PLCC Plastic Leaded Chip Carrier
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1 PLCC Plastic ed Chip Carrier Plastic ed Chip Carriers (PLCC) are four-sided J ed Plastic body packages. counts range from 20 to 84. PLCC packages can be square or rectangle. Body sizes range from.35" to 1.15". PLCCs are JEDEC standard compliant. The PLCC J configuration requires less board space versus equivalent gull leaded components. PLCC Plastic ed Chip Carrier Daisy-Chained And -Free Parts Available! (In Tubes) Pin Count ( and Reel) PLCC20T mm 48 PLCC20TR 16mm 12mm 1,000 PLCC28T mm 38 PLCC28TR 24mm 16mm 750 PLCC32T x 13mm 30 PLCC32TR 24mm 16mm 750 PLCC44T mm 27 PLCC44TR 32mm 24mm 450/500 PLCC52T mm 24 PLCC52TR 32mm 24mm 450 PLCC68T mm 18 PLCC68TR 44mm 32mm 230/250 PLCC84T mm 15 PLCC84TR 44mm 36mm 250 All PLCCs have J leads. Standard lead pitch is 1.27mm (50 mils). PLCCs are to JEDEC standards. 13" reels are standard. Parts available on and Reel. Moisture sensitivity is JEDEC level 3. -free parts are available with 100% Matte Sn finish. System Plastic ed Chip Carrier : T=Tubes, TR= and Reel. PLCC20T J-Formed For kits see pages 53, 55, 60, 62, 67, 70, 71, 79 and 82. H A Z G Attach Adhesive Attach Pad Y X S J L B E D C Full Radius Optional W P Heel T L PLCC Dimensions C Grid Placement Courtyard L (mm) S (mm) W (mm) T (mm) A (mm) B (mm) J (mm) H (mm) P (mm) Min Max Min Max Min Max Min Max Min Max Min Max Ref Max Basic PLCC PLCC PLCC PLCC PLCC PLCC Z (mm) G (mm) X (mm) PLCC Land Patterns Y (mm) C (mm) D (mm) E (mm) Placement Grid Ref Ref Ref Ref (No. of Elements) PLCC x 24 PLCC x 30 PLCC x 40 PLCC x 44 PLCC x 54 PLCC x 66 Practical s, Inc. Tel: Fax:
2 SOIC/SOJ Small Outline Integrated Circuit Small (SOP/SOJ) body size was compressed and the lead pitch tightened to obtain a smaller version SOP. This yields an IC package that is a significant reduction in the size (compared to stan- SOIC/SOJ Small Outline Integrated Circuit dard package). All IC assembly processes remain the same as with our standard SOPs. Style Body SO8GT-3.8mm* 8 Gull 3.8mm mm 8mm 2,500 SO14GT-3.8mm 14 Gull 3.8mm 50 16mm 8mm 2,500 SO16GT-3.8mm 16 Gull 3.8mm 48 16mm 8mm 2,500 SO16GT-7.6mm 16 Gull 7.6mm 46 16mm 12mm 1,000 SO20GT-7.6mm 20 Gull 7.6mm 38 24mm 12mm 1,000 SO24GT-7.6mm* 24 Gull 7.6mm 31 16mm 12mm 1,000 SO28GT-7.6mm 28 Gull 7.6mm 25 24mm 12mm 1,000 SO28JT-7.6mm 28 J- 7.6mm 26 24mm 12mm 1,000 SO32JT-7.6mm 32 J- 7.6mm 25 24mm 12mm 750 * = Available as an ExposedPad TM SOIC package by Amkor. ExposedPad TM can increase heat dissipation by as much as 110% over standard packages. Standard lead pitch is 1.27mm. Parts available on and Reel. -free parts are available with 100% Matte Sn finish. System Small Outline Integrated Circuit SO14GT 3.8mm Body Style Style: G=Gull Wing, J=J-ed. : T=Tubes, TR= and Reel. For kits see pages 53, 55, 60, 62, 67, 68, 69, 70, 71, 73 and 79. Attach Adhesive B Grid Placement Courtyard D A S L C