LBZX84XXXXLT1G SEMICONDUCTOR. 225 mw SOT-23 Zener Voltage Regulator Diodes. Zener Voltage Regulator Diodes. SERIES 225mW SOT-23 TECHNICAL DATA

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1 SEMICONDUCTOR TECHNICAL DATA 225 mw SOT-23 Zener Voltage Regulator Diodes GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP Zener Voltage Regulator Diodes LBZX84XXXXLTG SERIES 225mW SOT-23 3 Cathode 3 Anode 2 Pb-Free package is available MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260 C for 0 seconds SOT 23 (TO 236AB) PLASTIC THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FR-5 Board* P D 225 mw T A = 25 C Derate above 25 C.8 mw/ C Thermal Resistance Junction to Ambient R QJA 556 C/W Total Device Dissipation P D 300 mw Alumina Substrate,** T A = 25 C Derate above 25 C 2.4 mw/ C Thermal Resistance Junction to Ambient R QJA 47 C/W Junction and Storage Temeprature T J, T stg 50 C **FR-5 =.0 x 0.75 x 0.62 in. **Alumina = 0.4 x 0.3 x in. 99.5% alumina. Ordering Information Device Package Shipping LBZX84XXXXLTG SOT /Tape&Reel LBZX84XXXXLT3G SOT /Tape&Reel /5

2 GENERAL DATA 225mW SOT-23 ELECTRICAL CHARACTERISTICS BZX84CxxxLT SERIES (STANDARD TOLERANCE) (Pinout: -Anode, 2-No Connection, 3-Cathode) (T A = 25 C unless otherwise noted, V F = 0.90 V I F = 0 ma) (Devices listed in bold, italic are ON Semiconductor Preferred devices.) Device* Device Marking V Z ZT =5mA (Note 3) Z ZT ( I ZT = 5 ma V Z2 ZT2 =ma (Note 3) Z ZT2 ( I ZT2 = 0 ma V Z3 ZT3 =20mA (Note 3) Min Nom Max Min Max Min Max Z ZT3 ( I ZT3 = 20 ma Max Reverse Leakage Current VZ I ZT = 5 ma I R V R Volts Min Max C V R = 0 f = MHz LBZX84C2V4LTG Z LBZX84C2V7LTG Z LBZX84C3V0LTG Z LBZX84C3V3LTG Z LBZX84C3V6LTG Z LBZX84C3V9LTG Z LBZX84C4V3LTG W LBZX84C4V7LTG Z LBZX84C5VLTG Z LBZX84C5V6LTG Z LBZX84C6V2LTG Z LBZX84C6V8LTG Z LBZX84C7V5LTG Z LBZX84C8V2LTG Z LBZX84C9VLTG Z LBZX84C0LTG Z LBZX84CLTG Y LBZX84C2LTG Y LBZX84C3LTG Y LBZX84C5LTG Y LBZX84C6LTG Y LBZX84C8LTG Y LBZX84C20LTG Y LBZX84C22LTG Y LBZX84C24LTG Y Device Device Marking V Z ZT =2mA Z ZT I ZT = 2 ma V Z2 ZT2 = 0. m- A Z ZT2 I ZT4 = 0.5 ma V Z3 ZT3 =0mA Min Nom Max Min Max Min Max Z ZT3 I ZT3 = 0 ma Max Reverse Leakage Current VZ (mv/k) I ZT = 2 ma I R V R (V) Min Max C V R = 0 f = MHz LBZX84C27LTG Y LBZX84C30LTG Y LBZX84C33LTG Y LBZX84C36LTG Y LBZX84C39LTG Y LBZX84C43LTG Y LBZX84C47LTG Y LBZX84C5LTG Y LBZX84C56LTG Y LBZX84C62LTG Y LBZX84C68LTG Y LBZX84C75LTG Y Zener voltage is measured with a pulse test current I Z at an ambient temperature of 25 C. 2/5

