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Gwendoline Curtis
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2 ! "! #$% #$"&! '' "# % &(")# %!*+ %!!*,-

3 . Flip Chip! Fine Pitch & Low-K Wire Bonding Test Program Conversion Substrate/Bumping/Assembly/Test Turnkey Solution! Stacked Die SIP BCC QFN MEMS Green Solutions!

4 "! ITEM Available Package Size (mm 2 ) 4 x 4 ~ 15 x x 22 4 x 4 ~ 17 x 17 4 x 4 ~ 19 x 19 4 x 4 ~ 21 x 21 FC CSP Molding FCCSP Die Thickness Laminate C4 Pad Pitch (um) Ball Pitch (mm) 8 mils for 8" 10 mils for 12" 220/225 NSMD/SMD, no line pass 6 mils for 8" 8 mils for 12" 9 mils for 12 inch 195/205 NSMD/SMD, no line pass 175/185 NSMD/SMD, no line pass 0.5 ~ ~ mils for 8" 7 mils for 12" 165/170 NSMD/SMD, no line pass Pkg Thickness (mm) 1.7 ~ min 0.7 min 0.6 min FC BGA Package Size (mm 2 ) Bump Pitch (um) Package Size (mm 2 ) 15x15~40x40 12x12~42.5x x12~45x45 12x12~47.5x HVM (Production) / proto / (Proto) / HVM (Production) / proto / (Proto) / 150 HVM / proto 150 / 130 HVM / proto 150 / x12 ~45x45 12 x12 ~50x50 12x12 ~52.5x x12 ~55x55 High Performance FC BGA Die Size (mm 2 ) Ball Count Bump Material Organic Substrate 4x3~23x ~1936 Sn63/Pb37 / Pb95/Sn5 4 / 6 Layer Laminate 4 ~ 8 Layer BT Build-up with Ni/Au / Presoldered /SOP Pad 4x3~28x28 4x3~31x31 4x3~33x ~ ~ ~2916 Sn63/Pb37 / Pb95/Sn5 / Pb97/Sn3 / Leadfree 4 / 6 Layer Laminate 4 ~ 12 Layer BT Build-up 3/5/7 Layer PTFE with Ni/Au / Presoldered/ SOP Pad

5 "! ITEM Available High Performance FCBGA C4 Pad Pitch (um) Heatspreader 175 SMD, no line pass 200 SMD, one line pass 1-pc / 2-pc Cu with Ni plated 1-pc Cu / Al / AlSiC Cap Cu DLA for 17 x 17 or smaller 125 SMD, no line pass 150 SMD, one line pass 115 no line 130 one line pass 1-pc / 2-pc Cu with Ni plated 1-pc Cu / Al / AlSiC Cap Cu DLA for 31 x 31 or smaller Package Size (mm2) 25x32.5~50x50 13x11~52.5x x11 ~ 60x60 Ceramic FC B(P)GA Die Size (mm2) Ball Count Bump Pitch (um) Bump Material Substrate 6.5x6.5~10x10 HVM / proto 180 / 150 Sn63/Pb37 / Pb95/Sn5 / Pb97/Sn3 2.3 x 2.5 ~ 26 x x 2.5 ~ 28 x ~ ~3481 Alumina Ceramic Hi TCE Ceramic LTCC Glass Ceramic HVM / proto 150 / 130 HVM / proto 130 / 115 High Lead / Eutectic / Leadfree SIP Multi chip Multi package Side-by-side FC BGA 40x40 F/C + W/B staked FCBGA13x13 Flip chip staked 31x31 Flip chip + 2- or 4- CSP BGA 31 x 31 with passive component Combined MCM FC or F/C + W/B with multi package in one Leadframe Type Flip Chip FC QFN 10x10 88L FC BCC 8 x 8 56L Staggered Terminals Wafer Technology Al: 0.13um Cu: 0.13 um FSG/ lowk Cu: 90 nm Low-K Cu: 90 / 65 nm ultra Low-K

6 # $% " ITEM Available Bump Pitch (um) Solder Printing Repassivation & RDL Material BCB/PI PI PI PI RDL Bump on SiN/PI PI PI PI Cu/Low-k Wafer Eutectic Pb-free Pb-free Pb-free Bump on Nanotechnology /Cu/Low-k 90nm Wafer Eutectic Eutetic Pb-free Pb-free 60nm Wafer n/a Eutetic Pb-free Pb-free Bump Material 8" Printing Eutetic (w/ ULA) Pb-Free (SnAgCu) SnAgCu SnAgCu SnAgCu 12" Printing Eutetic (w/ ULA) Pb-Free (SnAgCu) SnAgCu SnAgCu SnAgCu

7 # $% " ITEM Available Bump Pitch (um) Repassivation & RDL Solder Plating Material PI PI PI PI RDL Bump on PI PI PI PI Cu/Low-k Wafer High Lead Eutectic(w/ ULA) Pb-free Pb-free Bump on Nanotechnolog y /Cu/Low-k 90nm Wafer n/a Hi-Pb/Eutectic Pb-free Pb-free 60nm Wafer n/a n/a Hi-Pb/Eutectic Hi-Pb/Eutectic Bump Material 8" Plating Hi-Pb (w/ ULA) Eutectic(w/ ULA) Pb-free Pb-free 12" Plating Hi-Pb (w/ ULA) Eutectic(w/ ULA) Pb-free Pb-free

