DATASHEET. Automotive Surface-Mount Devices miniasmd/microasmd/nanoasmd/ahs/asmd Series

Transcription

1 TSHT utomotive Surface-Mount evices minism/microsm/nanosm/hs/sm Series Since the 980 s we have provided PPT resettable devices for the automotive industry. In vehicle electronic equipment, our PolySwitch PT surface-mount devices are rapidly becoming the preferred circuit protection solution. Our automotive surface-mount device offering is constantly increasing with smaller size, higher current and higher temperature devices. We are proud to offer the specific automotive surface-mount device families: nanosm, microsm, minism, SM, HS. These specific devices are qualified and sold under our PS400 specification which is derived from the -Q200 standard for electronic components used in the automotive industry. The key difference between these automotive devices and other surface-mount devices from the circuit protection product portfolio is their qualification according to a series of rigorous tests related to the automotive environment. s a result, they are characterized by some specific additional values determined after stringent testing. enefits: eatures: Products meet applicable automotive industry standards Qualified per -Q200 specification ompatible with high-volume electronics assembly RoHS compliant and halogen free Small sizes help save board space and cost ootprints from 206 to 3425 Many product choices give design engineers more urrent ratings from 0.05 to 3.0 design flexibility Voltage ratings from 6 to 60V Low resistance allows for low voltage drop ast time-to-trip Low resistance pplications: lectronic ontrol Unit (U) I/O and trace protection Telematics, infotainment and navigations systems US port protection Motor and motor control circuit protection: power door-locks, mirrors, lumbar pumps, headlight position adjustment, seat, sunroofs and windows Heating Ventilation and ooling (HV) control circuit and I/O protection Liquid rystal isplay backlight heaters

2 lectrical haracteristics I HOL I Trip V MX I MX P max Part Number Marking () () (V ) () (W) Maximum Time-to-Trip urrent () nanosm02 P nanosm06 N nanosm nanosm microsm microsm minism minism minism minism minism minism075/ V minism0/6 06V minism0/24 024V minism25/6 256V minism50/6 506V minism50/ V minism260/6 2606V HS H HS HS200 H HS300 H SM SM SM SM SM SM SM SM SM Note : Operation Temperature for nanosm, microsm, minism and SM devices is -40~85. Operation Temperature for HS devices is -40~25. Time (s) R MIN Ω R MX Ω 2

3 Typical Thermal erating urve nanosm evices = nanosm02 = nanosm06 = nanosm020 = nanosm035 % of Rated Hold and Trip urrent mbient Temperature ( ) microsm evices = microsm005 = microsm % of Rated Hold and Trip urrent mbient Temperature ( ) minism evices = minism00 = minism04 = minism020 = minism030 = minism050 = minism075/24 G = minism0/6 H = minism0/24 I = minism25/6 J = minism50/6 K = minism50/24 L = minism260/6 % of Rated Hold and Trip urrent H 60 JI 50 G K 40 L L I J GKH mbient Temperature ( ) 3

4 Typical Thermal erating urve ont d SM and HS evices = SM = HS % of Rated Hold and Trip urrent mbient Temperature ( ) Typical Time-to-trip urve at 20 nanosm evices = nanosm02 = nanosm06 = nanosm020 = nanosm ault urrent () microsm evices = microsm005 = microsm ault urrent () 4

5 Typical Time-to-trip urve at 20 ont d minism evices = minism00, minism04 = minism020 = minism030 = minism050 = minism075/24 = minism0/6 G = minism0/24 H = minism25/6 I = minism50/6 J = minism50/24 K = minism260/6 0 G H J I K K G J 0.0 H I ault urrent () HS evices = HS = HS60 = HS200 = HS ault urrent () SM evices = SM030 = SM050 = SM075 = SM = SM25 = SM50 G = SM85 H = SM200 I = SM250 0 H G I I G H ault urrent () 5