3 GENERAL DATA 225mW SOT 23 TYPICAL CHARACTERISICS θ VZ, TEMPERATURE COEFFICIENT (mv/ C) 8 7 TYPICAL T C VALUES 6 FOR MMBZ522BLT SERIES 5 4 V I ZT θ VZ, TEMPERATURE COEFFICIENT (mv/ C) 00 0 TYPICAL T C VALUES FOR MMBZ522BLT SERIES V I ZT 0 00 V Z, NOMINAL ZENER VOLTAGE (V) Figure. Temperature Coefficients (Temperature Range 55 C to +50 C) V Z, NOMINAL ZENER VOLTAGE (V) Figure 2. Temperature Coefficients (Temperature Range 55 C to +50 C) Z ZT, DYNAMIC IMPEDANCE (Ω) K 00 0 I Z = ma 5 ma 20 ma T J = 25 C I Z(AC) = 0. I Z(DC) f = khz 50 C 75 C 25 C 0 C I F, FORWARD CURRENT (ma) V (MMBZ5267BLT) 9 V (MMBZ5270BLT) V Z, NOMINAL ZENER VOLTAGE Figure 3. Effect of Zener Voltage on Zener Impedance V F, FORWARD VOLTAGE (V) Figure 4. Typical Forward Voltage 3/5

4 GENERAL DATA 225mW SOT 23 TYPICAL CHARACTERISICS C, CAPACITANCE (pf) V BIAS V BIAS BIAS AT 50% OF V Z NOM T A = 25 C I R, LEAKAGE CURRENT (µa) C +25 C 55 C 0 00 V Z, NOMINAL ZENER VOLTAGE (V) Figure 5. Typical Capacitance V Z, NOMINAL ZENER VOLTAGE (V) Figure 6. Typical Leakage Current T A = 25 C T A = 25 C I Z, ZENER CURRENT (ma) 0 0. I Z, ZENER CURRENT (ma) V Z, ZENER VOLTAGE (V) Figure 7. Zener Voltage versus Zener Current (V Z Up to 2 V) V Z, ZENER VOLTAGE (V) Figure 8. Zener Voltage versus Zener Current (2 V to 9 V) 4/5

5 GENERAL DATA 225 mw SOT-23 Zener Voltage Regulator Diodes Surface Mounted 225 mw SOT-23 NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D G H J K L S V V G 3 2 B S STYLE 8: PIN. ANODE 2. NO CONNECTION 3. CATHODE C D H K J ( ) inches mm SOT-23 Footprint (Refer to Section 0 for Surface Mount, Thermal Data and Footprint Information.) MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Package Option Type No. Suffix MPQ (Units) Tape and Reel T 3K Tape and Ammo T3 0K (Refer to Section 0 for more information on Packaging Specifications.) 5/5

6 Tape & Reel and Packaging Specifications for Small-Signal Transistors, FETs and Diodes Embossed Tape and Reel is used to facilitate automatic pick and place equipment feed requirements. The tape is used as the shipping container for various products and requires a minimum of handling. The antistatic/conductive tape provides a secure cavity for the product when sealed with the peel back cover tape. Two Reel Sizes Available (7"and 3",) SOT 23, SC 70/SOT 323, Used for Automatic Pick and Place Feed Systems SC 89, SC 88/SOT 363, SC 88A/SOT 353, Minimizes Product Handling SOD 323, SOD-523 in Tape EIA 48,, 2 Use the standard device title and add the required suffix as listed in the option table below (Table ). Note that the individual reels have a finite number of devices depending on the type of product contained in the tape. Also note the minimum lot size is one full reel for each line item, and orders are required to be in increments of the single reel quantity. SOD-323 SC-59, SC-70, SC-75,SOT-23 SC-88, SOT-363 T Orientation SC-88A, SOT-353 T Orientation Direction of Feed Typical Reel Orientations Table. EMBOSSED TAPE AND REEL ORDERING INFORMATION Package SOT 23 SC 70/SOT 323 SC 89 SC 88/SOT-363 SC 88A/SOT-353 SOD-323 Tape Width Pitch Reel Size Devices Per Reel Device (mm) mm mm(inch) and Minimum Suffix Order Quantity (7) 3,000 T (3) 0,000 T (7) 3,000 T (3) 0,000 T (7) 3,000 T (3) 0,000 T (7) 3,000 T (3) 0,000 T (7) 3,000 T (3) 0,000 T (7) 3,000 T (3) 0,000 T3 SOD (7) 3,000 T (3) 0,000 T3