G Z Attach Pad P W H E X Y JEDEC SOIC Dimensions L (mm) S (mm) W (mm) T (mm) A (mm) B (mm) H (mm) P (mm) Min Max Min Max Min Max Min Max Min Max Min Max Min Max Basic SO8 MS-012 AA SO14 MS-012 AB SO16 MS-012 AC SO16-7.6mm MS-013 AA SO20-7.6mm MS-013 AC SO28-7.6mm MO-119 AB Z (mm) G (mm) X (mm) SOIC Land Pattern Dimensions Y (mm) C (mm) D (mm) E (mm) Placement Grid Ref Ref Ref Ref (No. of Grid Elements) SO x 16 SO x 16 SO x 16 SO16-7.6mm x 22 SO20-7.6mm x 24 SO28-7.6mm x Practical s, Inc. klaphen@practicalcomponents.com
3 TSOP Thin Small Thin Small s (TSOP) are thin body size components; thickness is 1.0mm. TSOP packages have four sides and are rectangular. Type I TSOPs have the leads protruding from the width portion of the package. Type II TSOPs have the leads protruding from the length portion of the package. counts range from 28 to 54. Package body size ranges from 8x11.8mm to 12x20mm. TSOP Thin Small Type I Per Tray TI-TSOP28-8.1x11.8mm-.55mm x 11.8mm.55mm mm 12mm 1,000 TI-TSOP28-8x20mm-.5mm 28 8 x 20mm.5mm mm 12/16mm 1,000 TI-TSOP32-8x11.8mm-.5mm 32 8 x 11.8mm.5mm mm 12mm 1,000 TI-TSOP32-8x18.4mm-.5mm 32 8 x 18.4mm.5mm mm 12/16mm 1,000 TI-TSOP40-10x14mm-.5mm x 14mm.5mm mm 12/16mm 1,000 TI-TSOP40-10x18.4mm-.5mm x 18.4mm.5mm mm 16mm 1,000 TI-TSOP48-12x18.4mm-.5mm x 18.4mm.5mm 96 32mm 16mm 1,000 TSOP Thin Small Type II Per Tray TII-TSOP40/ x18.42mm-.8mm 40/ x 18.42mm.8mm mm 16mm 1,000 TII-TSOP x18.42mm-.8mm x 18.42mm.8mm mm 16mm 1,000 TII-TSOP44/ x20.95mm-.8mm 44/ x 20.95mm.8mm mm 16mm 1,000 TII-TSOP x20.95mm-.8mm x 20.95mm.8mm mm 16mm 1,000 TII-TSOP x22.22mm-.8mm x 22.22mm.8mm mm 16mm 1,000 Standard packaging is in JEDEC trays or tape and reel (quantities may vary). Body dimensions are measured by body length and width. Type I means that pins extend from the narrow end (the width) of the body. Type II means that pins extend from the wide end (the length) of the body. Parts available on and Reel upon special request. -free parts are available with 100% Matte Sn or SnBi. System Type I or Type II Thin Small TI TSOP28 8.1x11.8mm.5mm Add T to end of part number for Tray. Add TR to end of part number for and Reel. Add specific finish to end of part number for -Free, i.e Sn or SnBi. TYPE I TYPE II For recommended kits see pages 58, 67 and 71. Practical s, Inc. Tel: Fax:
4 SSOP Small Shrink The Small Shrink (SSOP) body size is compressed and the lead pitch is tightened to obtain a small version of the standard SOIC packages. counts range from 8 to 64. Body sizes are 209 and 300 mils. The SSOP package is JEDEC and EIAJ compliant. The package leads are solder plated. SSOP Small Shrink Body SSOP14T-5.3mm mm.65mm mm 12mm 1,000 SSOP16T-5.3mm mm.65mm 80 16mm 12mm 1,000 SSOP20T-5.3mm mm.65mm 62 16mm 12mm 1,000 SSOP24T-5.3mm mm.65mm 66 16mm 12mm 1,000 SSOP28T-5.3mm mm.65mm 47 16/24mm 12mm 1,000 SSOP48T-7.6mm mm 1.27mm 30 32mm 12/16mm 1,000 SSOP56T-7.6mm mm 1.27mm 26 32mm 12/16mm 500 Parts available on and Reel upon special request. 