英飞凌汽车电子 您的技术伙伴 2010 英飞凌汽车电子中国巡回研讨会

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1 英飞凌汽车电子 您的技术伙伴 2010 英飞凌汽车电子中国巡回研讨会

2 英飞凌 一颗汽车之 芯 每部汽车平均有 25 颗英飞凌器件 平均 1/3 的发动机管理系统由英飞凌的单片机控制 在每一部新车里超过 1/2 的负载由英飞凌的汽车功率器件推动, 从仪表板显示到发电机到后雾灯 全球 1/3 的 IGBT 芯片来自英飞凌, 全球 No.1 IGBT 芯片供应商, 全球 No.1 IGBT 标准模块供应商 Mar 2010 Page 2

3 Infineon Automotive Market Share Development Worldwide Automotive Semiconductor Ranking 1. Infineon 9,0% 2. Freescale 8,0% 3. STM 7,7% 4. NEC 7,3% 5. Renesas 7,0% 6. NXP 6,4% 7. Toshiba 5,6% 8. Bosch 4,9% 9,0% 8,2% 5,7% 3,9% Infineon is the world s #1 in Automotive! Europe China, India, Brazil, Russia, ROW NAFTA Japan 1. Infineon 13,6% 2. STM 10,5% 3. Bosch 10,4% 4. Freescale 8,5% 5. NXP 8,2% 6. TI 5,9% 7. NEC 5,3% 8. ON Semi 2,9% 1. STM 9,2% 2. Infineon 8,8% 3. Freescale 7,6% 4. NXP 7,0% 5. NEC 4,5% 6. Renesas 3,9% 7. Toshiba 2,8% 8. ROHM 2,7% 1. Freescale 16,1% 2. Infineon 7,8% 3. NXP 7,1% 4. STM 6,6% 5. ON 4,3% 6. TI 3,7% 7. Renesas 3,3% 8. NEC 3,1% 1. Renesas 19,8% 2. Toshiba 18,0% 3. NEC 15,6% 4. ROHM 3,8% 5. Fujitsu 3,6% 6. TI 3,2% 7. Sanken 3,1% 8. Infineon 2,8% ROW: Key Rest-Of-World countries China, India, Brazil, Russia Source: Strategy Analytics, April 2010 For internal use only / Copyright Infineon Technologies All rights reserved. Page 3

4 Infineon s Ranking In Its Global Target Markets Power Industrial Chip Card Automotive Wireless ASSP #1 #1 #1 #1* #4 Market share Market share Market share Market share Market share 10% 8% 26% 9.5% 6% Calendar Year 2008 Source: IMS, Sep Calendar Year 2008 Source: Semicast, May 2009 Calendar Year 2008 Source: Frost & Sullivan, July 2009 Calendar Year 2008 Source: Strategy Analytics, May 2009 Calendar Year 2008 Source: isuppli, Oct 2009 *According to Strategy Analytics head-to-head with Freescale. According to isuppli #1 in calendar year 2008.

5 Infineon Automotive Your trusted partner for automotive applications Worldwide No. 1 for automotive semiconductors Reliability through experience: More than 40 years of automotive system and application expertise Innovative product portfolio covering the complete control cycle: From sensing over computing to actuating System expertise with broad application competence: Powertrain, Safety Management, Body & Convenience Worldwide development, production and support sites Automotive Excellence TM : Most comprehensive quality program in the industry Copyright Infineon Technologies All All rights rights reserved. Page 5

6 Infineon Automotive Semiconductor Solutions Combines Sense, Compute and Actuate Our target markets Sense Compute Actuate Powertrain Diesel Engine Mgmt. Gasoline Engine Mgmt. Transmission Control Starter / Alternator Pressure Sensors Magnetic (Hall) Sensors 16/32 bit µc 32 bit TriCore (µc + DSP) MOSFETs IGBTs Regulators Transceivers Smart Power System ICs Safety ABS/ESP/Traction Control Suspension Airbag/Restraint Systems Side-airbag Power Steering Tire Pressure Monitoring Pressure Sensors TPMS Magnetic (Hall) Sensors RF ICs 8 bit µcs 16/32 bit µcs 32 bit TriCore (µc + DSP) Diodes Transistors MOSFETs Regulators Transceivers Smart Power System ICs Body&Convenience Light Control Heating, Ventilation, Air Condition Door & Seat Smart Battery Terminal Magnetic Sensors Temperature Sensors RF ICs 8 bit µcs 16/32 bit µcs Transceivers Diodes MOSFETs Transistors Regulators E-Power Smart Power Hybrid Electrical Drives Hybrid motor drive Regenerative braking Battery management Magnetic Sensors Temperature Sensors 8 bit µcs 16/32 bit µcs 32 bit TriCore (µc + DSP) MOSFETs IGBTs Regulators Transceivers Smart Power HybridPACK Page 6

7 Requirements Actuate We meet the requirements for innovative automotive power application SMART Power ICs Smart MultiChannel Switches - For Body: SPIDER - For Powertrain and Safety: Flex Motor Bridges NovalithIC TM / Trilith IC - High-Current Motor Drives Driver ICs Voltage Regulators CAN/LIN Transceivers DC/DC Converters Power System ICs Smart Power System Integration - ABS / Airbag - Powertrain - Body Embedded Power Single Package Smart Power and Controller Integration Automotive LED Drivers PROFET TM / SPOC Protected High-Side-Switches Multi-Channel SPI MOSFET TEMPFET TM / HITFET TM Protected Low-Side-Switches Integration Copyright Infineon Technologies All rights reserved. Page 7

