Online Seminar. LED-PCBs for innovative Lighting Systems. 28. April, Copyright, Haeusermann GmbH, 2015

Transcription

1 Online Seminar LED-PCBs for innovative Lighting Systems 28. April, 2015 Copyright, Haeusermann GmbH, 2015 Häusermann GmbH I A-3571 Gars am Kamp I Zitternberg 100 I Tel.: I Fax: I hsmtec@haeusermann.at

2 Presented by Cornelia Trinko Moderator Dipl.-Ing. Stefan Hoerth Application development LED lighting 2

3 Differentiation by innovative product developments, control functions, quality and reliability 3

4 LED-Printed Circuit Boards for innovative lighting systems Agenda 1.Thermal management 2.Multilayer LED PCBs 3.Lifetime / Reliability 4.Multidimensional PCBs 4

5 Company Overview Haeusermann GmbH Printed Circuit Board Manufacturing 1907 founded Innovation leader 2006 Innovation award Austria 2011 European business award Located in Austria / Europe Portfolio Multilayer HDI / Rigid-Flex Boards LED Printed Circuit Boards Thermal management boards High current applications 5

6 Agenda 1 Thermal management 6

7 Achieving a low thermal resistance is the basis for an optimal thermal management Thermal resistance R th = L λ A L. Length of thermal path [m] λ. Thermal conductivity [W/(m K)] A. Total cross sectional area for heat dissipation [m 2 ] Goal: Rapid heatspreading directly below the LED 7

8 Standard FR4 PCBs offer well suited material properties for LED lighting applications Material properties Material Thermal cond. λ [W/mK] Copper RA 300 Aluminum alloy 150 Ceramic LEDs 24 FR Air (unforced) Material Thermal exp. coeff. X/Y [ppm / K] Aluminum 24 Solder 22 Copper 16 FR Ceramic LEDs 4 7 FR4 Material Standard* High Quality* Dielectric strength ~ 40 kv / mm ~ 50 kv / mm Limit temperature Tg CTI (Comparative Tracking Index) Thermal conductivity 135 C 150 C * Indicative values W/mK 0.65 W/mK * Indicative values 8

9 Common solutions: Standard FR4 board FR4 board with Thermal vias L > A << R th 9

10 Common solutions: Plugged FR4 board FR4 board with Plugged thermal vias L = d A << R th d 10

11 Common solutions: Metallic Substrate Boards / IMS Exemplary layer stackup of MC-PCB A λ = typ W/mK λ = typ. 150 W/mK 11

12 HSMtec allows rapid heat speading by direct connection of LED to massive copper Basic principle Heat dissipation Rapid heat dissipation by direct copper connection Optimal heat spreading withing massive copper elements Copper Heat Dissipation FR4 12

13 HSMtec Innovativ FR4 / copper PCBs for highest performance applications Kupferprofile und -drähte integriert in FR4-Leiterplatten ermöglichen High Performance PCBs Intelligente LED Leuchten 3D - Leiterplatten 13

14 HSMtec Innovativ FR4 / copper PCBs for highest performance applications Thick copper pieces embedded into standard FR4-PCBs enable High Performance PCBs Intelligent LED Lighting 3D - PCBs Optimized thermal performance for the highest LED power Electrical isolation up to 4kV integrated into the PCB Thick copper directly below the LED s solderpads Integration of complex electronics within LED PCBs Multilayer boards including thermal management FR4 / copper guarantees highest reliability Individual orientation of single LEDs Innovative designs and mechanics Fully integrated thermal and electrical connections 14

15 Comparison Thermal resistance Type No. Drill Ø Plating Thickn. Rth [K/W] Thermal Vias µ 20µ 1.6 mm 18.5 Plugged Vias µ 20µ 1.6 mm 17.8 Microvias µ filled 0.1 mm 0.3 Blindholes µ 20µ 0.3 mm 0.5 Type Area Th.cond λ [W/mK] Thickn. Rth [K/W] MC-PCB Dielectric Layer TIM Thermal insulation material 2.5 mm µ mm µ x 30 mm µ x 30 mm µ 0.4 DI Stefan Hörth, Ing. Norbert Redl 15

16 Advanced FR4 PCBs provide 2-3 x better thermal performance than comparative technologies Thermal resistance [K/W] 6,0 5,0 4,0 3,0 2,0 1,0 0,0 FR4 - Embedded copper / HSMtec Cu-MC-PCB Alu-MC-PCB FR4, filled / capped Vias 2.5 W/mK Isolation 75µm Dicke 4 W/mK Isolation 100µm Dicke *Based on actual thermal measurement with T3ster. Heatsink directly attached to rearside of HSMtec PCB. 16