6 imensions in Millimeters (Inches) Unit: mm (inch) G H Part Number Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min igure nanosm S (206 mils) (8) (34) (0.024) (0.039) (0.054) (0.07) (0.00) (0.030) (0.003) nanosm S (206 mils) (8) (34) (0.024) (0.039) (0.054) (0.07) (0.00) (0.030) (0.003) nanosm S (206 mils) (8) (34) (0.023) (0.032) (0.054) (0.07) (0.00) (0.030) (0.003) nanosm S (206 mils) (8) (34) (0.023) (0.032) (0.054) (0.07) (0.00) (0.030) (0.003) microsm S (20 mils) (8) (35) (0.09) (0.034) (0.092) (0) (0.00) (0.030) (0.003) microsm S (20 mils) (8) (35) (0.09) (0.034) (0.092) (0) (0.00) (0.030) (0.003) minism S (82 mils) (72) (86) (0.025) (0.035) (2) (34) (0.00) (0.040) (0.008) minism S (82 mils) (72) (86) (0.025) (0.035) (2) (34) (0.00) (0.040) (0.008) minism S (82 mils) (72) (86) (0.025) (0.035) (2) (34) (0.00) (0.040) (0.008) minism S (82 mils) (72) (86) (0.025) (0.035) (2) (34) (0.00) (0.040) (0.008) minism S (82 mils) (72) (86) (0.05) (0.025) (2) (34) (0.00) (0.040) (0.008) minism075/ S (82 mils) (72) (90) (0.032) (0.057) (2) (34) (0.00) (0.040) (0.008) minism0/ S (82 mils) (72) (90) (0.0) (0.09) (2) (34) (0.00) (0.040) (0.008) minism0/ S (82 mils) (72) (90) (0.032) (0.057) (2) (34) (0.00) (0.040) (0.008) minism25/ S (82 mils) (72) (90) (0.0) (0.09) (2) (34) (0.00) (0.040) (0.008) minism50/ S (82 mils) (72) (90) (0.0) (0.09) (2) (34) (0.00) (0.040) (0.008) minism50/ S (82 mils) (72) (90) (0.040) (0.077) (2) (34) (0.00) (0.040) (0.008) minism260/ S (82 mils) (72) (90) (0.042) (0.060) (2) (34) (0.00) (0.040) (0.008)

7 imensions in Millimeters (Inches) ont d Unit: mm (inch) G H Part Number Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min igure HS S2 (208 mils) (86) (0.24) - (0.060) (66) (94) (0.00) (0.04) (0.00) (0.04) (0.02) (0.08) HS S3 HS S3 HS S3 SM S3 (2920 mils) (0.265) (0.34) - (25) (9) (0.24) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.07) SM S3 (2920 mils) (0.265) (0.34) - (25) (9) (0.24) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.07) SM S3 (2920 mils) (0.265) (0.34) - (25) (9) (0.24) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.07) SM S3 (2920 mils) (0.265) (0.34) - (8) (9) (0.24) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.07) SM S3 (2920 mils) (0.265) (0.34) - (8) (9) (0.24) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.07) SM S3 SM S3 SM S3 SM S3 Note : Terminal Material is % matte tin with nickel underplate. imension igures igure S igure S2 igure S3 H G 7

8 Recommended Pad Layout Recommended Pad Layout igures [mm (In.)] Part Number imension (Nom.) imension (Nom.) imension (Nom.) nanosm device.60 (0.063).00 (0.039) 2.00 (0.079) microsm device 2.50 (0.098).00 (0.039) 2.00 (0.079) minism device 2.95 (4).68 (0.066) 3.0 (22) HS device 4.60 (80).50 (0.059) 3.40 (34) HS60~HS300 devices 4.60 (80) 2.30 (0.090) 6.0 (0.240) SM030~SM25 devices 3.0 (20) 2.30 (0.090) 5.0 (0.20) SM50~SM250 devices 4.60 (80) 2.30 (0.090) 6.0 (0.240) Soldering Reflow and Rework Recommendations lassification Reflow Profiles Reflow Profile Profile eature verage Ramp-Up Rate (Ts MX to Tp) Pb-ree ssembly 3 /s max Tp T L Ramp up tp ritical Zone T L to Tp Preheat Temperature Min (Ts MIN ) Temperature Max (Ts MX ) Time (ts MIN to ts MX ) Time maintained above: Temperature (T L ) Time (t L ) s s Temperature 25 Ts MX Ts MIN ts Preheat t 25 to Peak t L Ramp down Peak/lassification Temperature (Tp) 260 Reflow Profile Time Time within 5 of actual Peak Temperature Time (tp) Ramp-own Rate 30 s max 3 /s max Note : ll temperatures refer to topside of the package, measured on the package body surface. Solder Reflow Recommended reflow methods: IR, hot air and Nitrogen Recommended maximum paste thickness : 0.25mm (0.00 inch) evices can be cleaned using standard methods and aqueous solvents. Tyco lectronics believes the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed underneath each device s termination. s such, we request that customers comply with our recommended solder pad layouts. Tyco lectronics requests that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices. Rework Standard industry practices. Please also avoid direct contact to the device. 8

