2016 Unistar Plant Profile
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1 Your Most Reliable Partner Since 2003 Kunshan Unistar Electronics Co., Ltd Unistar Plant Profile
2 History 2003 Formed Unistar Electronics, Co., Ltd, Kunshan, China /Register Capital USD$ 60M 2005 Unistar Plant Operational, Land Area 102,000M2 / Floor Area 22,000 M2/ 300K SF 2006 Formed CT International, LLC, Unistar Plant TS & ISO Certified 2007 Begin MCPCB & Heavy Copper Production 2011 Expansion Floor Area To 26,000M2 /Capacity To 400K SF QC Certified 2011 Award customer ADVANTECH THE BEST SUPPLIER Award customer ARCADYAN THE BEST SUPPLIER Certified HI-TECH patent LED MCPCB MATERIAL 2012 Certified HI-TECH patent TELECOM COPPER PLATING TENTING TECH 2012 Certified HI-TECH patent HAVEY COPPER PCB TECH 2013 Formed CT Europe 2014 Award Automotive customer KEBODA THE BEST SUPPLIER Capacity : 500K SF/M, Employee : 850, Main Product : 2 ~ 12 layer Board of Directors Taoyuan, Taiwan Mr. Louis Wang Chairman CT An-Tung Plant Taoyuan, Taiwan CT Unistar Plant Kunshan, China CT International Atlanta, GA
3 Locations Schillinger Associates Detroit, MI Schillinger Associates Kokomo, IN CT International Birmingham, UK CT China Unistar Plant - Kunshan, China. Manufacturing Floor Area 260k ft 2 Land Area 27 Acres CT International Boston, MA CT International Atlanta, GA Prodigy Electronics Limited JSK High-Tech, Pte., Ltd. Manufacturing Locations Sales & Service Locations CT Taiwan An-Tung Plant - Chung Li, Taiwan. Manufacturing Floor Area 215K ft 2 Land Area 2.5 Acres
4 Products DS & Multilayer HDI Heavy Copper Metal Core
5 Revenue & Capacity Revenue (US$/thousands) Capacity (Ft 2 /mo.) 50,000 45,000 40,000 35,000 30,000 25,000 20,000 15,000 10,000 5, ,000 45, (F) 500, , , , , , , , ,000 50, , , , , , (F)
6 Distribution, Segments, Mix & Finishes Product Distribution Market Segments North America Europe Asia 45% 10% 45% Automotive Communications Computer & Peripherals Industrial/Consumer Industrial Consumer 5% 5% 15% 20% 15% 40% Other 2L Product Mix Finishes 4L 6L 8L 10L+ 24% 15% 15% 43% OSP ENIG / Gold Plating Immersion Silver HASL LF-HASL 5% 15% 10% 30% 40% AL
7 Customers Communications Industrial Computer & Peripherals Automotive
8 Quality Certifications ISO 9001:2008 TS16949:2009 ISO 14001:2004 QC080000:2012 UL:E CQC
9 Capital Investment $4.0 (Unit: US$M) 2016 $3.0 $2.0 $1.0 $ Auto Planarization (via fill) SIR Test AVI Flying Probe Solder Mask Coating (spray) General Automation
10 Capacity Unit : K Ft 2 /month (F) Total Capacity
11 Automotive Product Distribution Asia - China 10% 5% Integrated Electronic Control Panel Europe 60% 30% 10% 10% 15% 35% HVAC & Radio Steering Angle Sensors Steering Column Control Module North America 25% Complex Switches Other
12 Capability Process Item Unit Notes Layers 2-12 Layers 2-12 layers Board Thickness mil General Dimension - Max. 21x24 21x24 inch Impedance Control +/-10 +/-8 % Warpage and Twist 0.007"/inch 0.005"/inch HDI Process 1+C+1 2+C+2 FR4 Tg 150 Available Available NANYA,ITEQ,GRACE,SHEN-YI Material FR4 Tg 180 Available Available Halogen Free ( Tg 150 & Tg 170) Available Available Aluminum Metal 1-2 Layer 1-4 Layer Minimum Space Line to line 3./3. 2.5/2.5 mil Copper thickness: H oz Registration Tolerance 2 2 mil Max. Working Panel Size 22x26 22x26 inch Inner layer Minimum Core Thickness 3 2 mil Etching undercut(total) mil Copper thickness: H oz Etching undercut(total) 1 1 mil Copper thickness: 1 oz Circuit width tolerance +/-10 +/-10 % Copper Weight 1/3 to 4 1/3 to 6 oz
