HERZLICH WILLKOMMEN ZUM LIEFERANTEN-INNOVATIONSTAG 2015

Transcription

1 HERZLICH WILLKOMMEN ZUM LIEFERANTEN-INNOVATIONSTAG November 2015 TOGETHER WE MOVE

2 ff TECH-SESSION: VERNETZUNG & ASSISTENZ 14:30 16:00 Uhr TOGETHER WE MOVE

3 ff New Solutions for High Frequency / High Power Applications Michael GÖSSLER, AT&S AG 15:25 15:50 Uhr TOGETHER WE MOVE

4 New Solutions for High Frequency/High Power Applications Magna Tech Day, 18 th of November 2015 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse13 A-8700 Leoben Tel +43 (0) info@ats.net

5 Agenda Short Overview about AT&S High frequency materials for automotive radar Thermal management for high power applications 5

6 AT&S Group AT&S is currently the Technology Leader in HDI* and Any-Layer Boards Highest automated HDI factory in China No. 1 - ECP ** supplier with real commercial and industrial set up Largest European PCB supplier Largest PCB producer in India Supplier of the Top Players in each targeted segment * HDI = High Density Interconnect ** ECP = Embedded Component Packaging 6

7 AT&S Locations Production facilities in Europe and Asia Headquarters in Leoben, Austria Procurement center in Hong Kong, China Design center in Düren, Germany Sales network spanning three continents About ~8000 employees BU IA Plant Ansan, Korea Staff: ~250 Customer Orientation: 13% Automotive 47% Industrial 40% Mobile Devices BU IA Plant Leoben, Austria Headquarters Staff: ~ 900 Customer Orientation: 9% Automotive 91% Industrial AT&S AG Headquarters Leoben, Austria BU IA Plant Fehring, Austria Staff: ~350 Customer Orientation: 44% Automotive 56% Industrial BU IA Plant Nanjangud, India Staff: ~1.100 Customer Orientation: 60% Automotive 40% Industrial BU MS Plant Chongqing, China under construction Staff: ~1000 BU MS Plant Shanghai, China Staff: ~4.500 Customer Orientation: 84% Mobile Devices 14% Automotive 2% Industrial BU MS Headquarters Hong Kong, China AT&S AG Headquarters Sales Offices /Representations Business Unit Mobile Devices & Substrates (BU MS) Business Unit Industrial & Automotive (BU IA) 7

8 AT&S plants AT&S plants / installed capacity [m²]* 710k 300k 130k 380k 120k ~ 200k Fehring Leoben Nanjangud Shanghai Seoul (Korea) Chongqing Technology: DS-PTH, Flex Technology: HDI / Standard ML, Flex Technology: Standard ML Technology: HDI Technology: Flex / ridid-flex Under Construction Volume: low-mid Volume: Samples, Prototyps low-mid Volume: mid-high Volume: high Volume: mid-high IC-substrates Market: IND / AUT Market: IND / AUT Market: IND / AUT Market: MD / IND / AUT Market: MD / IND / AUT * Maximum capacity of plants Source: AT&S 8

9 Agenda Short Overview about AT&S High frequency for automotive radar Thermal management for high power applications 9

10 Radar Cameras are increasingly supported by radar technology for blind spot detection, rear pre-crash, rear cross traffic alert, vehicle assistant and lane change assistant systems. Short range radar 24 GHz (79GHz) and long range radar 77 GHz AT&S produces standard multilayer controller boards as well as hybrid multilayer boards implementing high-frequency materials addressing the requirements for modern automotive radar systems.

11 Frequency Allocation Dilemma Source: ANALOG DEVICES 11

12 RF Roadmap RF Stack up Material (Dk / Df) GHz Homogeneous Stack up FR4 < 3,6 / 0,01 45 GHz Asymmetric Hybrid FR4 < 3,4 / 0, GHz Asymmetric Hybrid + PTFE ( ) FR4 / PTFE < 3 / 0,002 > 80 GHz Homogeneous Stack up with PTFE ( ) PTFE < 3 / 0,002 R&D Implementation Ramp / Volume Homogeneous Stack up Asymmetric Hybrid Stack up 12

13 Material Dk (Dielectric Constant) Df (Dissipation Factor) Frequency Speed Very Low DK PTFE (Teflon), LCP GHz ~12-30 GB/s Df <0.003 Dk Df Low Dk Special Resin & Glass clothes Dk < 30 GHz ~ 10 GB/s Df Enhanced Dk Dk ~4 < 20 GHz ~ 7 GB/s Df > Standard FR4 Dk > 4 < 5 GHz ~ 1,5 GB/s 13

14 Design & PCB Optimization Losses due to the influence of copper foil treatment: Skin Effect 1 Treatment Rz= µm Treatment Rz= 4 17µm Impact of treatment with increasing frequency! 14

15 Design & PCB Optimization Losses based on the PCB structuring : Skin Effect 2 Line Shape Trace Geometric Concept 1 Concept 2 Concept 3 Skin Depth Smooth Line Shape & Trace Geometry reduce losses! 15

16 Agenda Short Overview about AT&S High frequency materials for automotive radar Thermal management for high power applications 16

17 Trends in der Elektronikindustrie Power Electronic must handle high current and ensure sufficient cooling Energy Efficiency - mechanical Solution will be replaced by electronic New LED systems must be cooled (Efficient) Thermal management in highly integrated electronic systems Fotoquelle: Shutterstock 17

18 Our motivation Why? - Modern Electronic is using new components MOSFETs (Metal Oxide Semiconductor Field- Effect Transistors) IGBTs (Insulated Gate Bipolar Transistors) GTOs (Gate Turn-Off Thyristors) High Brightness LEDs (Light Emitting Devices) Trends Smaller Components Higher switched speed Higher current density Miniaturization of modules New materials 18

19 The Motivation Consequences PCB failures caused by weak thermal management (hot spot) Moving away heat from components to other areas of module is getting vital (spreading heat) Advanced and reliable PCB solutions are requested!! 19

20 Thermal Conductive PCBs Combination of 2.5D + Thermal Management + Any Layer construction 2.5D cavity allows for the heat sink to be inserted without increase in z-axis dimension Improved thermal Transfer (reduced Gap between Sensor & Heat Sink) Stacked Micro Vias provide direct connection Sensor / Heat sink Low cost solution for advanced thermal management coefficient of thermal expansion (CTE) same as FR4 positive behaviour during thermal cycling 20

21 Under development - DLC Integration of dielectric layers with very high thermal conductivity in PCB-build up Patent Pending Very thin Layer no influence to other material properties (Dk, CTE ) Heat Spreading over the entire area No additional space Thermal solution More flexibility for design 21

22 Under development - DLC Infra Red (IR) measurements Reference: same build up without Heat Spreading layer with Heat Spreading Layer in the build up 27mm Heat spreading area increases 30% Temperature of the component decreases 3 C 35 mm 22

23 ECP Product Example 2kW Micro Solarinverter 2kWOutput Power High Speed GaN Transistor Embedding on two layers of the PCB Development time 6 months Source : AT&S 23

24 Contact Information In case of any questions Michael Gössler Engineering Manager Fabriksgasse Leoben Tel: +43/3842/200/5687 Mobile: +43/676/

25 ACStyria Autocluster Parkring Raaba-Grambach AUSTRIA TOGETHER WE MOVE