FrelTec GmbH. SMD Power Inductors

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1 GmbH Mathildenstr. 10A Starnberg Germany 10/12/2011 1/13 GmbH

2 SPECIFICATION Part Number * G * 100 * M E02 * Type Size Use Value Packing 107 : SMD Power Inductor : 2,5x2,0x1,0 G : General use : 2,5x2,0x1,2 C : Choke use The value is given in µh and u indicates the decimal point. When higher than 100µH then l the last digit is the multiplier which denotes the number of J: ±5% E02 : 2000pcs for , , , and (7" reel) K: ±10% E01 : 1000pcs for (13" reel) zero following : 3,2x1,6x1,8 Example: M: ±20% E0A : 500pcs for (7" reel) : 3,2x2,5x1,55 3U3 : 3,3 µh N: ±30% : 3,2x2,5x2,0 220 : 22 µh : 4,5x3,2x2,6 101 : 100 µh : 5,7x5,0x4,7 * not all combination is possible 10/12/2011 2/13 GmbH

3 Dimensions and land pattern: Type A B C E F H I J ,5±0,2 2,0±0,2 1,0 max, 0,4±0,2, 1,0min, 2,1 0,90 0, ,5±0,2 2,0±0,2 1,2 max, 0,4±0,2, 1,0min 2,1 0,90 0, ,2±0,3 1,6±0,2 1,8±0,3 0,7min, 0,7min, 1,5 1,5 1, ,2±0,3 2,5±0,2 1,55±0,3 0,7min, 0,7min, 2,0 1,5 1, ,2±0,3 2,5±0,2 2,0±0,3 0,7min, 0,7min, 2,0 1,5 1, ,5±0,3 3,2±0,2 2,6±0,3 1,0min, 1,0min, 3,0 2,0 1, ,7±0,3 5,0±0,3 4,7±0,5 1,3min, 1,7min, 5,0 2,0 2,0 unit: mm Inductance and rated current ranges ,47~10μH 2,80~0,65A ,47~10μH 3,70~0,9A ,00~100μH 1,00~0,1A ,00~560μH 0,445~0,04A ,00~2200μH 0,50~0,03A C 0,12~100μH 0,97~0,08A C 0,47~120μH 3,40~0,17A C 1,00~560μH 1,00~0,06A C 1,00~470μH 1,08~0,09A C 0,12~10000μH 6,00~0,05A Electrical specifications at 25 C 10/12/2011 3/13 GmbH

4 Electrical Characteristics G- Type DCR (Ω) max. I rms(a) typical I sat(a) typical U47 0,47 0,048 2,30 2,80 1U0 1,0 0,085 1,70 2,00 1U5 1,5 0,128 1,40 1,70 2U2 2,2 0,190 1,10 1,40 M 1MHz, 0,1V 3U3 3,3 0,304 0,94 1,20 4U7 4,7 0,440 0,78 0,98 6U8 6,8 0,541 0,70 0,82 0,854 0,52 0, G- Type DCR (Ω) max I rms(a) typical I sat(a) typical U47 0,47 0,056 2,20 3,70 1U0 1,0 0,088 1,80 2,70 1U5 1,5 0,126 1,50 2,20 2U2 2,2 0,155 1,30 2,00 3U3 3,3 M 1MHz, 0,1V 0,272 1,00 1,60 4U7 4,7 0,406 0,81 1,30 5U6 5,6 0,450 0,72 1,15 6U8 6,8 0,612 0,66 1,10 0,756 0,59 0, G- Type DCR IDC SRF (Ω) max. (A) max. (MHz) min. 1U0 1,0 0,078 1, N 1U5 1,5 0,068 1, U2 2,2 0,126 0, M 4U7 4,7 0,195 0, ,420 0, MHz, 0,1V 0,750 0, ,000 0, K 1,400 0, ,200 0, ,200 0, ,500 0, /12/2011 4/13 GmbH

5 G- Type Toleran ce Conditio n Quality Factor Spec. min. DCR (Ω) max. IDC (A) max. SRF (MHz) min. 1U0 1,0 0,50 0, M 1U2 1,2 0,60 0, U5 1,5 0,60 0, U8 1,8 0,70 0, U2 2,2 0,80 0, U7 2,7 0,90 0, U3 3,3 1,00 0, K, M 3U9 3,9 1,10 0, U7 4,7 1,20 0, U6 5,6 1,30 0, U8 6,8 1,50 0, U2 8,2 1,60 0, MHz, 0,1V 1,80 0, ,00 0, ,20 0, ,50 0, MHz, 0,1V 2,80 3,10 0,150 0, ,50 0, ,90 0, ,30 0, ,90 0, ,50 0,080 9,0 J, K ,20 0,070 8, ,00 0,080 8, ,00 0,075 7, ,30 0,070 7, ,20 0,065 6, KHz, 0,1V 11,80 12,50 0,065 0,065 5,5 5, ,00 0,065 5, ,00 0,050 5, ,00 0,045 5, ,00 0,040 5,0 ref 10/12/2011 5/13 GmbH