7 EMBOSSED TAPE AND REEL DATA FOR DISCRETES CARRIER TAPE SPECIFICATIONS K t D P 0 P 2 0 Pitches Cumulative Tolerance on Tape ± 0.2mm( ± ) Top Cover Tape A 0 E F W B K 0 See Note B 0 P Embossment Center Lines of Cavity D For Components 2.0mm x.2mm and Larger For Machine Reference Only Including Draft and RADII Concentric Around B 0 User Direction of Feed 0 o *Top Cover Tape R Min Thickness(t Bar Code Label ) Tape and Components 0.0mm (0.004 )Max. Shall Pass Around Radius R Bending Radius Embossed Carrier Without Damage 00 mm Maximum Component Rotation (3.937 ) Embossment mm Max Typical Component Cavity Center Line Tape mm(.039 ) Max 250 mm Typical Component Center Line (9.843 ) Camber (Top View) Allowable Camber To Be mm/00 mm Nonaccumulative Over 250 mm DIMENSIONS Tape Size B Max D D E F K P 0 P 2 RMin TMax WMax 8mm 2mm 6mm 24mm 4.55mm (.79 ) 8.2mm (.323 ) 2.mm (.476 ) 20.mm (.79 ).5+0.mm ( ).0Min (.039 ).5mm Min (.060 ).75 ± 0.mm (.069 ±.004) 3.5 ± 0.05mm (.38±.002 ) 5.5 ± 0.05mm (.27 ±.002 ) 7.5 ± 0.0mm (.295 ±.004 ).5 ± 0.mm (.453 ±.004 ) 2.4mm Max (.094 ) 6.4mm Max (.252 ) 7.9mm Max (.3 ).9mm Max (.468 ) 4.0 ± 0.mm (.57 ±.004 ) 2.0 ± 0.mm (.079 ±.002 ) 25mm (.98 ) 30mm (.8 ) 0.6mm (.024 ) 8.3mm (.327 ) 2 ±.30mm (.470 ±.02 ) 6.3mm (.642 ) 24.3mm (.957 ) Metric dimensions govern - English are in parentheses for reference only. NOTE : A 0, B 0, and K 0 are determined by component size. The clearance between the components and the cavity must be within.05 mm min. to.50 mm max., NOTE 2: the component cannot rotate more than 0 o within the determined cavity. NOTE 3: If B exceeds 4.2 mm (.65 ) for embossed tape, the tape may not feed through all tape feeders.

8 EMBOSSED TAPE AND REEL DATA FOR DISCRETES.5mm Min (.06 ) 3.0mm ± 0.5mm (.52 ±.002 ) T Max Outside Dimension Measured at Edge A 20.2mm Min (.795 ) 50mm Min (.969 ) Full Radius G Inside Dimension Measured Near Hub Size A Max G T Max 330mm (2.992 ) 8.4mm+.5mm, -0.0 ( , -0.00) 4.4mm (.56 ) 2mm 330mm (2.992 ) 2.4mm+2.0mm, -0.0 ( , -0.00) 8.4mm (.72 ) 6mm 360mm (4.73 ) 6.4mm+2.0mm, -0.0 ( , -0.00) 22.4mm (.882 ) 24 mm 360mm (4.73 ) 24.4mm+2.0mm, -0.0 ( , -0.00) 30.4mm (.97 ) Reel Dimensions Metric Dimensions Govern English are in parentheses for reference only Storage Conditions Temperature: 5 to 40 Deg.C (20 to 30 Deg. C is preferred) Humidity: 30 to 80 RH (40 to 60 is preferred ) Recommended Period: One year after manufacturing (This recommended period is for the soldering condition only. The characteristics and reliabilities of the products are not restricted to this limitation)