0.15 +/ (0.006" +/ ) / (0.033" +/ ) / (0.088" +/ ") 1.91 (0.075") 1.09 (0.043") 0.91 (0.
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1 Note: For wave solder, increase the spacing in both the horizontal Surface Mount Polymeric.66 and Electrostatic +/- vertical.6 dimensions by Discharge Suppressors.54 (.") where denoted by an asterisk (*).4 (.4") REF PGB Series.6 (.4") (.66" +/-. ).5 +/-.8 (.6" +/-. ).84 +/-.5 (." +/-. ).4 +/-.8 (.88" +/-.7") RoHS.5 (.").4 +/-.8 (.7" +/-.7 ).8 (."). +/-. (.8" +/-.8").69 +/-. (.7" +/-.4).5 (.").76 (."). (.") (.9").64 (.5").5.76 (.") (.")..76 (.") (.8").9 (.75").9 (.6").5 +/-.8 (.6 +/-.").54 (.").64 (.5") (.9").9 (.4") Description help protect sensitive electronic equipment against electrostatic discharge (ESD). They supplement the on-chip protection of integrated circuitry and are best suited for low-voltage, high-speed applications where low capacitance is important. Data ports utilizing such high-speed protocols as USB., IEEE94, HDMI and DVI can benefit from this new technology. PULSE-GUARD suppressors use polymer composite materials to suppress fast-rising ESD transients (as specified in IEC 6-4-), while adding virtually no capacitance to the circuit. s 4 and 6 Devices SOT Device Features RoHS compliant, lead-free and available halogen-free Ultra-low capacitance Low leakage current Fast response time Bi-directional Withstands multiple ESD strikes Compatible with pick-and-place processes Available in,, 5 and piece reels (EIA- RS48) Product Characteristics Part Number Lines Protected Component Package Available as Halogen-Free PGB4 4 No PGB6 6 Yes PGBST SOT Yes Applications HDTV Hardware Laptop/Desktop Computer Network Hardware Computer Peripherals Digital Camera External Storage Set-Top Box Antenna Electrical Characteristics Specification PGB4 PGB6 PGBST Notes ESD Capability: IEC 6-4- Contact Discharge (typical) IEC 6-4- Air Discharge (maximum) 5 Littelfuse, Inc. Revised: 7/7/5 Peak Voltage (typical) V 5V 5V Clamping Voltage (typical) 5V 5V 5V Rated Voltage (maximum) VDC 4VDC 4VDC Capacitance (typical).4 pf.6 pf. pf Measured at 5 MHz Response Time <ns <ns <ns Leakage Current (typical) <na ( VDC) 4V 4V ESD Pulse Withstand The ESD capability measured by direct and air discharge method is subject to testing equipment and conditions. Numerous factors could affect the reliability and reproducibility of the direct and air discharge test results. Measured per IEC 6-4- Contact Discharge Measured per IEC 6-4- Contact Discharge, at 5 nsec. Some shifting in characteristics may occur when tested over multiple pulses at a very rapid rate Notes:. PGB 4 product not offered as Halogen Free. See PGB series 4 product instead ( Testing performed on Littelfuse test setup as described in Typical Test Setup Section on page 4 of this document. Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.