6 G- Type 1U0 1,0 Quality Factor Spec. min. DCR (Ω) max. IDC (A) max. SRF (MHz) min. 0,20 0, U2 1,2 0,20 0, U5 1,5 0,30 0, U8 1,8 0,30 0, M 20 2U2 2,2 0,30 0, U7 2,7 0,32 0, U3 3,3 0,35 0, U9 3,9 0,38 0, U7 4,7 0,40 0, U6 5,6 0,47 0, K, M 30 6U8 6,8 0,50 0, U2 8,2 0,56 0, MHz, 0,1V 0,56 0, ,62 0, ,73 0, MHz, 0,82 0, ,1V 0,94 0, ,10 0, ,20 0, ,40 0, ,50 0, ,70 0,200 9, ,90 0,180 8, ,20 0,170 7, J, K 3,70 0,130 5, KHz, 6,80 0,100 4, ,1V 8,20 0,095 3,6 40 2,50 0,160 6, ,00 0,150 6, ,50 0,120 5, ,40 0,110 4, ,70 0,090 3, ,80 0,080 3, ,50 0,070 2, ,00 0,065 2, ,50 0,060 2,2 1KHz, ,00 0,050 2,0 0,1V ,00 0,045 1,8 252KHz, ,00 0,040 1,6 0,1V ,00 0,035 1, ,00 0,030 1,3 10/12/2011 6/13 GmbH

7 C- High currency type (choke use) DCR IDC SRF (Ω) max. (A) max. (MHz) min. U12 0,12 0,112 0, U22 0,22 0,140 0, U47 0,47 0,210 0, U68 0,68 M 0,250 0, U0 1,0 0,364 0, U2 2,2 0,533 0, U3 3,3 0,700 0, MHz, 0,1V 4U7 4,7 0,845 0, K, M 6U8 6,8 1,350 0, ,690 0, ,900 0, J, K 4,700 0, ,40 0, ,60 0, C- High currency type (choke use) DCR (Ω) ±20% Isat (A) max. Irms (A) max. SRF (MHz) min. U47 0,47 0,030 3,40 2, U0 1,0 0,045 2,30 2, U5 1,5 0,057 1,75 1, U2 2,2 N 0,076 1,55 1, U3 3,3 0,120 1,25 1, U7 4,7 0,180 1,00 1, U8 6,8 0,240 0,85 0, MHz, 0,380 0,75 0, ,1V ,570 0,60 0, ,810 0,50 0, M 1,150 0,38 0, ,780 0,33 0, ,280 0,28 0, ,700 0,18 0, ,380 0,17 0, C- High currency type (choke use) DCR IDC SRF (Ω) max. (A) max. (MHz) min. 1U0 1,0 0,078 1, U2 2,2 0,126 0, U3 3,3 0,165 0, M 4U7 4,7 0,195 0, U8 6,8 0,330 0, ,572 0, ,923 0, K, M MHz, 0,1V 1,690 0, ,550 0,100 8, ,100 0,080 7, ,92 0,070 5, J, K 13,00 0,060 4, ,10 0,060 4, ,70 0,060 3, ,60 0,060 3,4 10/12/2011 7/13 GmbH

8 C- High currency type (choke use) DCR IDC SRF (Ω) max. (A) max. (MHz) min. 1U0 1,0 0,08 1, U5 1,5 0,09 1, M 2U2 2,2 0,11 0, U3 3,3 0,13 0, U7 4,7 0,15 0, K, M 6U8 6,8 0,20 0, ,24 0, ,32 0, MHz, 0,1V ,60 0, ,00 0, ,10 0, J, K 1,70 0,220 8, ,20 0,190 6, ,50 0,130 5, ,00 0,110 4, ,80 0,100 3, KHz, 0,1V 8,50 0,090 3, C- High currency type (choke use) DCR (Ω) max. IDC (A) max. SRF (MHz) min. U12 0,12 0,0098 6, U27 0,27 0,0140 5, U47 0,47 0,0182 4, U0 1,0 0,0270 4, U5 1,5 M 0,0310 3, U2 2,2 0,0410 3, U3 3,3 0,0500 2, U7 4,7 1MHz, 0,1V 0,0574 2, U8 6,8 0,1040 2, ,1300 1, ,210 1, ,266 1, ,448 0, ,560 0, ref ,938 0,640 7, ,204 0,560 6, ,660 0,420 5,0 K, M KHz, 3,360 0,320 4, ,1V 6,160 0,270 3, ,560 0,240 2, ,34 0,190 1, ,42 0,150 1, ,10 0,100 1,2 10KHz, 0,1V ,04 0,070 0, ,0 0,050 0,5 10/12/2011 8/13 GmbH

