Japan China. Recommended Applications AV equipment, Wireless communication equipment and various general electronic equipment.
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1 4. High Power Type PF, PC, PA, PB Japan China Features Low DCR and large current, suitable for power circuit. Wire wound and resin molded chip inductor. (PC, PA, PB type) Non wound structure using unique laser cut method. (PF type) Corespond to Re-fl owsoldering and fl ow soldering. Wide line-up from 1005 size to 4532 size. Good for mounting. Recommended Applications AV equipment, Wireless communication equipment and various general electronic equipment. Explanation of Part Numbers E L J P A 1 R 5 K F Packaging Design No. Product code Shape tolerance Chip Inductors PF PC PA PB N5 10N R22 3R nh 10 nh 220 nh 3.3 µh 47 µh 560 µh D J K M ±0.3 nh ±5 % ±10 % ±20 % F Taping Storage condition Package : Normal temperature ( 5 to 35 C), normal humidity (85 %RH Max.), shall not be exposed to direct sunlight and harmful gas and care should be taken so as not to cause dew. Product on PWB : Temperature 20 to +85 C Storage period In generally, even if storage condition is good, solderability will be down cause of time progress. Please use product within 6 months after received. (In case of over 6 months storage period, use the product after confi rmation of no abnormality of appearance and solderability.) Packaging Soldering condition Caution for use Refer 28 ro 29 page. Refer 30 page. Refer 31 page.
2 PF Type 1005 (0402) 0.2± ± ± ± ± to to to pcs./reel (nh) ( ) max. (ma) max. ELJPF2N2DFB ELJPF2N7DFB ELJPF3N3DFB D : ±0.3 nh ELJPF3N9DFB ELJPF4N7DFB ELJPF5N6DFB ELJPF6N8JFB ELJPF8N2JFB 8.2 J : ± 5 % ELJPF10NJFB
3 PC Type 2520 (1008) ± ± ± to to to ± pcs./reel ( ) max. (ma) max. ELJPC1R0MF ELJPC1R5MF ELJPC2R2MF 2.2 M : ±20 % ELJPC3R3MF ELJPC4R7MF ELJPC6R8KF ELJPC100KF ELJPC120KF K : ±10 % ELJPC150KF ELJPC220KF ELJPC330KF
4 PA Type 3225 (1210) 3.2± ± ± ± to to to ± pcs./reel ( ) max. (ma) max. ELJPA1R0MF ELJPA1R5MF ELJPA2R2MF M : ±20 % ELJPA3R3MF ELJPA4R7MF ELJPA6R8MF ELJPA100KF ELJPA120KF ELJPA150KF ELJPA180KF ELJPA220KF ELJPA270KF ELJPA330KF ELJPA390KF ELJPA470KF ELJPA560KF 56 K : ±10 % ELJPA680KF ELJPA820KF ELJPA101KF ELJPA121KF ELJPA151KF ELJPA181KF ELJPA221KF ELJPA271KF ELJPA331KF
5 PB Type 4532 (1812) 4.5± ± ± to to ± to ± pcs./reel ( ) max. (ma) max. ELJPB100KF ELJPB120KF ELJPB150KF ELJPB180KF ELJPB220KF ELJPB270KF ELJPB330KF ELJPB390KF ELJPB470KF 47 K : ±10 % ELJPB560KF ELJPB680KF ELJPB820KF ELJPB101KF ELJPB121KF ELJPB151KF ELJPB181KF ELJPB221KF
Recommended Applications AV equipment, Wireless communication equipment and various types of general electronic equipment.
4. High Power Type PF, PE, PC, PA, PB, LC, LA Features Low DCR and large current capability, suitable for power circuitry. Wire wound, resin molded chip inductor. (PC, PA, PB, LC, LA type) Unique Ceramic
More informationRecommended Applications AV equipment, Wireless communication equipment and various types of general electronic equipment.
4. High Power Type PF, PE, PC, PA, PB Features Low DCR and large current capability, suitable for power circuitry. Wire wound, resin molded chip inductor. (PC, PA, PB types) Unique Ceramic Core/Laser-cut
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1. High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA Features High frequency capability due to its non magnetic core. Capable of being Re-fl ow or fl ow soldered. Wide line-up from 5 to 3225 case
More informationRecommended Applications AV equipment, Wireless communication equipment and various types of general electronic equipment.
4. High Power Type PF, PE, PC, PA, PB, LC, LA Features Low DCR and large current capability, suitable for power circuitry. Wire wound, resin molded chip inductor. (PC, PA, PB, LC, LA type) Unique Ceramic
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