PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE

Transcription

1 This version: Apr Previous version:jun PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total.

2 5.1 Thermal-resistance of IC Package ICs have recently become more highly integrated and high speed. IC s power consumption tends to increase with this progress. On the other hand, the packages to mount IC chips become more smaller and thinner. In other words, the thermal-resistance of IC packages is generally greater and the heat dissipation for ICs has become more important than before. Generally, the heat dissipating path for IC packages is regarded as the arrow mark in Figure PC Board Figure Heat Dissipating Path for IC Packages Therefore, there are two paths as follows from Figure as the heat dissipating paths from the IC chip to the atmosphere. a) IC chip Package Atmosphere b) IC chip Package Lead PC board Atmosphere The amount of heat dissipated by the path b) depends on various factors such as the kind and size of IC packages and the size, wired length, wired width, wired density, layer number, layer configuration, thickness, materials, etc. of the PC boards and comes to approximately 5 to 50% of all the amount of heat, accordingly, the influence for ICs must be considered as the whole system. 1

3 (1) Thermal resistance θjc The thermal resistance θjc is defined in the following equation (1). Ambient temperature Ta ( C ) Package surface temperature Tc ( C ) Chip surface temperature Tj ( C ) Power consumption P (W) PC board Figure where Tj Tc θjc =...(1) P Tj ( C) = chip surface temperature Tc ( C) = package surface temperature P (w) = power consumption The thermal resistance θjc is decided by thermal conduction only in package constituent materials as shown in the Figure and the equation (1). (2) Thermal resistance θja The thermal resistance θja is described by the following equation (2). where Tj Ta θja =...(2) P Tj ( C) = chip surface temperature Ta ( C) = package ambient temperature P (w) = power consumption Even if the same package is used, the thermal resistance θja depends on the following factors. Chip size Power consumption Mounting conditions Package ambient temperature The velocity of wind...figure Therefore, the thermal resistance value shown in the Figure 5.1.1, 5.1.2, and Lists of Thermal Resistance Values is measured by the constant measuring conditions as follows: Chip size...the most approximate size for the actual size Power consumption...1 (W) Package ambient temperature...25 C (in static air) Mounting...PC board size: (SEMI G42-96 both-sided mounting board) In addition, the thermal resistance θja also changes in the case of forced air cooling and Figure shows the wind velocity depending rate. 2

4 100 Thermal resistance θja [%] pin P-QFP 44 pin P-QFP 100 pin P-QFP Wind velocity [m/sec] Figure Wind Velocity Depending Rate of Thermal Resistance θja 5.2 Lists of Thermal Resistance Values A maximum junction temperature (Tjmax) is given for an IC to prevent its malfunctioning and the deterioration of reliability. Such abnormalities may occur, however, if the surface temperature of an IC chip exceeds its maximum junction temperature. Therefore, the thermal design of a system must be so made that the surface temperature of an IC chip will not exceed the maximum junction temperature. The maximum junction temperature depends on the type and design rules of the IC chip and the term of using it. Moreover, it is more important for designers to take into account heat buildup when making a thermal design. Data described in this chapter should be used as reference data. It is recommended that a thermal design, that requires a stringent thermal specification, be determined after actual measurements. The standard test methods for thermal resistance are shown below. SEMI G38-96 [TEST METHOD FOR STILL-AND FORCED-AIR JUNCTION-TO-AMBIENT THERMAL RESISTANCE MEASUREMENTS OF INTEGRATED CIRCUIT PACKAGES] SEMI G42-96 [SPECIFICATION FOR THERMAL TEST BOARD STANDARDIZATION FOR MEASURING JUNCTION-TO-AMBIENT THERMAL RESISTANCE OF SEMICONDUCTOR PACKAGES] SEMI G43-87 [TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS MOLDED PLASTIC PACKAGES] 3

