Prevention of electromagnetic interference to signals on the secondary side of electronic equiepmet.

Transcription

1 Multilayer Ferrite Chip Inductors - CKFI Features 1. Monolithic structure for high reliability compact size inductor possible. 2. No cross coupling due to magnetic shield. 3. Perfect shape for mounting with no directionality. 4. Excellent solderability and high heat resistance for either wave flow or reflow soldering. Applications Prevention of electromagnetic interference to signals on the secondary side of electronic equiepmet. Dimensions and Construction Dimensions in mm TYPE L W T a C D E ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± Part Numbering System CKFI nH / K Electrical Characteristics (1) Operating Temperature Ranges: -25~85. (2) Rated Current: DC current at which the inductance drops approximate 10% from its value without current. Electrical Parameters TOLERANCE INDUCTANCE SIZE CODE SERIES NAME Page:1

2 CKFI0402 Series Part No. Inductance (nh) Test Frequency Q DCR (Ω)Max SRF Rated Current (ma)max CKFI nH/K 47±10% CKFI nH/K 56±10% CKFI nH/K 68±10% CKFI nH/K 82±10% CKFI uH/K 100±10% CKFI uH/K 120±10% CKFI uH/K 150±10% CKFI uH/K 180±10% CKFI uH/K 220±10% CKFI uH/K 270±10% CKFI uH/K 330±10% CKFI uH/K 390±10% CKFI uH/K 470±10% CKFI uH/K 560±10% CKFI uH/K 680±10% CKFI uH/K 820±10% CKFI uH/K 1000±10% Remark Page:2

3 CKFI0603 Series Part No. Inductance (uh) Test Frequency Q DCR (Ω)Max SRF Rated Current (ma)max CKFI nH/M 0.010±20% CKFI nH/M 0.033±20% CKFI nH/M 0.047±20% CKFI nH/M 0.056±20% CKFI nH/M 0.068±20% CKFI nH/M 0.082±20% CKFI nH/K 0.10±10% CKFI nH/K 0.12±10% CKFI nH/K 0.15±10% CKFI nH/K 0.18±10% CKFI nH/K 0.22±10% CKFI nH/K 0.27±10% CKFI nH/K 0.33±10% CKFI nH/K 0.39±10% CKFI nH/K 0.47±10% CKFI nH/K 0.56±10% CKFI nH/K 0.68±10% CKFI nH/K 0.82±10% CKFI uH/K 1.0±10% CKFI uH/K 1.2±10% CKFI uH/K 1.5±10% CKFI uH/K 1.8±10% CKFI uH/K 2.2±10% CKFI uH/K 2.7±10% CKFI uH/K 3.3±10% CKFI uH/K 3.9±10% CKFI uH/K 4.7±10% CKFI uH/K 5.6±10% CKFI uH/K 6.8±10% CKFI uH/K 8.2±10% CKFI uH/K 10±10% CKFI uH/K 12±10% CKFI uH/K 15±10% CKFI uH/K 18±10% CKFI uH/K 22±10% Remark Page:3

4 CKFI0805 Series Part No. Inductance (uh) Test Frequency Q DCR (Ω)Max SRF Rated Current (ma)max Remark CKFI nH/M 0.022±20% T:0.9 CKFI nH/M 0.033±20% T:0.9 CKFI nH/M 0.047±20% T:0.9 CKFI nH/M 0.056±20% T:0.9 CKFI nH/M 0.068±20% T:0.9 CKFI nH/M 0.082±20% T:0.9 CKFI nH/K 0.10±10% T:0.9 CKFI nH/K 0.12±10% T:0.9 CKFI nH/K 0.15±10% T:0.9 CKFI nH/K 0.18±10% T:0.9 CKFI nH/K 0.22±10% T:0.9 CKFI nH/K 0.27±10% T:0.9 CKFI nH/K 0.33±10% T:0.9 CKFI nH/K 0.39±10% T:0.9 CKFI nH/K 0.47±10% T:0.9 CKFI nH/K 0.56±10% T:0.9 CKFI nH/K 0.68±10% T:0.9 CKFI nH/K 0.82±10% T:0.9 CKFI uH/K 1.0±10% T:0.9 CKFI uH/K 1.2±10% T:0.9 CKFI uH/K 1.5±10% T:0.9 CKFI uH/K 1.8±10% T:0.9 CKFI uH/K 2.2±10% T:0.9 CKFI uH/K 2.7±10% T:1.2 CKFI uH/K 3.3±10% T:1.2 CKFI uH/K 3.9±10% T:1.2 CKFI uH/K 4.7±10% T:1.2 CKFI uH/K 5.6±10% T:1.2 CKFI uH/K 6.8±10% T:1.2 CKFI uH/K 8.2±10% T:1.2 CKFI uH/K 10±10% T:1.2 CKFI uH/K 12±10% T:1.2 CKFI uH/K 15±10% T:1.2 CKFI uH/K 18±10% T:1.2 CKFI uH/K 22±10% T:1.2 CKFI uH/K 27±10% T:1.2 Page:4