8 Actuate Our long lasting experience in industrial drives supports the move towards HEV solutions HybridPACK2 Designed for full HEV application with a power range up to 80 KW, 420 V. Most advanced 600 V IGBT3 technology. HybridPACK1 Designed for main inverter of a mild HEV application with a power range up to 20 KW, 420 V. Most advanced 600 V IGBT3 technology. Gatedriver IC s Features Driver IC: Single channel isolated IGBT driver, For 600 V / 1200 V IGBTs, 2 A rail-to-rail output, VCEsat detection, Two-level-turn-off, Active Miller Clamp, V + A + B + C + A B C 0 A 0 B 0 C 0 Ia Va Ib Vb Ic Vc V1 Motor Voltages & Currents Motor Temperature Motor Position V2 Copyright Infineon Technologies All rights reserved. Page 8

9 Sense Infineon Automotive Smart Sensor Product Portfolio Integrated Sensor Products Magnetic Sensors ABS Camshaft/Crankshaft Transmission Linear Hall Angle Consumer (e.g. Flip Phones) TPMS Sensors Sense & Control Integrated Pressure Sensors Side Airbag BAP, MAP Wireless Control ICs RKE Consumer (e.g.remote control) Industrial (e.g. metering) Radar ICs Wireless Sense & Control Products Page 9

10 Compute Infineon Automotive Microcontroller Portfolio Scalable and Compatible MIPS 8-Bit 16-Bit 32-Bit 300MHz ~ MHz 1/3 cycle ~ MHz 1/3 cycle ~ 80 80MHz 1 cycle ~ 40 40MHz 1 cycle ~ 20 24MHz 2 cycle ~ 10 26MHz 2 cycle ~ 2 20MHz 12 cycle RISC/CISC/DSP C167 C165 C505 TC1130 C164 C161 C MB AUDO-NG TC1796 TC176x 32kB 256kB XC164 16KB XC MB AUDO-F TC1797 TC1767 TC1736 XC866 XC866 XC161/7 1 3MB AUDO-S TC1387 TC1367 TC KB 64KB XC88x XC878 AUDO-MAX TC179x TC178x TC172x 1.5 4MB XC27xx XC23xx XC22xx XC82x TC139x TC135x 32kB 1.6MB Page 10

11 Infineon Wafer Technologies for Automotive ICs We continuously extend the portfolio of dedicated automotive wafer technologies CxFLA eflash Microcontroller C9FLRA 0.22µm C11FLA 130nm L90FLA 90nm C65FLA 65nm SPT BCD System IC SPT4 60V, 1.2µm SPT5/6 60V, 0.5µm SPT7 60V, 0.35µm SPT9 60V, 130nm, NVM Smart Common Drain Protected Switches SSMART 60V, 1.5µm Smart5 60V, 1.0µm Smart6 60V, 1.0µm Sm6HV 75V, 1.0µm DOPL Bipolar Vregs Bridges DOPL3 UCE>45V DOPL4 UCE>45V Supply1 UCE>45V SFET MOSFET Power Transistors SFET2 planar SFET3 Trench Gen1 SFET4 Trench Gen2 SFET5 Trench Gen3 Copyright Infineon Technologies All rights reserved. Page 11

12 Infineon Package Technology Portfolio IC Power Wafer Level Packages, Bare Die Laminate based Packages Leadframe based Packages Power Discretes Sensors High Power Chip Card Surface Mount Technology (SMD) Without redistribution WLP (fan-in) Wafer level w/redistribution WLB (fan-in) ewlb (fan-out) Bare Die Wirebond Flip chip SMD OCCN 1) BGA LBGA xfbga, xfsga Flip chip FCxBGA xf2bga, xf2sga Through Hole DIP 2) SMD PLCC 2) TSSOP TQFP, LQFP, MQFP Leadless VQFN O-LQFN 1) Through Hole TO, DIP SMD TO DSO SSOP Leadless CanPAK SON QFN SIP Low Power IDC SIP Medi. Power CIPOS SMD leaded SOT SOD Flat lead TSFP SC Leadless TSLP Wafer level WLP Through Hole PSSO SMD Leaded DSO SC TSOP Open cavity DSOF Power Modules Easy 62mm Econo Econo PACK+ PrimePACK IHM IHV Hybrid PACK Mold on LF P-MCCx Mold P-Mx.x Chip on Flex UV Globe top T-Mx.x PRELAM PPxx Flip Chip S-MFCx.x Wafer Bumped Diced 1) for specialties only 2) phase-out Copyright Infineon Technologies All rights reserved. Page 12

13 PPM Infineon established the Automotive Excellence Program in 2003 Infineon s Automotive Excellence Program Goals: Sustainable quality improvement Zero Defect Culture Measurables: Decrease of number of customer returns and quality spills Increase of customer satisfaction Improvement Examples: Zero Defect Product Quality goes Zero Defect 1.2 ppm 0.9 ppm 0.6 ppm 0.4 ppm Our target of ZD is your competitive advantage: Advanced Process Control Excellent Requirement Management No quality events Defect-free product launches Low non-conformance costs Highest quality image in your market More business due to satisfied customers Our quality is clearly seen as industry benchmark by almost all of our customers Page 13

14 参考方案 发动机管理系统 ; 摩托车电喷, 16 位和 32 位的设计平台 参考方案 传动系统 AMT,AT TCU 与国内主要供应商开发中 ABS / ESC 完整的方案 第三方设计公司的支持 安全气囊主要的本土供应商都在使用 EPS DC 参考方案完成 ; 三相电机设计开发中 RKE /TPMS 成熟完整的设计方案, 包括软 硬件 车身电子车灯控制 空调控制 电动窗控制 门控 网关都已有参考设计 混合动力汽车 / 电动汽车电机驱动模块 控制 ; 电池管理系统 Mar 2010 Page 14

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