Release of TSSOP14-16 (SOT ) package assembled in ASEN (NXP-ASE JV) Suzhou China

Transcription

1 Qualification Report: Release of TSSOP14-16 (SOT ) package assembled in ASEN (NXP-ASE JV) Suzhou China Emile Busink Quality Assurance Date: August 11, 2010 BL Standard IC s Report nr: NXP Semiconductors Building FB Tel: Gerstweg 2 Fax: AE Nijmegen The Netherlands emile.busink@nxp.com 1

2 1. Subject Release of assembly plant NXP-ASE JV Suzhou China (ASEN) for the TSSOP14-16 package. This qualification report shows details of the tests which were executed to confirm the reliability / quality in NXP-ASE JV Suzhou China (ASEN) for TSSOP Assembly plant ASEN will use the Dark Green / Halogen Free Bill Of Material (BOM). 2. Introduction ASEN Advanced Semiconductor Engineering Incorporated, the world s largest semiconductor assembly and test company, and NXP Semiconductors announced (February 2007) the completion of an assembly and test joint venture, the name of the new company is ASEN. Located in the Suzhou Industrial Park, Southern China, ASEN is strategically placed to serve the rapidly growing global semiconductor assembly and test market. As a joint venture, ownership is split between ASE (60%) and NXP (40%). 3. Qualification Program In line with the NXP Semiconductors Quality and Reliability Specification NX , the Plastic Package Qualification Guidelines SNW-FA-04-07, the Structural Similarity Procedure SNW-FQ-607 and also the AEC Q100 was used as a guideline for specific automotive products. The extensive qualification program was executed to verify the quality of the pins TSSOP14-16 package. 2

3 4. Test Vehicles Lot: I II III Package Name TSSOP14 / SOT402 TSSOP16 / SOT403 TSSOP16 / SOT403 Assembly Centre ASEN ASEN ASEN Device 74AHCT125PW HEF4051BTT 74HC4051PW Die-Size (mm²) 0,825 x 0,740 1,540 x 1,540 1,125 x 1,085 Diffusion Process PM62 BonA PM42 BonA PM57 BonA Leadframe Material / Finish CuFe2P / NiPdAu CuFe2P / NiPdAu CuFe2P / NiPdAu Moulding Compound GE7470 GE7470 GE7470 Glue (Die attach) QMI519 QMI519 QMI519 Diffusion Centre ICN6 (6 ) ICN6 (6 ) ICN6 (6 ) Batch number L8D1A5 L9E4A6 L9C4AX6 5. Reliability Test Details PCON - Preconditioning For a number of stresses to be performed, the SMD devices will undergo preconditioning. This is performed in line with the latest revision of the IPC/JEDEC Standard J-STD-020D, as described in NXP Semiconductors specification SNW-FQ-225A. It is expected that these packages will have a moisture sensitivity level (MSL) of 1, indicating that the products are not sensitive to moisture. The preconditioning sequence that will be applied can be summarised as follows: Moisture soak for 168 hrs at 85 C/85% R.H. Within 4 hours, three times exposure to IR soldering. (Temperature /-0 C) Flux, rinse and dry Electrical test SHTL - Static High Temperature Life Electrical endurance with electrical bias (V cc,max ) at 150 C. This test is the primary test to determine the long-term reliability of the product. Generally there is limited influence of the package on this test. It is nevertheless included to demonstrate the long-term reliability of the product/package combination. TMCL - Temperature Cycling Temperature Cycling (air to air -65 C +150 C) with preconditioning. This test is aimed at the mechanical integrity of the whole product, under the several circumstances of rapid changes in temperature. HTSL - High Temperature Storage High Temperature Storage of devices (150 C). This test evaluates the reliability of the product after long term storage. HAST - Highly Accelerated Steam Test Highly Accelerated Steam Test (130 C/85% R.H.), with electrical bias (Vcc,max ) and preconditioning. This test stresses both the electrical endurance of the design/process, as well as the resistance to moisture of the package. 3

4 GL Test - Gate Leakage Test The purpose of this specification is to establish a reliable and repeatable procedure for determining surface mount integrated circuit susceptibility to Electro-Thermally Induced Parasitic Gate Leakage 155 C, +/-400 Volts). This specification may also be used as an evaluation tool for determining the susceptibility of circuit designs, molding compounds, fabrication processes, and post mold cure processes to GL. BPT - Bond Pull Test This procedure (SNW-FQ-322) will be used in package construction analysis during qualifications, and is required by the automotive product specification (AEC Q100), and as reference for assembly quality monitoring in production. This document applies to all NXP Semiconductors IC packages and multi-die module packages including Surface Mounted Devices (SMDs) and passive integration dies. MSLA - Moisture Sensitivity Level Assessment Described in the NXP Semiconductor specification SNW-FQ-225B. MSL of 1 indicate that the products are not sensitive to moisture. 6. Qualification Requirements Construction Analysis Tests (ConAna) Test # Devices Lots Visual / Mechanical 45 Each lot Physical Dimension 10 Each lot Solder Leadfinish 9 Each lot Solderability 15 Each lot MSLA 11 Each lot Mark 12 Each lot X-Ray 10 Each lot SCAT 22 Each lot Decap 3 Each lot Die Shear 5 Each lot BPT (30 bonds rom a minimum) 5 devices of each lot BST (30 bonds rom a minimum) 5 devices of each lot Lead Tensile 3 Each lot Glueability 5 Each lot Cross Section 3 Each lot 4