13 Capability Process Item Unit Note Copper thickness 1 oz 3 3 mil Lamination Copper weight ( external ) 1/3 to 4 1/3 to 4 oz Max. Working Panel Size 21x24 21x24 inch Board thickness tolerance +/-3 +/-3 mil Drill Size 6 to to 250 mil Drilling Max. Working Panel Size 21x24 21x24 inch Roughness 1 1 mil Aspect Ratio 8 to 1 8 to 1 PTH Minimum PTH Hole Tolerance 2 2 mil Max. Board Thickness mil Min. Board Thickness mil Dry Film (External) Minimum Space Line to line 3/3 3/3 mil Copper thickness 1 oz Etching Max. Copper Weight: 4 6 oz Circuit Width Tolerance +/-15 +/-10 % Soldermask on BGA Tolerance 2 2 mil Soldermask Registration Solder Mask Tolerance 2 2 mil Solder Dam mil Soldermask Thickness >0.4 >0.4 mil
14 Capability Process Item Unit Note Electroplated Gold 1~ 50 1 ~ 50 u" HASL (Leaded) 50~ ~1000 u" Sub-contracted HASL (Pb Free) 50~ ~1000 u" OSP 0.3~ ~0.6 um Surface Finish 1~3 1~3 μ" Au Immersion Gold/ENIG 100~ ~300 μ" Ni Immersion Silver 6 ~ 25 6 ~ 25 u" Immersion Tin 1.0 ~ ~ 1.2 um Sub-contracted Legend Printing Minimum Space Line 5 4 mil Registration Tolerance 3 3 mil Rout Tolerance +/-4 +/-4 mil V-Cut Tolerance +/-4 +/-4 mil Forming Maximum Array Size 18 X X 17 inch Minimum Jump Score 3 3 mm Bevel Angle 30 ~ 60 30~60 degree
15 Capability Process Item Unit Note Maximum Test Points Per Board (O/S Test) 73, points Minimum SMT Feature Pitch mil Max.Board size 14.4X X11.2 inch Universal Test Continuity Test 20~50 20~50 Ohm Isolation Test 10M 10M Ohm Minimum SMT Feature Pitch 7 6 mil Electrical Testing Max.Board size 21x24 21x24 inch Auto Test Continuity Test 20~50 20~50 Ohm Isolation Test 10M 10M Ohm Minimum SMT Feature Pitch 4 3 mil Max.Board size 21X24 21X24 inch Continuity Test 20~50 20~50 Ohm Flying Probe Test Isolation Test 10M 10M Ohm
16 Unistar Plant Organization President & GM Joseph Hsu Sales & Marketing Ken Wang Manufacturing Eric Li Quality Assurance Paul Yang Administration Seth Liao Finance Vicky Liu Sales Angus Chen Production Se-I Lou Engineering Alan Young Quality Control Peter Hu Marketing Sam Chen Process Engineering Zhiqiang Xu Chemical Lab Junqiang Wang Customer Service Cherolyn Xiao Product Engineering Zhijun Dong Design Engineering
17 Direct Support A MANUFACTURING ORGANIZATION WORKING with Knowledge, Integrity and Precision Angus Chen China 20+ Years Industry Experience 15+ Years Sales and Customer Service Experience 5+ Years PCB Engineering Sam HS Chen China 30+ Years Industry Experience 25+ Years Sales Marketing & Customer Service Experience 17+ Years Engineering and Quality Management Experience. 8+ Years PCB Assembly and Supply Chain Management Experience. Kevin Herring USA 20+ Years Manufacturing & Quality Engineering Experience 14+ Years Industry Experience 6+ Years Automotive PCB Assembly Experience 7+ Years Avionics Technician Experience Kerri McFarland USA 20+ Years Industry Experience 14+ Years Global Account Management, Customer Service, Inside/Outside Sales Experience 8+ Years Manufacturing & Production Control Experience Alex Mikolowsky - USA 35+ Years Industry Experience 25+ Years Manufacturing & Engineering Experience 20+ Years Sales and Customer Service Experience Tony Dry United Kingdom 35+ Years Industry Experience 10+ Years Manufacturing Experience Betty Tseng - Taiwan 18+ Years Industry Experience 10+ Years Sales & Customer Service Experience Ken Wang China 25+ Years Industry Experience 20+ Years Sales, Marketing and Customer Service Experience 5+ Years PCB Manufacturing Experience Sammi Yeh Taiwan 11+ Years Industry Experience 8+ Years Sales, Marketing & Customer Service Experience
18 THANK YOU! America Sales & Service Ms. Kerri McFarland Mobile: Time Zone = UTC -5 Boston, MA USA Unistar Plant Mr. Ken Wang Tel: Ken.wang@ctpcbgroup.com Time Zone = UTC +8 #900, Hanpu Road, Kunshan City, Jiangsu, China. Europe Sales & Service Mr. Tony Dry Tel: Mobile : tony.dry@ctpcbgroup.com Birmingham, UK
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