8 # $&! Ultra CSP Package Size ITEM Available Package Size 5x5 6x6 7x7 8x8 Ball Material Std. Ultra CSP Eutectic/Lead Free Higher Cu Low Alpha Low Alpha Polymer Collar Ultra CSP Eutectic Lead Free Higher Cu Low Alpha Wafer Size 6"/8" 6'/8" 6"/8" 12" Process Capability Wafer Thickness 12mil 10mil 8mil 6mil Ball Pitch/Size 0.5/ / / /0.2 Surface Material Passivation BCB PI PI PI Backside Protection N/A Molding Molding Molding

9 ''/+ ITEM Available Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Micro-Display Hermetic Ceramic Package Solder Reflow Hermetic Sealing Wafer Level Hermetic Sealing MEMS RF-MEMS Acoustics Sensors, Switchs Biometric Sensor Finger Print Face Identification Retina Identification PDIC PDIC LGA Clear Mold LGA Blue Ray Wafer Level Package CLCC / OLCC LGA Clear Mold 48L Image Sensor Module Camera Module w/ CLCC, w/ PCB Camera Module with ASE WLCSP WLCSP with Embedded Lens

% Item Current 2004 2005 2006 IC Feature

Bond pad pitch (um ) ( Quad-Tier ) 70 60

10 % Item Current IC Feature Size (um) Wire Bond pad Pitch (um) (Single-In-Line) Wire Bond Pad Pitch (um) (2 Row Staggered) Wire Bond Pad Pitch (um) (Tri-Tier) Wire Bond pad pitch (um ) ( Quad-Tier ) Leading-Edge Fine-Pitch Capabilities In-Line: 45 um; Staggered: 60 um; Tri-Tier: 60 um ; Quad-Tier: 70um World s Largest Capacity: 5230 Bonders

11 !!&(")# $ ASE engineering study Base on customer volume Wafer Tech. Dielectric Material Package Type Capability Study Trial Run Realiability Test Qual Run Production QFP FSG BGA 0.13um Flip Chip QFP Y2004H2 Low-K BGA Y2004H2 Flip Chip QFP Y2005H1 90nm Low-K BGA Y2005H1 Flip Chip Y2004H1 QFP Y2006H2 65um ELK BGA Y2006H2 Flip Chip Y2006H2

12 01$ 0.5mm *& mm 1.0mm 1.2mm 1.4mm 2 die 3 die 4 die 5 die 7 die

13 410$ PIP SPBGA (POP) MPBGA MPBGA 2~3 Chips 4 Chips 6 Chips

14 ! Wafer Thickness (8 ) 75um/3mils 50um / 2mils 25um / 1mils Wafer Thickness (12 ) 150um/ 6mils 100um/4mils 75um/3mils 50um / 2mils Substrate Thickness (2L) 0.17 mm 0.12 mm 0.1 mm Substrate Thickness (4L) 0.26 mm 0.24 mm 0.22 mm Mold Thickness 0.35 mm 0.3 mm 0.25 mm Loop Height 75um 50um Available

15 +0 2-Chip Stack 1.2mm (0.65mm cap) 1.0mm (0.53mm cap) 0.8mm (0.45mm cap) 0.5mm (0.3mm cap) 3-Chip Stack 1.2mm (0.65mm cap) 1.0mm (0.53mm cap) 0.8mm (0.45mm cap) 4-Chip SCSP 1.2mm 1.0mm 0.8mm 1.4m SCSP 4/5 chips 6 chips 7 chips MPBGA WB + Passives System Module SPBGA (POP) 2 Package (1.8mm Max) 2 Package (1.5mm Max) 3 Package (2.0mm Max) PIP BGA 1.4 mm Max 1.2 mm Max 1.0 mm Max Available

%!!*,- ITEM Available 2004 2005 2006 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 BCC

260 Level-1 260 Multi Dies Single Die 2 Dies Stack Sandwich Stack Dies QFN

16 %!!*,- ITEM Available Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 BCC Package Size 3x3 ~ 9x9 mm 3x3 ~ 15x15mm 3x3 ~ 19x19mm Package Thickness 0.8mm 0.5mm Terminal Stagger Terminal Triple Terminal MSL Level Level-2A 260 Level Level Multi Dies Single Die 2 Dies Stack Sandwich Stack Dies QFN Sawing Type 3x3 ~ 9x9 mm Thermally Enhanced Type Punch Type 3x3 ~ 7x7 mm 8x8 mm 9x9 mm Stagger Termal MSL Level Level-2A 260 Level Level-1 260

17 ITEM Package Type Available Lead Frame Type BGA Laminate Type WL-CSP 2004E Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Flip Chip BGA Lead Frame Type MSL Level MSL C MSL C MSL C Lead Frame Plating Material Sn Cu / SnBi / Matt Tin Sn Cu / SnBi / Matt Tin Matt Sn/PPF BGA type MSL Level MSL C MSL 2A 260 C MSL C

Future Trends in Microelectronic Device Packaging. Ziglioli Federico

Future Trends in Microelectronic Device Packaging Ziglioli Federico What is Packaging for a Silicon Chip? 2 A CARRIER A thermal dissipator An electrical Connection Packaging by Assy Techology 3 Technology