9 PS400 Test Items and Results (ased on -Q200 Specification) Item Test Test condition etails Test Results Pre & post stress electrical test 4 Temperature cycling 6 Moisture resistance 7 iased humidity 8 Operational life 2 Resistance to solvents 3 Mechanical shock 4 Vibration 5 Resistance to soldering heat 6 Thermal shock ive resistance, TtT, I HOL, Pd -40 to 85 0 cycles t = 24 hours/cycle; 0 continuous cycles Un-powered Ramp rate 0 /min Soak time 5 minutes 0 hours 85 ± 5 /85%RH±5% In-test measurement: None Test current: 0% of I HOL 0 hours Rated Temp. and tol: 85 ±2 Still air requirement: None ist of temp measurement: 4 min Three solvents. Immersion brush, 3 cycles, inspection for marking and part damage ondition: Mounting cfg.: per general spec. 5 g s for 20 min. 2 cycles each of 3 orientations Test from Hz Per MIL-ST-202G Test conditions I, J, K -40 to 85 Transfer time: 20 sec; well time: 5 minutes Medium: ir - ir Operation condition: Rated Voltage/I HOL ON-O frequency: 5 sec ON 5 sec O Per MIL-ST-202G MTHO 25K Peak value 500g s half-sine 0.5msec for each duration Repeat 3 times per direction requency : 0-40 Hz mplitude: ± 0.75 mm requency 2: 40 2KHz mplitude: 5 g s peak Repeat 3 times 24hrs cooling time prior to final measurement No. of cycles: S 5KV air discharge level 8 Solderability 2 oard flex 22 Terminal strength Short circuit fault current durability ault current durability nd-of-life-mode verification Jump start endurance Load dump endurance 260(+0/-5) 0 seconds max (Pb free solder paste) 220(+0/-5) 0 seconds max (Pb contained solder paste) Room temperature V /200, (6V for minism04) Test with devices after 8 hours steam aging Total deflection: 2.0mm minimum eflection time: 60 (-0/+5) sec. 7.7 N (.8 Kg) force to the side of a device being tested for 60sec 5 sec ON, 2 minutes O 25 cycles Room temperature Min. 5 minutes ON 6V/6 x I HOL Min. 0 minutes O Room temperature 5 sec ON, minute O 6V/6 x I HOL 0 cycles Test voltage: 26V uty cycle: min ±3sec ON, 2 min O 3 pulses Test voltage: Us=86.5V/66.5V/46.5V (the two lower Test per ISO7637-2, pulse 5a, 0 times Us values correspond to truncated surge profiles)* evices tested under un-tripped status, Ua=3.5V * * Most tested devices meet the load dump test with a peak voltage of 86.5V. However some only meet a reduced peak voltage surge. ontact us if you need more details. ircuit Protection Products 308 onstitution rive Menlo Park, US Tel : (800) , (650) ax : (650) (hinese) (Japanese) PolySwitch, T (logo) and Tyco lectronics are trademarks of the Tyco lectronics group of companies and its licensors. Other logos, product and ompany names mentioned herein may be trademarks of their respective owners. ll information, including illustrations, is believed to be reliable. Users, however, should independently evaluate the suitability of each product for their application. Tyco lectronics orporation makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use. Tyco lectronics only obligations are those in the Tyco lectronics Standard Terms and onditions of Sale for this product, and in no case will Tyco lectronics be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In addition, Tyco lectronics reserves the right to make changes without notification to uyer to materials or processing that do not affect compliance with any applicable specification. 200 Tyco lectronics orporation. ll rights reserved. RP