Low-Profile, Shielded Drum Core, Tapped Inductor SDT30 Series

Transcription

1 Low-Profile, Shielded Drum Core, Tapped Inductor SDT0 Series SMD Device Description Halogen Free Approved for use with Maxim MAX45 chip set 5 C maximum total temperature operation. x. x.0mm shielded drum core Ferrite core material Low losses High efficiency Reduces peak output currents Magnetically shielded, low EMI RoHS compliant Applications Keypads Instrument clusters EL backlighting Buck or boost inductor Environmental Data Storage temperature range: -40 C to +5 C Operating temperature range: -40 C to +5 C (with derated current) Solder reflow temperature: J-STD-00D compliant Packaging Supplied in tape-and-reel packaging, 5000 parts per reel, diameter reel Also supplied in tape-and-reel packaging, 7 diameter reel. See product specifications table note 5 below. HALOGEN HF FREE Product Specifications Part Pin OCL Part Marking Turns Raito I rms I sat DCR (mω) Number 5 Numbers (μh) Designator Primary:Secondary (Amps) C K-factor 4 ( - ) Primary.9 ± 0% ± 5% SDT0-7-R A :7 ( - ) Secondary 48 ± 0% ± 5% N/A Open Circuit Inductance (OCL) Test Parameters: 00kHz, 0.0V rms, 0.0Adc I rms : DC current for an approximate temperature rise of 40 C without core loss when either the primary or secondary winding is running separately. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 5 C under worst case operating conditions verified in the end application. I sat : Peak current for approximately 0% rolloff at +5 C of primary or secondary with another winding open. 4 K-factor: Used to determine B p-p for core loss (see graph). B p-p = K * L * ΔI. B p-p : (Gauss), K: (K-factor from table), L: (primary inductance in μh), ΔI (peak-to-peak ripple current in amps). 5 Part Number Definition: SDT0-xx-yy-R SDT0 = Product code and size -xx = Turns ratio (first x = primary winding, = : and second x = secondary winding) e.g., -7 = :7 primary to secondary turns ratio. -yy = add T7 for 7 inch tape-and-reel package. Leave blank for 5000 parts on inch tape-and-reel package. -R suffix = RoHS compliant 0409 BU-SB0948 Page of 4 Data Sheet: 464

2 Dimensions - mm Top View Side View Bottom View Recommended Pad Layout Schematic Marking 4.0 max. XXX. max.. max..0 max 0.6 typ..0 typ..0 typ..0 typ. 4.0 max..(x) Pri. 0.9 Sec typ. Part Marking: Three digit marking; st digit indicated inductance value per Part Marking Designator chart, nd digit indicated bi-weekly production date code, rd digit is last digit of the year produced. Packaging Information - mm dia ± User Direction Feed.5dia. 4.. Supplied in tape-and-reel packaging, 5000 parts per reel, diameter reel. Also supplied in tape-and-reel packaging on 7 diameter reel (not shown above). See product specifications table note 5 on page for ordering details. Temperature Rise vs.total Loss Temp.Rise( C) Total Loss (W) 0409 BU-SB0948 Page of 4 Data Sheet: 464

3 Core Loss Core Loss (W) Core Loss vs. Bp-p M Hz 500kHz 00k Hz 00kHz 00kHz B p-p (G u ass) Inductance Characteristics % of OCL % of OCL 0% 00% 90% 80% 70% 60% 50% 40% 0% 0% 0% 0% % of OCL vs. DC Bias current PRIMARY - se condary w inding OPEN +5 C -40 C +85 C DC Bias Current(A) % of OCL vs. DC Bias current SECONDARY - prim ary w inding OPEN 0% 00% 90% 80% 70% 60% +5 C 50% 40% -40 C 0% 0% +85 C 0% 0% DC Bias Current(A) 0409 BU-SB0948 Page of 4 Data Sheet: 464

4 Solder Reflow Profile T P T L Temperature T smax T smin Max. Ramp Up Rate = C/s Max. Ramp Down Rate = 6 C/s Preheat ts t t P T C -5 C Table - Standard SnPb Solder (T c ) Volume Volume Package mm mm Thickness <50 >_50 <.5mm 5 C 0 C >_.5mm 0 C 0 C Table - Lead (Pb) Free Solder (T c ) Volume Volume Volume Package mm mm mm Thickness < >000 <.6mm 60 C 60 C 60 C.6.5mm 60 C 50 C 45 C >.5mm 50 C 45 C 45 C 5 C Time 5 C to Peak Time Reference JDEC J-STD-00D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T smin ) 00 C 50 C Temperature max. (T smax ) 50 C 00 C Time (T smin to T smax ) (t s ) 60-0 Seconds 60-0 Seconds Average ramp up rate T smax to T p C/ Second Max. C/ Second Max. Liquidous temperature (TL) 8 C 7 C Time at liquidous (t L ) Seconds Seconds Peak package body temperature (T P )* Table Table Time (t p )** within 5 C of the specified classification temperature (T c ) 0 Seconds** 0 Seconds** Average ramp-down rate (T p to T smax ) 6 C/ Second Max. 6 C/ Second Max. Time 5 C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. North America 5 Broken Sound Parkway NW Suite F Boca Raton, FL Tel: Fax: Toll Free: Cooper Bussmann P.O. Box 4460 St. Louis, MO Tel: Fax: Europe Cooper (UK) Limited Burton-on-the-Wolds Leicestershire LE 5TH UK Tel: +44 (0) Fax: +44 (0) Avda. Santa Eulalia, Terrassa, (Barcelona), Spain Tel: Fax: Asia Pacific Jalan Kilang Timor #06-0 Pacific Tech Centre Singapore 590 Tel: Fax: The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 009 Cooper Bussmann St. Louis, MO BU-SB0948 Page 4 of 4 Data Sheet: 464

5 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Cooper Bussmann: SDT0-7-R