209 and 300 mil body widths. JEDEC and EIAJ package outline standard compliance. High-conductivity copper leadframes. Eutectic solder plating is 85/15 Sn/Pb. Moisture sensitivity is JEDEC level 3. -free available with 100% Matte Sn alloy. System Small Shrink SSOP20T 5.3mm Add T for Tubes or TR for and Reel to end of part number. Add epad to beginning of part number when ordering ExposedPad package. Body Pb Looking for -Free? This symbol indicates that lead-free parts are available! Attach Adhesive Attach Pad For kits see pages 60, 71, 79 and 82. Attach Adhesive Di Practical s is the exclusive distributor of Amkor Technology Mechanical s. Note: Drawings not to scale. 32 Practical s, Inc. klaphen@practicalcomponents.com
5 TSSOP Thin Shrink Small The Thin Shrink Small (TSSOP) offers smaller body sizes, smaller lead pitches and package thickness (0.9mm thick) than standard SOIC packages. Body widths are 3.0mm, 4.4mm and 6.1mm. counts range from 8 to 80. This package conforms to JEDEC package outlines. Parts are also available as an ExposedPad package. TSSOP Thin Shrink Small Body Per Reel A-TSSOP8T-3.0mm 8 3.0mm.65mm 12mm 8mm 98 2,500 A-TSSOP8T-4.4mm 8 4.4mm.65mm 12/16mm 8mm 100 1,000/2,500 A-TSSOP10T-3.0mm mm.5mm 12mm 8mm 98 2,500 A-TSSOP14T-4.4mm mm.65mm 12/16mm 8mm 96 1,000/2,500 A-TSSOP16T-4.4mm mm.65mm 12/16mm 8mm 96 1,000/2,500 A-TSSOP20T-4.4mm mm.65mm 16mm 8/12mm 74 1,000/2,500 A-TSSOP24T-4.4mm mm.65mm 16mm 8/12mm 62 1,000/2,500 A-TSSOP28T-4.4mm mm.65mm 16mm 8/12mm 50 1,000 A-TSSOP28T-6.1mm mm.65mm 24mm 12mm 50 1,000 A-TSSOP32T-6.1mm mm.65mm 24mm 12mm 44 1,000 A-TSSOP38T-4.4mm mm.5mm 16mm 8/12mm 50 1,000 A-TSSOP38T-6.1mm mm.65mm 24mm 12mm 39 1,000 A-TSSOP44T-4.4mm mm.5mm 24mm 12mm 42 1,000 A-TSSOP48T-4.4mm mm.4mm 16mm 8mm 50 1,000 A-TSSOP48T-6.1mm mm.5mm 24mm 12mm 39 1,000 A-TSSOP56T-4.4mm mm.4mm 24mm 12mm 42 1,000 A-TSSOP56T-6.1mm mm.5mm 24mm 12mm 35 1,000 A-TSSOP64T-6.1mm mm.5mm N/A N/A 28 N/A A-TSSOP80T-6.1mm mm.4mm N/A N/A 28 N/A 0.9mm body thickness for 4.4 and 6.1mm body widths. 0.85mm body thickness for 3.0mm body width. JEDEC package outline is standard. High conductivity copper leadframes. Very low-stress mold compound. Parts available on and Reel upon special request.. All pin counts listed are available as an ExposedPad package. -free available with 100% Matte Sn alloy. TSSOP Package System Amkor A-ePadTSSOP8T-3.0mm Body ExposedPad Thin Shrink Small Add T for Tubes or TR for and Reel to end of part number. Add epad to beginning of part number when ordering ExposedPad package. ExposedPad TSSOP Package Attach Adhesive Attach Pad Attach Adhesive For recommended kit see page 55. ExposedPad Solder plated exposed metal die pad. Highly conductive copper leadframe. Up to 60% improvement in Theta JA (compared to standard TSSOP). Overall height is 1.1mm. Practical s, Inc. Tel: Fax:
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