17 High Power LED Moduls Application examples Ultra high power LED modules Different LED colours Ø 55 mm LED cluster 144 Osram Oslon Ø 19 mm LED Cluster 30 Cree XB-D Rth 0,15 K/W 50W for one single LED package PCB 4 x 5 cm 17

18 Optional integrated insulation layer for the highest dielectric strength and thermal conductivity Optional: Up to 4 kv dielectric strength directly integrated into the PCB Rapid heat spreading by embedded copper parts Copper HEAT Dissipation FR4 Heatsink 18

19 Isolation after heat spreadind allows to maintain high thermal performance < 3 mm 2 e.g. 8 x 8 mm 2 = 164 mm 2 Factor > 50 Copper HEAT Dissipation FR4 19

20 Agenda 2 Multilayer LED PCBs 20

21 Full integration of intelligent control electronics and thermal dissipation directly on one LED PCB Typical solution 2 PCBs HSMtec solution MC-PCB for LEDs 2 in 1 - FR4 Board Flex-connection FR4 PCB for control electronics Embedded copper profiles support selective thermal management Multilayer boards enable a flexible electrical layout of intelligent control electronics 21

22 RGBW accent lighting module for shops, showrooms, museums etc. Example Up to 50W LED Power 4-Layer PCB to achieve flexible layout for RGBW colour control and drivers Selectively integrated thick copper for highest thermal performance Zhaga book 3 compatible design Colour sensor and microcontroller directly integrated onboard 18 equally distributed red, green, blue and white Osram Oslon LEDs cover the whole colour spectrum *Source: Cogilux 22

23 RGBW accent lighting module for shops, showrooms, museums etc. Driver electronic directly on board Integrated thick copper for rapid heatspreading Complex 4 layer cluster layout for RGBW control Direct connection of LEDs using Microvias 23

24 RGBW accent lighting module for shops, showrooms, museums etc. Vias for electr. layout within cluster Direct connection with microvias Partial thermo-blindholes for direct connection to heatsink on backside Heatsink 24

25 RGBW accent lighting module for shops, showrooms, museums etc. Vias for electr. layout within cluster Direct connection with microvias Flexible layout on layer 3 Kühlkörper 25

26 RGBW accent lighting module for shops, showrooms, museums etc. 26

27 RGBW accent lighting module for shops, showrooms, museums etc. 27

28 RGBW accent lighting module for shops, showrooms, museums etc. 28

29 Multilayer LED boards Application examples Multicolor LED-Wash Stage Spot Light 200 mm Stage luminaire Up to 600W total power (54 x 12W) Control electronics / driver on board 4 Layer Multilayer Board Up to 66W of LED Power 4 different coloured LED chips individually controlled 4-Layer board achieves a flexible layout * Source - Sample Pictures Internet * Source LDDE Vienna 29

30 2 color signal light Thermal solution without separate heatsink PCB solution: 10 Osram Golden Dragon (350mA) per color Design without heatsink Optimized circulation through PCB slots Driver onboard Simple mounting and assembly 30

31 2 color signal light Thermal solution without separate heatsink Original: 10 LEDs a 350mA = 10W Overload: 20 LEDs a 350mA = 20W 31

32 Backlight-illumination module for billboards / advertisement screens cogistrip Simple Plug & Play solution for > 50 modules per chain Direct mounting without paste / foil Fully electrically isolated backside of PCB PCB solution: 6 Oslon Square LEDs each 3W pro LED Integrated copper pieces for optimal heat dissipation. 60µm isolation layer within the PCB Thermal decoupling of LEDs and driver onboard * Source: Cogilux 32

33 Multilayerboard with integrated isolation layer and minimum thermal resistance Several layers for flexible routing Direct heat dissipation and metallic connection FR4 Copper Heatsink Integrated electrical isolation up to > 4kV Embedded thick copper to ensure fastest heat dissipation 33

34 Backlight-illumination module for billboards / advertisement screens Integrated thick copper elements guarantee direct heat dissipation LED driver electronics onboard (4 electr. layers) Simple mounting without past / foils due to integrated electrical isolation layer Direct thermal connection via microvias 34

35 The placing of the LEDs is the basis for a cost efficient PCB design. 35

36 Agenda 3 Reliability / Lifetime 36

37 Thermal stress and temperature differences are a major source of defects for IMS Alu-MC-PCBs Temperature difference Different expansion of Comp. & PCB Mechanical stress to solderjoint Failure due to cracked solderjoint Temperature cycling caused by Operation of device Environmental conditions Switching / dimming Material Expansion [ppm / K] Aluminium 23 Copper 16 FR Ceramic LED 4 8 *Source: Osram OS 37

