Partial high current solutions WIRELAID The technology and technical application

Transcription

1 Partial high current solutions WIRELAID The technology and technical application

2 Agenda Introduction Design Guide Markets and target groups WIRELAID versus Standard Example of use Advantages of WIRELAID Seite 2

3 Introduction Requirements of the market: Power (3-200A) Signal (SMD, fine line) Benefit Seite 3

4 Introduction The priciple Use of embedded copper wires to realise high current tracks Combination of power and signal processing electronics Competitive alternative to PCBs with thick copper technology or parallel arrangement of additional layers The technics The copper wires are fixed onto the under side (treatment) of the copper foil using resistance welding After lamination the process, wires are embedded by prepregs into a multilayer PCB WIRELAID copper foil forms external layer and is structured with standard PCB processes Therefore external layer are SMD-capable Seite 4

5 Production process Welding first point Wire is cut to length Second welding point Turning the WIRELAID foil Lamination process Embedding wires Wirelaid Multilayer Seite 5

6 Production process Anschweißen des ersten Punktes Ziehen und Ablängen des Drahtes Schweißung des zweiten Punktes Wenden der bestückten Folie Verpressen der Folie Einbetten der Drähte Fertiger Multilayer Seite 6

7 Types of wires Flat wire F08 0,8 x 0,25mm² Cross-sectional-area : 0,2mm² F14 Cross-sectional-area : 1,4 x 0,35mm² 0,5mm² Seite 7

8 3 dimensional way of installation Wirelaid 3D Depth-milled slot Suited for complicated installation space Partial thick copper with hinge character Bending radius <1mm Seite 8

9 WIRELAID vs. Standard Introduction Design Guide Markets and target groups WIRELAID versus Standard Example of use Advantages of WIRELAID Seite 9

10 WIRELAID vs. Standard Requirements: 20A at 20K allowed temperature rise 0,63mm² 8,9mm 4,5mm 1,9mm WIRELAID use: Reduction of 78,7% WIRELAID Cross-sectional area track width Wirelaid (35µm base Cu) Track width standard (35µm base Cu) Reduction F14 0,5mm² 1,9mm 8,9mm 78,7% Seite 10

11 Poll 1. Guess how many amps two wires (F14) can carry with maximum temperature rise of 20K? 1. 12A 2. 23A 3. 38A Seite 11

12 Design Guide Introduction Design Guide Markets and target groups WIRELAID versus Standard Example of use Advantages of WIRELAID Seite 12

13 Ampacity Wires welded under the internal layer rise of temperature (ΔT in C) Copper thickness conductor 70µm 38 Strom [A] Draht Leiterbreite [mm] 1x x x x x x x14002 x F ,3mm x x x µm Strom [A] 4,3mm Draht Leiterbreite [mm] 1x x x x x x x x x x Seite 13

14 Wirelaid sample depth-milled bendable area clearance view on embedded wires cross-sectional area of embedded wires Signal processing electronics Power electronics Seite 14

15 Example of use Introduction Design Guide Markets and target groups WIRELAID versus Standard Example of use Advantages of WIRELAID Seite 15

16 Frequently asked questions by customers Mr Jürgen Westenkirchner Business Development Sales Technical Customer Support FAQ about WIRELAID technology experience from everyday professional life 1. Hot Spots aon angled wirelaid tracks 2. Connection of Wirelaid layers 3. Layouting Wirelaid layers Seite 16

17 Frequently asked questions by customers Hot Spots aon angled wirelaid tracks Increased current density Dinstance between wires according to design rules Problem investigation Thermal analysis Explanation: Power derating on ohmic resistance P = I² x R, increased current density S Solution: No hot spots thriugh local high thermal capacity Relation: I [A] = 9,1 [mm²] 0,68 * ΔT [K] 0,43 Seite 17

18 Frequently asked questions by customers Connection of Wirelaid layers No through wire connection Distance between wires according to design guide Connection through pad after wire`s end The more vias the better the thermal management Problem investigation Similar to angled wires, but with a higher local thermal capacity with the help of cable, pressfits, etc» in correlation with the conductivity and the emissivity (radiation, Cu 0,76)) Leads to temperatur increment Seite 18

19 Frequently asked questions by customers Layout For implementing the WIRELAID technology in your PCB build-up, use an additional help layer showing the relevant wires (width and length) in Gerber format The combination of bottom and wirelaid_bottom represents the Wirelaid copper foil in the shown build-up top wirelaid_bottom (Help layer) bottom Seite 19

20 Example of use a) Permanent current load 70 A Allowed temperature 80C before: 8 layer build-up, 6 inner layer 105µm Cu after: 4 layer with embedded wires (highlighted) under one layer Advantages in cost by reduced amount of layers and thickness of copper foil Seite 20

21 Example of use b) Permanent current load 50 A Allowed temperature 80C Before: 3 PCBs, 6 layers with 70µm After: 1 PCB, 6 layers with 70µm + Wirelaid 3D Advantages in cost through production, solder process and omission of connectors Seite 21

22 Markets and target groups Introduction Design Guide Markets and target groups WIRELAID versus Standard Example of use Advantages of WIRELAID Seite 22

23 Applications Automotive Motor electr.. Hybrid techology Gear box electr. Automotive Energy supply Comfort electr. Sensor and monitoring system Seite 23

24 Applications Industrial electronics Con-/inverter Sensor systems Motor drive Thyristor activation control system Industrial electronics Power supply Voltage distribution Switching power supply Seite 24

25 Perspective - Powerflex Embedded wires into depth-milled Semiflex-area Combination of Wirelaid 3D and Semiflex Transfer of signals through Semiflex area Transfer of currents through Wirelaid 3D Seite 25

26 Advantages of Wirelaid Introduction Design Guide Markets and target groups WIRELAID versus Standard Example of use Advantages of WIRELAID Seite 26

27 Vorteile der Technologie High currents without thick copper technology High currents within small areas Combination of power and signal processing electronics on one single layer Partial power management Thinner copper layers possible Cost reduction Economical use of PCB area Reduction of layers Reduced efforts with soldering process Omission of connectors Reliability Electrical connection without cable or connector Improvement of heat dissipation Reduced system costs Seite 27

28 I appreciate your attention. Seite 28