9 Tape and Reel Dimensions INDUCTORS Type Tape size W P unit: mm 10/12/2011 9/13 GmbH

10 Cover Tape Peel off Strength Peel-off force should be in the range 0,1N~0,6N at a peel-off speed of 300±10 mm/min Storage Temperature: 25±3 C Humidity < 80%RH Caracteristics /252012/ C Temperature range: -55 C to +125 C Rated DC Current(I sat): The current when the inductance becomes 30% typical its initial value (Ta=25 C). Temperature Rise Current(I rms): The actual current when the temperature of coil becomes T40 C. (Ta=25 C) Caracteristics /322520/ C/ C/453226/ C/ C Operating temperature range: -40 C to +85 C Rated DC Current: The current when the inductance becomes 10% lower than its initial value or the current when the temperature of coil increases T20 C. The smaller one is defined as Rated DC Current. (Ta=25 C) ead Free Reflow Soldering Profile Stock period The performance of these products, including the solderability, is guaranteed for 6 month after production date code, provided that they remain packed as they were when delivered and stored at a temperature of 25 C ± 3 C and a relative humidity less than 80%RH 10/12/ /13 GmbH

11 Environmental Items Specifications s / Methods High temperature Storage ow temperature Storage test Humidity test Thermal shock test Mechanical No case deformation or change in appearance. / 10% Q/Q 30% Temperature 85±2 C, Time: 48±2 hours, ed after 1hour at room temperature. Temperature -25±2 C, Time: 48±2 hours, ed after 1hour at room temperature. Temperature 40±2 C, 90~95% relative humidity Time: 96±2 hours, apply rated current, ed after 1hour at room temperature. First -25 C 30minutes then 25 C 10 minutes last 85 C 30 minutes, as 1 cycle. Go through 5 cycles. ed after 1 hour at room temperature. Items Specifications s / Methods Solderability test Heat endurance of Reflow soldering Vibration test Shock resistance Terminal area must have 90% minimum solder coverage. No case deformation or change in appearance. / 10% Q/Q 30% Product with ead-free terminal: Dip pads in flux then dip in solder pot at 245±5 C for 3 seconds. Refer to the reflow soldering condition. Go through 3 times. Apply frequency 10~55Hz. 1,5mm amplitude in each of perpendicular direction for 2 hours. Drop down with 981m/s 2 (100G) shock attitude upon a rubber block method shock testing machine, for 1 time. In each of three orientations. 10/12/ /13 GmbH

12 For this part: It does not use the materials that include the substances specified in RoHS, the detail refer to the part of prohibition or exclusion items in RoHS (2002/95/EC). Cadmium and cadmium compounds (permissive content<100 ppm) ead and lead compounds (permissive content<1000 ppm) Exceptions specified: ead contained in the glass of cathode ray tubes, electronic components and fluorescent tubes. The glass material used in the electronic components, which includes resistor elements, conductive pastes (silver or copper ones), adhesives, glass frit and sealing materials. Mercury and its mercury compounds (permissive content<1000 ppm) Hexavalent chromium compounds (permissive content<1000 ppm) Polybrominated biphenyls (PBB) (permissive content<1000 ppm) Polybrominated diphenylethers (PBDE) (permissive content<1000 ppm) 10/12/ /13 GmbH

13 Published by GmbH Mathildenstr. 10A; Starnberg; Germany 2010 GmbH. All Rights Reserved. The following applies to all products named in this publication: 1. The information describes the type of component and shall not be considered as assured characteristics. 2. Terms of delivery and rights to change design reserved. 3. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. Nevertheless, we explicitly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 4. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 5. The warnings, cautions and product-specific notes must be observed. 6. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous ). Useful information on this will be found in our Material Data Sheets. Should you have any more detailed questions, please contact our sales offices. 7. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true for the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. 8. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the General conditions for the supply of products and services of the electrical and electronics industry published by the German Electrical and Electronics Industry Association (ZVEI), available at 9. As far as patents or other rights of third parties are concerned, liability is only assumed for components per se, not for applications, processes and circuits implemented within components or assemblies. 10. The trade name is a trademark registered or pending in Europe and in other countries. 10/12/ /13 GmbH

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