QUALIFICATION REPORT RELIABILITY LABORATORY PCN#: CYER-19YRIY190

Transcription

1 QUALIFICATION REPORT RELIABILITY LABORATORY PCN#: CYER-19YRIY190 Date August 24, 2010 Qualification of 20L SOIC (.300) at GTK (GRTK) assembly site and the 16L SOIC (.300) will qualify by similarity Distribution Surasit P. Rangsun K. Wanphen L. C.K. Barlingay Wichai K. Gerry O. R. Sharma Technology (Thailand) Co., Ltd. 14 Moo 1 T.Wangtakien A. Muangchacherngsao, Chacherngsao, Thailand, Tel. (+66 38) , ext Fax (+66 38)

2 Purpose Qualification of 20L SOIC (.300) at GTK (GRTK) assembly site. The 16L SOIC (.300) will qualify by similarity. CN QUAL ID MP CODE Part No. BC Q10065 A7BE37G5XA20 PIC16C771-I/SO Bonding No. BDE Rev. 01 CCB No. 957 Package Type Package size Die thickness Die size Lead Frame Paddle size Material Surface Process Lead Lock Part Number Die attach material Epoxy Wire Mold Compound Plating Composition 20L SOIC 300 mils 15 mils x mils 160 x 200 mils C194 / Poongsan Bare Cu Stamped No 11-00W-003 CRM1076DJ-G / Sumitomo (Japan) Au wire G600F Sumitomo (Taiwan) Matte Tin

3 Manufacturing Information Assembly Lot No. Wafer Lot No. Trace Code GTK TMPE HJB GTK TMPE HJC GTK TMPE HJD Result Pass Fail 20L SOIC (.300) assembled by GTK pass reliability test per QCI This package was qualified the Moisture/Reflow Sensitivity Classification Level 1 at 260 C reflow temperature per IPC/JEDEC J-STD-020C standard. Prepared By: ) Date: August 24, 2010 (Reliability Engineer) (Mr.Udom Suksansakul) Approved By: ) Date: August 24, 2010 (Reliability Manager) (Mr. Surasit Phurikhup)

4 MSL MSL Level 1/260 o C 85 C/ 85%RH Moisture Soak 168 hrs. System: TABAI ESPEC Model PR-3SPH 3x Convection-Reflow 260 C max System: Vitronics Soltec MR1243 ( IPC/JEDEC J-STD-020C) /05/10 07/20/10 0/135 Pass Precondition Electrical Test Electrical Test :+25 C and 85 C 693(0) 06//10 07/05/ Good Devices Bake Moisture Soak Convection-Reflow Bake 150 C, 24 hrs System: CHINEE 85 C/85%RH Moisture Soak 168 hrs. System: TABAI ESPEC Model PR-3SPH 3x Convection-Reflow 260 C max System: Vitronics Soltec MR1243 PI-92014B 07/05/ PI-91173B 07/14/ PI-91160B 07/14/10 07/14/ Electrical Test Electrical Test :+25 C and 85 C 07/14/10 07/20/10 0/693 Pass

5 Temp Cycle Pressure Cooker -65 C to +150 C, 500 Cycles System : TABAI ESPEC TSA-70H Inspection: External crack inspection all units under 40X Optical magnification Electrical Test: +85 C Bond Strength: Bond Shear (14.00 grams) Wire Pull (> 3 grams) +121 C, 100% RH, 15 PSI, 96 hrs. System: HIRAYAMA TPC-4R PI-91020B QCI (0) QCI (0) 07//10 08/02/10 08/02/10 08/02/ /30 Parts had been pre-conditioned at 260 C 231(0) 08/02/10 0/231 Pass 77 units / lot 15 (0) 0/15 0/15 Pass Pass Wire pull & bond shear after Temp Cycle PI-92013B 07/24/10 07/28/ Parts had been pre-conditioned at 260 C Electrical Test: +25 C 231(0) 07/28/10 07/29/10 0/231 Pass 77 units / lot

6 HAST Solderability Temp 215 C +130 C/85%RH, 96 hrs. System: HAST 6000X Electrical Test: +25 C and 85 C Steam Aging: Temp 93 C,8Hrs System: SAS-3000 Solder Dipping: Solder Temp.215 C Solder material: Pb Free Sn 95.5Ag3.9 Cu0.6 System: ERSA RA 00D Visual Inspection: External Visual Inspection PI-92010B 07/24/10 07/28/ Parts had been pre-conditioned at 260 C 231(0) 07/28/10 07/31/10 0/231 Pass 77 units / lot QCI (0) 07/05/10 0/ Pass Solderability Temp 245 C Steam Aging: Temp 93 C,8Hrs System: SAS-3000 Solder Dipping: Solder Temp.245 C Solder material: Pb Free Sn 95.5Ag3.9 Cu0.6 System: ERSA RA 00D Visual Inspection: External Visual Inspection QCI (0) 07/05/10 0/ Pass

7 Physical Dimensions High Temperature Storage Life Physical Dimension, 30 units from 1 lot Bake 175 C, 504 hrs System: CHINEE Electrical Test: +25 C and 85 C QCI (0) Units PI-92014B - - 0/30 Pass Physical Dimension 07/05/10 07/28/ (0) 07/28/10 07/29/10 0/135 Pass 45 units / lot Bond Strength Data Assembly Bond Shear (14.00 grams) Wire Pull (> 3 grams) QCI (0) bonds 30 (0) wires - - 0/30 Pass - - 0/30 Pass Wire pull & bond shear data assembly