AEC-Q100G Qualification Result

Transcription

1 AEC-Q100G Qualification Result Objective: Mamba TSMC14 Fab Qualification with Cu Wire on 516 TePBGA 27x27 mm and TEPBGA *27 in FSL-KLM-FM Freescale PN: SPC5674 Plan or : Technology: (H009FHX6) Package: 516 TePBGA 27x27 mm (5193) Design Engr: Not applicable QUARTZ Tracking #: Fab / Assembly / TSMC14/FSL-KLM-FM/FSL-KLM-FM Product Engr: KW Soon_R64558 Final Test s: Maskset#: N31E GAO(Global Assembly Chan Weng Hoong-B14777 Rev#: 0 Aperation) Engr: Die Size (in mm) X mm NPI PRQE: Chew Kim Seong-B36347 W x L (Signature/Date shown below may be electronic) GAO Approval (for Chan Weng Hoong-B14777 DIM/BOM results) 16-May-2014 NPI PRQE Approval Chew Kim Seong-B May-2014 Part Operating Temp. Grade: Grade 1-40 C to C Trace/DateCode: LOT A 8EMHA1XXJP 00 LOT B NA LOT C NA CAB Approval M May-2014 Customer Approval NA TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY This testing is performed by Freescale Reliability Lab (KLM) unless otherwise noted in the Comments. GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS End Point Requirements Minimum Sample Size # of Lots including spares Lot ID-(#Rej/SS) NA=Not Applicable A113 J-STD-020 Preconditioning (PC) : PC required for SMDs only. MSL 260 C, +5/-0 C All surface mount devices prior to THB, HAST, AC, Pass TC and as required per test conditions. PC Lot B: 0/231 THB A101 A110 Temperature-Humidity-Bias (THB): PC before THB (for SMDs only): Required THB = 85 C/85%RH for 1008 hrs. Bias = Max Vdd Timed RO of 48hrs. MAX Pass A102 A118 Unbiased HAST (UHST): PC before UHST (for SMDs only): Required UHST = 110 C/85%RH for 264 hrs. R Pass UHST Timed RO of 2-48hrs. MAX TC A104 AEC Q100- Appendix 3 Temperature Cycle (TC): H Pass PC before TC (for SMDs only): Required For AEC: WBP =/> 3 TC = -65 C to 150 C for 500cycles grams ; WP: 0/5, min > 3 grams WBP after TC on 5 devices from 1 lot; 2 bonds per corner and one mid-bond per side on each device. ; WP: 0/5, min > 3 grams Record which pins were used. HTSL A103 High Temperature Storage Life (HTSL): 150 C for 1008 hrs Timed RO = 96hrs. MAX Pass TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS High Temperature Operating Life (HTOL): C A108 Ta = 125 C Cobra90, (N23A_TSMC14), 516 TePBGA 27x27, Bias = 1.6V (Core), 4.0V (DGO), 5.8V (HV) for Q213667: 0/ hrs Fado, (N61C_TSMC14), MAPBGA x17, Devices incorporating NVM shall receive 'NVM Q212483: 0/308 HTOL ELFR AEC Q Early Life Failure Rate (ELFR): Ta = 125 C for 48 hrs; Bias = 1.6V (Core), 4.0V (DGO), 5.8V (HV) Timed RO of 48 hrs MAX Lot A: 0/800 Q213667: 0/1498 Fado, (N61C_TSMC14), MAPBGA *17, Q212483: 0/1619 EDR AEC Q NVM Endurance, Data Retention, and Operational Life (EDR): Ta= 150 C (non bias) for 168 hrs. Devices incorporating NVM shall receive 'NVM C Q213667: 0/239 for 1008hrs Fado, (N61C_TSMC14), MAPBGA x17, Q212483: 0/336 for 1008hrs FORMPPAP004XLS 1 of 6 Freescale Rev T

2 Plan or : TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS AEC Q Wire Bond shear (WBS) Cpk = or > bonds WBS 1 5 Lot A: 0/5; Cpk>1.67 Cobra, (N23A), PBGA-PGE516 27*27, FSL-KLM-FM, Lot A: 0/5; Cpk> 1.67 Lot C: 0/5; Cpk> 1.67 Lot D: 0/5; Cpk> 1.67 WBP MilStd Wire Bond Pull (WBP): Cond. C or D Cpk = or > bonds 1 5 Lot A: 0/5; Cpk>1.67 Cobra, (N23A), PBGA-PGE516 27*27, FSL-KLM-FM, Lot A: 0/5; Cpk> 1.67 Lot C: 0/5; Cpk> 1.67 Lot D: 0/5; Cpk> 1.67 SD B102 Solderability (SD): 8hr.(1 hr. for Au-plated leads) Steam age prior to test. >95% lead coverage of critical areas 15 PD B100 Physical Dimensions(PD): PD per FSL 98A drawing Cpk = or > DIM & BOM Dimensional (DIM): GAO to verify PD results against valid 98A drawing. BOM Verification (BOM): GAO to verify qual lot ERF BOM is accurate. DIM: No change BOM: Approved SBS AEC-Q Solder Ball Shear (SBS): Performed on all solder ball mounted packages e.g. PBGA, Chip Scale, Micro Lead Frame (but NOT Flip Chip). Two reflow cycles at MSL reflow temperature before shear. Cpk = or > (5 balls from a min. of 10 devices) TEST GROUP D - DIE FABRICATION RELIABILITY TESTS Comments Electro Migration (EM) EM TDDB HCI SM NBTI Time Dependent Dielectric Breakdown (TDDB) Hot Carrier Injection (HCI) Stress Migration (SM) Negative Bias Temperature Instability (NBTI) TEST GROUP E - ELECTRICAL VERIFICATION TESTS Freescale 48A Pre- and Post Functional / Parametrics (TEST): For AEC, test software shall meet requirements of AEC-Q TEST Testing performed to the limits of device specification in temperature and limit value. 0 Fails All All All See Summary This action refers to Final Testing of all qualification units. HBM AEC-Q / ElectroStatic Discharge/ A114E Human Body Model Classification (HBM): Jan /1000/1500/2000 Volts For AEC, see AEC-Q for classification 2KV min Lot A: 1000V: 0/ V: 0/3 MM AEC-Q ElectroStatic Discharge/ or JESD22 Machine Model Classification m(mm): 200 Volts For AEC, see AEC-Q for classification 200V min. CDM AEC-Q ElectroStatic Discharge/ Charged Device Model Classification (CDM): 250/500/750 Volts For AEC, see AEC-Q for classification Timed RO of 96hrs MAX. All pins =/> 500V For AEC, Corner pins =/> 750V; 1 9 Lot A: 250V: 0/3 750V: 0/3 (Corner pins) LU JESD78 plus AEC-Q for AEC Latch-up (LU): Lot A: 0/6 Test per JEDEC JESD78 with the AEC-Q requirements for AEC. Ta= Maximum operating temperature Vsupply = Maximum operating voltage AEC-Q , Electrical Distribution (ED) C Pass, Cpk>1.67 Freescale 48A spec ED FORMPPAP004XLS 2 of 6 Freescale Rev T