38 HSMtec enables optimal reliability & lifetime when compared to a typical aluminium IMS / MC-PCB Shear force tests kindly provided by Osram OS have confirmed a high resistance of HSMtec LED PCBs to thermal stress. Shear force as a % of the initial value 100 Data kindly provided by HSMtec / FR4 MC - PCB 0 = initial situation after soldering HSMtec / FR4 MC - PCB HSMtec / FR cycles 1500 cycles HSMtec / FR4 IMS / MC-PCB Number of thermal cycles (- 40 to +125 C) 38

39 HSMtec enables an optimal LED lifetime & reliability when compared to typical Aluminium MC-PCBs Thermal cycle test results Number of thermal cycles - 40 to +85 C tested to 1% failure rate Temperature FR4 copper PCB Alu MC-PCB 0 60 C > 2 x IMS 450 % MC-PCB / IMS - 40 to +85 C > 3.5 x IMS 100 % * Results after 6 months testing time HSMtec Ceramic Data kindly provided by % 200 % 300 % 39

40 Agenda 4 Multidimensional LED PCBs 40

41 Multi-dimensional PCBs enable flexible optics and innovative mechanics 3D Printed Circuit Boards Individual optical orientation of single LEDs Self-supporting stable mechanical structures Innovative design opportunities No separate cabling necessary 41

42 Rapid heat transfer within the board enables innovative thermal concepts Multi-dimensional technology supports use of simple and cheap heatsinks for multiple LED clusters Fully integrated thermal and electrical connections within the 3D board Embedded copper parts to enable Electrical connections Heat transfer Mechanical stability 42

43 Innovative 3D - PCB designs Design workplace luminair 4 x folded PCB Design Assembled on both sides of PCB PCB provides additional functionalities (Touch-panel, self-supporting mechanics, fully integrated connections without cables, optical design element, tilt of LEDs) Source: Ingomaurer 43

44 Manufacturing of 3D PCBs Produced Populated - Bent 1 PCB manufacturing 2 Population of components (flat PCB) 3 Bending of FR4-PCB 4 Assembly of luminaire 44

45 Architectural effect luminaire 360 Ring luminaire LEDs and driver on opposite PCB sides 12 HB-LEDs individually driven Driver directly integrated on same board Simple mounting and handling Solution: * Source: LDDE 4-Layer HSMtec Board Assembled on both sides Fully integrated thermal management and layout 3D ring-shaped luminaire with single LED segments 45

46 Architectural effect luminaire *Source: LDDE 46

47 Architectural effect luminaire Integrated copper elements (width 12mm) ensure direct heat dissipation to the center board and ensure mechanical stability Driver electronics and LEDs assembled on both sides of a 4- layer multilayer-pcb Integrated 0,5mm wires for direct individual electrical control of each LED 47

48 Innovative PCB-designs Application example 360 signal light - helicopter Tunnel flloor light 48

49 Innovative PCB-designs Application example Architectural effect - lighting Bendable line module 49

50 Innovative PCB-designs Application example Street lighting Camera ring - luminaire * Source: Schreder Group G.l.E. * Source: Büchner Lichtsysteme 50

51 Innovative PCB-designs Application example Solar Outdoor luminaire * Source: EcoliGhts 51

52 Support from the first idea to the finished product Haeusermann - Competence center LED lighting Support throughout the whole design/ concept phase Layout support and realisation Thermal measurement and analysis of your PCBs Assembled / 3D formed circuits (via partner assembly companies) 52

53 Summary: Individual PCB-concepts are the key for cost efficient high-end-lighting solutions. Highest thermal performance Innovative optics / designs High power applications / arrays Partial thermal management 3D concepts for optimized illumination Dispense for add. mounting/cabling effort Advanced Standard FR4 / copper boards enable Intelligent lighting control Flexible Layout Lighting Intelligence Hohe Lebensdauer Reliable systems / high lifetime Bewährte Use of well Materialien proven materials FR4 / Kupfer Minimiertes Minimize risk Ausfallrisiko of defects 53

54 Contact We are pleased to assist you throughout the whole design process COMPETENCE CENTER LED-LIGHTING Austria, 3571 Gars am Kamp, Zitternberg 100 Phone Fax Copyright 2014, Häusermann GmbH, Zitternberg 100, A-3571 Gars am Kamp Copying and reposting to other sites only with prior permission of the Partner Häusermann GmbH of Copyright 2015, Häusermann GmbH, Zitternberg 100, A-3571 Gars am Kamp Copying and reposting to other sites only with prior permission of the Häusermann GmbH 54