INPAQ Global RF/Component Solutions

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1 WIP252012Q ZF Series Specification Product Name Series Power Inductor WIP252012Q ZF Series Size EIAJ 2520

2 WIP252012Q ZF Series Engineering Specification 1. Feature This specification applies Low Profile Power Inductors. Halogen free, Lead Free, RoHS Compliance. 2. Explanation of Part Number W I P Q 2 R 2 M Z F : Product Series 2 : Size Code: The first two digitals: length(mm), The last two digitals: width(mm) 3 : Thickness(mm) 4 : Model Code 5 : Inductance (μh) : 2R2=2.2uH 6 : Inductance Tolerance Code: M=±20% ; Y=±30% 7 : Control S/N 3. Construction & Dimensions Series A B C D E WIP252012Q ZF / / max ref ref. Units: mm WIP252012Q ZF Series Engineer Specification Version: A1 Page 1 of 6

3 4. Specifications Part Number Inductance (uh) Tolerance (%) Test Frequency (Hz) DCR (Ω) ±20% I sat (A) I rms (A) Typ. Max. Typ. Max. WIP252012Q-R47Y-ZF 0.47 ±30% 0.1V/1M WIP252012Q-R68Y-ZF 0.68 ±30% 0.1V/1M WIP252012Q-1R0Y-ZF 1.0 ±30% 0.1V/1M WIP252012Q-1R5Y-ZF 1.5 ±30% 0.1V/1M WIP252012Q-2R2M-ZF 2.2 ±20% 0.1V/1M WIP252012Q-4R7M-ZF 4.7 ±20% 0.1V/1M Note: Isat:Based on inductance change( L/L0: -30%)@ ambient temp. 25 Irms:Based on temperature rise ( T:40 typ.) WIP252012Q-R47Y-ZF WIP252012Q-R68Y-ZF WIP252012Q-1R0Y-ZF WIP252012Q-1R5M-ZF WIP252012Q ZF Series Engineer Specification Version: A1 Page 2 of 6

4 WIP252012Q-2R2M-ZF WIP252012Q-4R7M-ZF 5. Appearance Exposed wire tolerance limit of coating resin part on product side. Size of exposed wire occurring to coating resin is specified below. 1. Width direction(dimension a):acceptable when a w/2 Nonconforming when a>w/2 2. Length direction(dimension b):dimension b is not specified. 3. The total area of exposed wire occurring to each sides is not greater than 50% of coating resin area, and is acceptable 6. Material Lists No. Item Material a Core Ferrite Core b Coating Epoxy with magnetic powder c Termination Tin (Pb-Free) d Wire Enameled Copper Wire WIP252012Q ZF Series Engineer Specification Version: A1 Page 3 of 6

5 7. Reliability and Test Condition Item Performance Test Method and Remarks Operating Temperature -55~+125 (For products in unopened tape package, less than 40 ) Electrical Performance Test Inductance L Q SRF DC Resistance Refer to standard electrical characteristic list Agilent-4291, Agilent-4287 Agilent-4192, Agilent-4285 Agilent-4291 Agilent-4338 Rated Current Base on temp. rise & L/L0A 30%. Saturation DC Current (Isat) will cause L0 to drop approximately L(%). Temperature Rise Test Mechanical Performance Test ΔT 40 Max Heat Rated Current (Irms) will cause the coil temperature rise approximately T( ) without core loss. 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Solder Heat Resistance Appearance:No damage. Inductance:within±10% of initial value Q:Shall not exceed the specification value. RDC:within ±15% of initial value and shall not exceed the specification value Temperature ( C) 260 ±5 (solder temp) Time (s) Depth: completely cover the termination Temperature ramp/immersion and emersion rate Number of heat cycles 10 ±1 25mm/s±6 mm/s 1 Solderability Test More than 95% of terminal electrode should be covered with solder. Reliability Test Life Test Thermal shock Humidity Resistance Test Vibration Test Appearance:No damage. Inductance:within±10% of initial value Q:Shall not exceed the specification value. RDC:within ±15% of initial value and shall not exceed the specification value After fluxing,component shall be dipped in a melted solder bath at 235±25 for 4±1seconds. Temperature:125±2 (Bead) Temperature: 85±2 (Inductor) Applied current:rated current Duration:1000±12hrs Measured at room temperature after placing for 24±2 hrs Step1:-40±2 30±5min Step2:25±2 0.5min Step3:105±2 30±5min Number of cycles: 500 Measured at room fempraturc after placing for 24±2 hrs Humidity:85±2 % R.H, Temperature:85 ±2 Duration:1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Oscillation Frequency: 10~2K~10Hz for 20 minutes Equipment: Vibration checker Total Amplitude:0. 15mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations) WIP252012Q ZF Series Engineer Specification Version: A1 Page 4 of 6

6 8. Soldering and Mounting 8-1 Soldering Mildly activated rosin fluxes are preferred. terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure Soldering Iron(Figure 2): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Preheat circuit and products to 150 Never contact the ceramic with the iron tip Use a 20 watt soldering iron with tip diameter of 1.0mm 355 tip temperature (max) 1.0mm tip diameter (max) Limit soldering time to 4~5 sec. 8-2 Recommended PC Board Pattern L(mm) G(mm) H(mm) WIP252012Q ZF Series Engineer Specification Version: A1 Page 5 of 6

7 9. Packaging Information 9-1 Reel Dimension Type A(mm) B(mm) C(mm) D(mm) 7 x8mm 8.4± min. 13± ±2 9-2 Tape Dimension Type Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) WIP252012Q 2.85± ± ± ± ± Packaging Quantity Type PCS/Reel WIP252012Q 2, Tearing off force WIP252012Q ZF Series Engineer Specification Version: A1 Page 6 of 6