Large Current Type Q min. 22 Test Freq. (MHz) SRF DCR IDC (MHz) min. (Ω) max. (ma) max , U2 1, , U5 1, , U8 1, , U2 2, , U7 2, , ,96 3U3 3, , U9 3, , U7 4, , U6 5,6 ±5, ±10% , U8 6, , U2 8, , , , , , , , , , /10/2018 7/13

8 SMD Standard 1812 Large Current Type Q Test Freq. SRF DCR IDC min. (MHz) (MHz) min. (Ω) max. (ma) max , U2 1, , U5 1, , U8 1, , U2 2,2 80 0, U7 2,7 60 0, ,96 3U3 3,3 45 0, U9 3,9 40 0, U7 4,7 35 0, U6 5,6 30 0, U8 6,8 28 0, U2 8,2 25 0, , , , , , , ±10% 2, , , ,5 1, , , , , ,5 4, , ,5 7, ,5 9, , , , ,8 23, , , , , /10/2018 8/13

9 Standard 2220 Large Current Type Q Test Freq. SRF DCR IDC min. (MHz) (MHz) min. (Ω) max. (ma) max. 95 0, U2 1,2 70 0, U5 1,5 55 0, U8 1,8 47 0, U2 2,2 42 0, U7 2,7 37 0, ,96 3U3 3,3 34 0, U9 3,9 32 0, U7 4,7 29 0, U6 5,6 26 0, U8 6,8 24 0, U2 8,2 22 0, , , , , , ,5 0, , ±5, ±10% 10,5 0, ,5 0, ,5 0, ,8 1, ,0 1, ,4 1, ,0 1, ,4 1, ,8 2, ,4 2, ,9 3, ,6 4, , ,2 4, ,9 5, ,6 7, ,4 8, , , ,252 1, Construction 1 Molded resin 3 Ferrite core 2 Electrode (Ag) 4 Magnet wire 5/10/2018 9/13

10 Tape Dimensions P0 E P2 D W F D0 B P1 A Embossed Plastic Tape Type A B E F P 0 P 1 P 2 W T 1 T 2 D D ,85±0,1 2,45±0,1 1,75±0,1 3,5±0,05 4±0,1 4±0,1 2±0,05 8±0,2 1.45±0,05 0,23±0,05 1,5 1, ,80±0,1 2,95±0,1 1,75±0,1 3,5±0,05 4±0,1 4±0,1 2±0,05 8±0,2 2.22±0,05 0,23±0,05 1,5 1, ,96±0,1 3,60±0,1 1,75±0,1 3,5±0,05 4±0,1 4±0,1 2±0,05 8±0,2 2.40±0,05 0,23±0,05 1,5 1, ,30±0,1 5,00±0,1 1,75±0,1 5,5±0,05 4±0,1 8±0,1 2±0,05 12±0,2 3.50±0,05 0,30±0,05 1,5 1, ,35±0,1 6,10±0,1 1,75±0,1 7,5±0,05 4±0,1 12±0,1 2±0,05 16±0,2 5.50±0,05 0,35±0,05 1,5 1,5 Reel Dimensions Type ΦA ΦB ΦC W T ±2.0 60±0.5 13±0.3 9±0.3 12± ±2.0 60±0.5 13±0.3 9±0.3 12± ±2.0 60±0.5 13±0.3 9±0.3 12± ±2.0 80±0.5 13± ±0.3 16± ± ±0.5 13± ±0.3 22±1.0 Lead Dimensions: Trailer End Leader End Trailer (80mm min.) Empty Compartments with Cover Tape (100mm min.) Cover Tape Only (250mm min) 5/10/ /13

11 Cover Tape Peel off Strength Peel-off force should be in the range of 0,1N~0,6N in the arrow direction at the following conditions: Temperature: 5~35 C Humidity: 45~85% Top Cover Tape Atmospheric Pressure: 860~1060 hpa 160~180 Base Tape Operating and storage Temperature range (individual chip without packing): -40 C to +85 C Lead Free Reflow Soldering Profile Stock period The performance of these products, including the solderability, is guaranteed for 12 month, provided that they remain packed as they were when delivered and stored at a temperature of 25 C ± 3 C and a relative humidity less than 80%RH 5/10/ /13

12 Electrical Performance Test Item Requirement Test Method Q SRF DC Resistance DCR Rated Current IDC Refer to standard electrical characteristic spec. HP4291 or HP4284 HP4291 or HP4284 HP4291 Agilent 34401A Applied the current to coils, The inductance change should be less than 10% to initial value Mechanical Performance Test Item Requirement Test Method Solderability Resistance to Soldering Heat Vibration The electrodes shall be at least 90% covered with new solder coating Appearance: No damage Appearance: No damage L change: within±10% Q change: within±30% DCR: within specification Climatic Test Item Requirement Test Method Lead-free inductor: after fluxing(alpha 100 or equiv), inductor shall be dipped in a melted solder bath at 245±5 C, 5±0,5 seconds Pre-heating: 150 C, 1min. Solder Temperature: 260±5 C Immersion Time: 10±1 seconds Test device shall be soldered on the substrate Oscillation Frequency: 10 to 55 to 10Hz for 1 min. Amplitude: 1,5 mm Time: 2 hrs for each axis (X, Y&Z), total 6 hrs Temperature Cycle Damp Heat with Load High Temperature Storage Low Temperature Storage Appearance: No damage L change: within±10% Q change: within±30% DCR: within specification One cycle: Temperature Time Step ( C) (min.) 1-25± ± ± ±2 3 Total: 100 cycles Measured after exposure in the room condition for 24 hrs Temperature: 40±2 C Relative Humidity: 90 ~ 95% Time: 1000 hrs Measured after exposure in the room condition for 24 hrs Temperature: 85±3 C Relative Humidity: 20% Applied Current: Rated Current Time: 1000 hrs Measured after exposure in the room condition for 24 hrs Temperature: -25±3 C Relative Humidity: 0% Time: 1000 hrs Measured after exposure in the room condition for 24 hrs 5/10/ /13

13 Published by GmbH Mathildenstr. 10A; Starnberg; Germany 2018 GmbH. All Rights Reserved. The following applies to all products named in this publication: 1. The information describes the type of component and shall not be considered as assured characteristics. 2. Terms of delivery and rights to change design reserved. 3. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. Nevertheless, we explicitly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 4. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 5. The warnings, cautions and product-specific notes must be observed. 6. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous ). Useful information on this will be found in our Material Data Sheets. Should you have any more detailed questions, please contact our sales offices. 7. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true for the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. 8. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the General conditions for the supply of products and services of the electrical and electronics industry published by the German Electrical and Electronics Industry Association (ZVEI), available at 9. As far as patents or other rights of third parties are concerned, liability is only assumed for components per se, not for applications, processes and circuits implemented within components or assemblies. 10. The trade name is a trademark registered or pending in Europe and in other countries. 5/10/ /13