2 ... Part Numbering System QUANTITY & PACKAGING 6 CODE: Capacitance (ff) Frequency (GHz) Typical Device Capacitance ce (pf). PGBST PGB6 PGB4.,, Frequency (MHz).. Typical Device Capacitance 45NR PGB6 PGBST. PGB4,, -5 5 Frequency 5 75 (MHz) PGB 6 MR PGBST PGB485 PGB6 PGB4. LEAD-FREE PULSE-GUARD,, ESD SUPPRESSORS Frequency (MHz) LINES PROTECTED: = line = lines DEVICE SIZE CODE: 7 4 = 4 (5)* 6 = 6 (68) ** Note:, ff = pf ST = SOT MR = pieces, tape & reel WR = pieces, tape & reel 5 NR = 5 pieces, tape & reel KR =, pieces, tape & reel 6 *Note: PGB 4 product not available as PGB6 Halogen Free item. See 4 PGB 4 product instead, part number PGBST PGB4KRHF 4( PGB PGB Dimensions 4 4 Device.7 (.8 ). +/ (.4 ) ( -. ) /-.8 e (V) (.4" +/-.4") 6 Device.4 (.4") REF (.") PGB6 PGBST.76 (."). PGB4 (.") 45NR /-.8 (.7" +/-.7 ).5 (.").6 (.4") Note: For wave solder, increase the spacing in both the horizontal and vertical dimensions by.54 (.") where denoted by an asterisk (*) (.9").64 (.5").5 (.").4 +/-.9 (.9" +/-.4").5 +/-.5 (." +/-.") Note: The device has two rectangular ink marking to improve its identification by Automated Optical Inspection systems SOT Device.5 (.").76 (.").76 (.").8 (.").99 +/-.5 (.9" +/-."). (.8") SIDE TOP. +/-. (.8" +/-.8").69 +/-. (.7" +/-.4) Body.5 +/-.8 (.6 +/-.") PGB6 PGBST PGB485 PGB4 (." +/-.") Termination.55 (.6").66 +/-.6 (.66" +/-. ).9 (.75").9 (.6") Recommended for reflow soldering only.54 (.").4 +/-.8 (.88" +/-.7").64 (.5").56 (.").8 (.5").58 (.") (.9").5 +/-.8 (.6" +/-. ).84 +/-.5 (." +/-. ).9 (.4") 5 Littelfuse, Inc. Revised: 7/7/5
3 Temperature Physical Specifications Materials Body: Glass Epoxy Terminations: Copper/Nickel/Tin Solderability MIL-STD-, Method 8 Soldering Parameters Design Consideration Wave solder - 6 C, seconds maximum Reflow solder - 6 C, seconds maximum Because of the fast rise-time of the ESD transient, proper placement of PULSE-GUARD suppressors are a key design consideration to achieving optimal ESD suppression. The devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PULSE-GUARD suppressors (connected from signal/data line to ground) directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. Environmental Specifications Operating Temperature Moisture Resistance Thermal Shock Vibration -65 C to +5 C 4 series: 4 C, 95% RH, hours 6, ST: 85 C, 85% RH, hours MIL-STD-, Method 7, -65 C to 5 C, min. cycle, cycles MIL-STD-, Method, ( to 55 to Hz, min. cycle, hrs each in X-Y-Z) Chemical Resistance MIL-STD-, Method 5 Solder Leach Resistance and Terminal Adhesion IPC/EIA J-STD- Soldering Parameters Reflow Condition Pre Heat Pb Free assembly - Temperature Min (T s(min) ) 5 C - Temperature Max (T s(max) ) C - Time (min to max) (t s ) 6 8 seconds Average ramp up rate (Liquidus Temp (T L ) to peak C/second max T S(max) to T L - Ramp-up Rate C/second max - Temperature (T L ) (Liquidus) 7 C Reflow - Temperature (t L ) 6 5 seconds Peak Temperature (T P ) 6 C Time within 5 C of actual peak Temperature (t p ) Ramp-down Rate Time 5 C to peak Temperature (T P ) seconds 6 C/second max 8 minutes max T P T L T S(max) T S(min) 5 t S Preheat Ramp-up time to peak temperature t P t L Ramp-down Time Based on IPC/JEDEC J-STD- 5 Littelfuse, Inc. Revised: 7/7/5
4 Packaging Part Number Quantity & Packaging Code Quantity Packaging Option Packaging Specification PGB4 KR Tape & Reel (7 reel) EIA RS-48- (IEC 86, part ) PGB6 MR Tape & Reel (7 reel) EIA RS-48- (IEC 86, part ) PGBST WR Tape & Reel (7 reel) EIA RS-48- (IEC 86, part ) PGB6 NR 5 Tape & Reel (7 reel) EIA RS-48- (IEC 86, part ) Tape and Reel Specifications T t D d D s Description 4 Series 6 Series SOT Series C t - Cover tape thickness P d T w P h D d - Drive hole diameter D s - Drive hole spacing C t P s P w P d - Pocket depth P h - Pocket height..85. P s - Pocket spacing P w - Pocket width T t - Carrier tape thickness T w - Carrier tape width Typical Test Setup FARADAY CAGE COMPUTER AGILENT INFINIIUM.5 GHz 8 GS/s db PASTERNAK ATTENUATOR PE75- TEKTRONIX LOW CAP PROBE 658 (x TIP) QUADTECH 865 RESISTANCE METER RESISTANCE TEST FIXTURE ESD TEST FIXTURE TEST BOARD W/ DUT ESD PULSE GENERATOR 5 Littelfuse, Inc. Revised: 7/7/5
5 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Littelfuse: PGB4KR PGBSTWR
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