Power Splitter/Combiner

Transcription

1 Ultra-Small Ceramic Power Splitter/Combiner 2 Way-90 50Ω 2500 to 4500 MHz Maximum Ratings Operating Temperature -55 C to 100 C Storage Temperature -55 C to 100 C Power Input (as a splitter) 15W* max. * Derate linearly to 7W at 100 C ambient. Permanent damage may occur if any of these limits are exceeded. Pin Connections SUM PORT 1 PORT 1 (0 ) 4 PORT 2 (+90 ) 6 GROUND 2,5 50 OHM TERM EXTERNAL 3 Product Marking: SA Outline Drawing PCB Land Pattern Suggested Layout, Tolerance to be within ±.002 Outline Dimensions ( inch) mm A B C D E F G H J K wt grams Demo Board MCL P/N: TB-405 Suggested PCB Layout (PL-250) Features wide band, MHz low insertion loss, 0.4 db typ. wrap-around terminal for excellent solderability ultra small, 0.12"X0.06"X0.035" patent pending Applications balanced amplifiers modulators MMDS defense communications FREQ. RANGE (MHz) TOTAL LOSS (db) Frequency (MHz) ISOLATION (db) Total Loss 1 (db) S-1 S-2 TOTAL LOSS S-1 S-2 Electrical Specifications INSERTION LOSS (db) Avg. of Coupled Outputs ABOVE 3 db Typical Performance Data Amplitude Unbalance (db) PHASE UNBALANCE (Degrees) 1. For applications requiring DC voltage to be applied to the RF ports, add suffix letter "D" to part no. DC resistance to ground is 100 Mohms min. Isolation (db) ISOLATION (db) Phase Unbalance (deg.) S ISOLATION Total Loss = Insertion Loss + 3dB splitter loss. CASE STYLE: FV RoHS Compliant The +Suffix identifies RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications Available Tape and Reel at no extra cost Reel Size Devices/Reel 7 20, 50, 100, 200, 500,1000, 3000 AMPLITUDE UNBALANCE (db) f L -f U Typ. Min. Typ. Max. Typ. Max. Typ. Max. Typ (:1) FREQUENCY (MHz) PHASE UNBALANCE FREQUENCY (MHz) electrical schematic (Note 1) PHASE UNBALANCE (deg.) FREQUENCY (MHz) Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, Standard Terms ); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits website at Mini-Circuits P.O. Box , Brooklyn, NY (718) sales@minicircuits.com REV. G M ED AD/CP/AM

2 2 Way-90 Power Splitter/Combiner Typical Performance Data TEST CONDITIONS: INPUT POWER = = +25 C TOTAL LOSS 1 AMP. PHASE FREQ. ISOLATION UNBAL. UNBAL. (MHz) (db) (db) (deg.) (db) S-1 S Total Loss = Insertion Loss+ 3dB Splitter Loss (:1) S 1 2 REV. X Page 1 of 3

3 2 Way-90 Power Splitter/Combiner Typical Performance Data TEST CONDITIONS: INPUT POWER = = -55 C AMP. FREQ. TOTAL LOSS 1 PHASE ISOLATION UNBAL. UNBAL. (MHz) (db) (db) (deg.) (db) S-1 S Total Loss = Insertion Loss+ 3dB Splitter Loss (:1) S 1 2 REV. X Page 2 of 3

4 2 Way-90 Power Splitter/Combiner Typical Performance Data TEST CONDITIONS: INPUT POWER = = +100 C AMP. PHASE FREQ. TOTAL LOSS 1 ISOLATION UNBAL. UNBAL. (MHz) (db) (db) (deg.) (db) S-1 S Total Loss = Insertion Loss+ 3dB Splitter Loss (:1) S 1 2 REV. X Page 3 of 3

5 2 Way-90 Power Splitter/Combiner Typical Performance Curves Total Loss Total Loss S-1 vs. TEMPERATURE Total Loss S Total Loss (db) Total Loss S-2 Total Loss (db) Amplitude Unbalance vs. TEMPERATURE 95 Phase Unbalance vs. TEMPERATURE Amplitude Unbalance (db) Phase Unbalance (deg.) Isolation 1-2 vs. TEMPERATURE Isolation (db) REV. X Page 1 of 2

6 2 Way-90 Power Splitter/Combiner Typical Performance Curves SUM vs. TEMPERATURE S (:1) (:1) OUT1 vs. TEMPERATURE (:1) REV. X Page 2 of 2

7 Case Style Outline Dimensions FV FV PCB Land Pattern Suggested Layout, Tolerance to be within ±.002 CASE # A B C D E F G H J K L M N P FV (3.20).063 (1.60).035 (0.89).024 (0.61).022 (0.56).011 (0.28).039 (0.99) Dimensions are in inches (mm). Tolerances: 2 Pl. +.01; 3 Pl (0.61).042 (1.07).123 (3.12) WT. GRAM.020 Notes: 1. Open style, ceramic base. 2. Termination finish: For RoHS Case Styles: Tin plate over Nickel plate. All models, (+) suffix. For RoHS-5 Case Styles: Tin-Lead plate. All models, no (+) suffix. 98-FV Rev.: T (05/02/14) M File: 98-FV.doc Sheet 2 of 7 This document and its contents are the property of Mini-Circuits.

8 Tape & Reel Packaging TR-F75 Tape Width, mm Device Cavity Pitch, mm Reel Size, inches Devices per Reel Small quantity standards (see note) Standard 3000 Note: Please consult individual model data sheet to determine device per reel availability. Mini-Circuits carrier tape materials provide protection from ESD (Electro-Static Discharge) during handling and transportation. Tapes are static dissipative and comply with industry standards EIA-481/EIA-541. Go to: 98-TR-F75 Rev.: F (03/22/11) M File: 98-TR-F75.doc Sheet 1 of 1 This document and its contents are the property of Mini-Circuits.

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11 Mini-Circuits Environmental Specifications ENV06 All Mini-Circuits products are manufactured under exacting quality assurance and control standards, and are capable of meeting published specifications after being subjected to any or all of the following physical and environmental test. Specification Test/Inspection Condition Reference/Spec Operating Temperature -55 to 100 C Ambient Environment Individual Model Data Sheet Storage Temperature -55 to 100 C Ambient Environment Individual Model Data Sheet Humidity 90 to 95% RH, 240 hours, 50 C MIL-STD-202, Method 103, Condition A, Except 50 C and end-point electrical test done within 12 hours Solder Reflow Heat Sn-Pb Eutetic Process: 225 C peak Pb-Free Process C peak J-STD-020, Table 4-1, 4-2 and 5-2, Figure 5-1 Solderability 10X Magnification J-STD-002, Para 4.2.5, Test S, 95% Coverage Vibration (High Frequency) 20g peak, Hz, 12 times in each of three perpendicular directions (total 36) MIL-STD-202, Method 204, Condition D Mechanical Shock 50g, 11 ms, 1/2-sine, 18 shocks: 3 each direction, each of 3 axes MIL-STD-202, Method 213, Condition A ENV06 Rev: A 02/25/11 M File: ENV06.pdf This document and its contents are the property of Mini-Circuits. Page: 1