5 4

6 Table Thermal Resistance Values of Plastic Shrink DIP θja θjc SDIP30-P Alloy SDIP42-P Alloy SDIP64-P Cu Alloy Table Thermal Resistance Values of Ceramic Standard DIP PKG code Package outline size Chip size [mm] [mm] θja DIP14-C DIP16-C DIP18-C DIP20-C DIP22-C DIP24-C DIP28-C DIP40-C DIP42-C DIP48-C θjc Table Thermal Resistance Values of Plastic ZIP θja θjc ZIP20-P Alloy ZIP20-P W Alloy ZIP24-P Alloy ZIP28-P Alloy ZIP40-P Alloy

7 Table Thermal Resistance Values of Ceramic PGA *1 *2 PKG code Package outline size Chip size PGA73-C-S11U HPGA73-C-S11D PGA88-C-S13U HPGA88-C-S13D-2.54-W PGA133-C-S14U PGA177-C-S15U PGA209-C-S17U PGA240-C-S17U PGA257-C-S20U PGA301-C-S20U IPGA365-C-S33U IPGA400-C-S33U *1: Package with radiator fin *2: Package with heat sink and radiator fin [mm] [mm] θja θjc 6

8 Table Thermal Resistance Values of Plastic SOP θja θjc SOP8-P K Alloy SOP16-P K Cu Alloy SSOP20-P K Alloy SOP24-P K Alloy SOP28-P K Alloy SSOP30-P K Alloy SSOP32-P K Alloy SOP32-P K Alloy SOP40-P K Alloy SOP44-P K Alloy SSOP60-P BK Alloy SSOP64-P K Alloy SSOP70-P K Alloy Table Thermal Resistance Values of Plastic TSOP θja θjc TSOP(1)32-P K Alloy TSOP(2)26-P K Alloy TSOP(2)28-P K Alloy TSOP(2)28-P K Alloy TSOP(2)32-P K Alloy TSOP(2)44-P K Alloy TSOP(2)44-P K Alloy TSOP(2)48-P K Alloy TSOP(2)50/44-P K Alloy TSOP(2)50/44-P K Alloy TSOP(2)50-P K Alloy TSOP(2)70-P K Alloy

9 Table Thermal Resistance Values of Plastic QFP θja θjc QFP44-P K Alloy QFP56-P K Alloy QFP64-P BK Alloy QFP64-P BK Alloy QFP80-P BK Alloy QFP80-P K Alloy QFP100-P BK Alloy QFP128-P K Alloy QFP128-P DK Alloy QFP128-P BK Cu Alloy QFP160-P BK/BK Alloy QFP160-P BK/BK Alloy QFP208-P BK Cu Alloy QFP208-P CK Cu Alloy QFP240-P BK Cu Alloy QFP272-P BK Cu Alloy QFP304-P BK Cu Alloy

10 Table Thermal Resistance Values of Plastic TQFP θja θjc TQFP44-P K Alloy TQFP48-P K Alloy TQFP64-P K Alloy TQFP80-P K Alloy TQFP100-P K Alloy TQFP100-P K Alloy TQFP120-P K Alloy Table Thermal Resistance Values of Plastic LQFP θja θjc LQFP144-P K Alloy LQFP176-P BK Alloy LQFP208-P K Alloy Table Thermal Resistance Values of Ceramic QFP *3 *3 PKG code Package outline size Chip size HQFP208-C HQFP256-C *3: Package with heat sink and radiator fin [mm] [mm] θja θjc Table Thermal Resistance Values of Plastic SOJ θja θjc SOJ26-P Alloy SOJ26-P Alloy SOJ28-P Alloy SOJ32-P Alloy SOJ40-P Alloy SOJ42-P Alloy

11 Table Thermal Resistance Values of Plastic QFJ θja θjc QFJ18-P-R Alloy QFJ20-P-S Cu Alloy QFJ22-P-R Alloy QFJ28-P-S Cu Alloy QFJ32-P-R Alloy QFJ44-P-S Cu Alloy QFJ68-P-S Cu Alloy QFJ84-P-S Cu Alloy Table Thermal Resistance Values of BGA PKG code Package outline size Chip size [mm] [mm] θja [ C/W] P-TFLGA P-LFBGA P-LFBGA P-LFBGA P-LFBGA P-LFBGA P-BGA P-BGA P-BGA P-BGA M-BGA θjc 10