5 CKFI1206 Series Part No. Inductance (uh) Test Frequency Q DCR (Ω)Max SRF Rated Current (ma)max CKFI nH/M 0.047±20% CKFI nH/M 0.056±20% CKFI nH/M 0.068±20% CKFI nH/M 0.082±20% CKFI nH/K 0.10±10% CKFI nH/K 0.12±10% CKFI nH/K 0.15±10% CKFI nH/K 0.18±10% CKFI nH/K 0.22±10% CKFI nH/K 0.27±10% CKFI nH/K 0.33±10% CKFI nH/K 0.39±10% CKFI nH/K 0.47±10% CKFI nH/K 0.56±10% CKFI nH/K 0.68±10% CKFI nH/K 0.82±10% CKFI uH/K 1.0±10% CKFI uH/K 1.2±10% CKFI uH/K 1.5±10% CKFI uH/K 1.8±10% CKFI uH/K 2.2±10% CKFI uH/K 2.7±10% CKFI uH/K 3.3±10% CKFI uH/K 3.9±10% CKFI uH/K 4.7±10% CKFI uH/K 5.6±10% CKFI uH/K 6.8±10% CKFI uH/K 8.2±10% CKFI uH/K 10±10% CKFI uH/K 12±10% CKFI uH/K 15±10% CKFI uH/K 18±10% CKFI uH/K 22±10% CKFI uH/K 27±10% Remark Page:5

6 Packaging 1. Packaging -Cover Tape The force for tearing off cover tape is 10 to 100 grams in the arrow direction. 2. Tape Dimensions(Unit:mm) Type A B T W P F K Tape Type / B / B 0805(T:0.9mm) / B 0805(T:1.2mm) A A 3. Reel Dimensions (Unit:mm) A B C D Page:6

7 4. Packaging Quantity Type Pcs/Reel , , (T:0.9mm) 4, (T:1.2mm) 3, ,000 Page:7

8 Reliability No. Item Specification Test Method Test device shall be soldered on the substrate Substrate Dimension: 100x40x1.6mm 1 Flexure Strength Deflection: 2.0mm The forces applied on the right conditions must not damage the terminal electrode and the ferrite. Keeping Time: 30sec *For , substrate dimension is 100x40x0.8mm Test device shall be soldered on the substrate 2 Vibration Oscillation Frequency: 10 to 55 to 10Hz for 1min Amplitude: 1.5mm Time: 2hrs for each axis (X, Y & Z), total 6hrs 3 Resistance to Soldering Heat Appearance: No damage More than 75% of the termina Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free ) electrode should be covered with solder. Inductance: within ±15% of initial value Q: within ±30% of initial value Inductance: within ±20% of initial value Pre-heating: 150, 1min Solder Temperature: 260±5 Immersion Time: 10±1sec Pre-heating: 150, 1min 4 Solder ability The electrodes shall be at least 95% covered with new solder coating Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free) Solder Temperature: 245±5 (Pb-Free) Immersion Time: 4±1sec One cycle: Step Temperature ( ) Time (min) 1-25± Temperature Cycle 2 25± ± ±2 3 Total: 100cycles Measured after exposure in the room condition for 6 Humidity Resistance Appearance: No damage Inductance:within±10% of initial value Q change:within±30% of initial value 24hrs Temperature: 40±2 Relative Humidity: 90 ~ 95% / Time: 1000hrs Measured after exposure in the room condition for 24hrs Temperature: 85±3 7 High Temperature Resistance Relative Humidity: 20% Applied Current: Rated Current / Time: 1000hrs Measured after exposure in the room condition for 24hrs 8 Low Temperature Resistance Temperature: -25±3 Relative Humidity: 0% / Time: 1000hrs Measured after exposure in the room condition for 24hrs Page:8