5 Construction Analysis Test Descriptions In addition to the reliability evaluation, qualification lots will be subjected to Construction Analysis and Moisture Sensitivity Level assessment testing per the following test methods: Visual/Mechanical Inspection (V/M) SNW-FQ-612B Lead Finish Inspection (LFNH) Local document Moisture Sensitivity Level Assessment SNW-FQ-225B X-Ray Inspection (X-RAY) SNW-FQ-312 SCAT Inspection (SCAT) SNW-FQ-311 Die Shear Testing (DISH) SNW-FQ-322 Bond Pull Testing (BPT) SNW-FQ-322 Bond Shear Testing (BST) SNW-FQ-322 Cross Section Inspection (CROSS) SNW-FQ-314 Solderability Inspection (SOLD) SNW-FQ Construction Analysis (ConAna) / MSLA results All Construction Analysis test results are positive, all criteria and qualification requirements have been met. MSL for this package is level 1, 260 C Pb-free convection reflow. - Dry bag are not required. - Unlimited out of bag Floor Life at maximum ambient 30 C/85%RH. 8. Qualification Requirements Reliability Tests Stress Required Readpoints per x total batch 150ºC 168 hrs 0,168,1000 hrs 0/ ºC 1000 hrs 0,1000,2000 hrs 0/ PCON¹ + 130ºC 144 hrs 0,144,192 hrs 0/ PCON¹ + TMCL* 500 cls 0,200,500,1000 cls 0/ Gate Leakage 155ºC 2x3 parts 0 volts, +/- 400 volts 0/ BPT after 500 cls 6x5 parts Spec > 3 gr 0/ ¹ PCON = Moisture Sensitivity Level (MSL) of 1. *= BPT after TMCL 500 cls. 5

6 9. Reliability Test Results 9.1 SHTL - Static High Temperature Life Electrical endurance with electrical bias at 150 C. Lot Product Result at (hrs): I 74AHCT125PW 0/77 0/77 0/77 II HEF4051BTT 0/77 0/77 0/77 III 74HC4051PW 0/77 0/77 0/ PCON + HAST - Highly Accelerated Steam Test Preconditioning (PCON) is performed in line with the latest revision of the IPC/JEDEC J-STD-020D specification, as described in the NXP Semiconductor specification SNW-FQ-225A. Highly Accelerated Steam Test (130 C / 85% RH) with preconditioning (PCON), and electrical bias. This test is a replacement for THBS. Lot Product Result at (hrs): I 74AHCT125PW 0/77 0/77 0/77 II HEF4051BTT 0/77 0/77 0/77 III 74HC4051PW 0/77 0/77 0/ PCON + TMCL * - Temperature Cycling Temperature Cycling (air-to-air, -65 C 150 C) with preconditioning. Lot Product Result at (cycles): * 1000 I 74AHCT125PW 0/82 0/82 0/82 0/77 II HEF4051BTT 0/82 0/82 0/82 0/77 III 74HC4051PW 0/82 0/82 0/82 0/77 *= BPT after TMCL 500 cls (See 9.6) 6

7 9.4 HTSL - High Temperature Storage High Temperature Storage of devices (150 C / No Bias). Lot Product Result at (hrs): I 74AHCT125PW 0/77 0/77 WK1043 II HEF4051BTT 0/77 0/77 0/77 III 74HC4051PW 0/77 0/77 0/ GLT Gate Leakage Test To determine surface mount integrated circuit susceptibility to Electro-Thermally Induced Parasitic Gate Leakage (155 C / No Bias). Lot Product Result at: V (Pos.) V (Neg.) I 74AHCT125PW 0/6 0/6 0/6 II HEF4051BTT 0/6 0/6 0/6 III 74HC4051PW 0/6 0/6 0/6 9.6 BPT Bond Pull Test Will be executed in package construction analysis during qualification, and is required by the Automotive product specification (AEC Q100). Lot Product Result at: 0 Spec > 3 gr After TMCL 500 cls I 74AHCT125PW 0/5 0/5 0/5 II HEF4051BTT 0/5 0/5 0/5 III 74HC4051PW 0/5 0/5 0/5 10. Conclusion All qualification requirements have been met. 7

8 11. Document Revision Sheet R E V I S I O N S H E E T DATE Yymmdd REV DESCRIPTION AUTHOR Qualification Report: Release of TSSOP14-16 (SOT ) package assembled in ASEN (NXP- ASE JV) Suzhou China E. Busink 8