3 Plan or : FG Q Fault Grading (FG) FG shall be = or > 90% for qual units FG%= No change GL Q Electro-Thermally Induced Gate Leakage (GL): R NA Freescale does not plan Gate Leakage testing in alignment with the expected revision 155 C, 2.0 min, +400/-400 V to AEC Q100 that will eliminate this "for information only" stress. Per AEC Q100 Rev G, this test is performed for information only. Timed RO of 96 hrs MAX. For all failures, perform unbiased bake (4hrs/125 C, or 2hrs/150 C) and retest; recovered units are GL failures. EMC SAE J1752/3 - Radiated Emissions Electromagnetic Compatibility (EMC) (see AEC Q100 Appendix 5 for test applicability; done on case-by-case basis per customer/freescale agreement) <40dBuV 150kHz - 1GHz 1 Product Information FSL-KLM-FM Q TSMC14 / N31E / Mamba / SPC X TEPBGA PGE 516 CRM-1525 SUMITOMO G770SFL 20um PdCu Package List FSL-KLM-FM Q TSMC14 / N23A / Cobra90 / SPC X TEPBGA PGE 516 CRM-1525 SUMITOMO G770SFL 20um PdCu Q FSL-ATMC-FM / M17W / Mamba / SPC X FSL-KLM-FM TEPBGA PGE 516 CRM-1525 SUMITOMO G770SFL 20um PdCu Die List FSL-KLM-FM Q TSMC14 / N23A / Cobra90 / SPC X TEPBGA PGE 516 CRM-1525 SUMITOMO G770SFL 23um Au Q TSMC14 / N61C / Fado / SPC X FSL-KLM-FM MAPBGA *17 (5253) ABLEBOND 2025D SUMITOMO G770SFL 23um Au Devices Qualify By Similarity FSL-KLM-FM NA TSMC14 / N31E / Mamba / SPC X TEPBGA 416 CRM-1525 SUMITOMO G770SFL 20um PdCu 27*27 (5252) Revision Date Comments Author Rev O 8-May-14 Qualification results update. Chew Kim Seong FORMPPAP004XLS 3 of 6 Freescale Rev T

4 Plan or : AEC-Q100G Qual Objective: Mamba TSMC14 Qualification with Cu Wire on PBGAPGE SQ1.25P1.0 in FSL-KLM-FM Freescale PN: SPC5673 Plan or : See revision history below Technology: Design Engr: Not applicable QUARTZ Tracking #: Package: PBGAPGE SQ1.25P1.0 Fab / Assembly / TSMC14 / FSL-KLM-FM / FSL-KLM-FM Product Engr: Mohd Yusof Shahrul-R55167 (Signature/Date shown below may be electronic) Final Test s: Maskset#: N31E GAO(Global Assembly Chan Weng Hoong-B14777 GAO Approval (for Chan Weng Hoong-B14777 Rev#: 0 Operation) Engr: DIM/BOM results) 15-May-2014 Die Size (in mm) X mm NPI PRQE: Chew Kim Seong-B36347 NPI PRQE Approval Chew Kim Seong-B36347 W x L May-2014 Part Operating Grade 1-40 C to C Trace/DateCode: LOT A LOT B LOT C CAB Approval M-04 Temp. Grade: 8EMHA1Z0J8 8EMHA1Z14Y00 16-May Customer Approval NA TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY This testing is performed by Freescale Reliability Lab (KLM) unless otherwise noted in the Comments. GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS End Point Requirements Minimum Sample Size # of Lots including spares Lot ID-(#Rej/SS) NA=Not Applicable A113 J-STD-020 Preconditioning (PC) : PC required for SMDs only. MSL 260 C, +5/-0 C All surface mount devices prior to THB, HAST, AC, UHST, TC and as required per test conditions. PC Lot B: 0/231 Mamba_SPC5673L, (M17W), PBGAPGE *23, Q224258; Temperature-Humidity-Bias (THB): PC before THB (for SMDs only): Required THB = 85 C/85%RH for 1008 hrs Pass THB Bias = Max Vdd Timed RO of 48hrs. MAX A101 A110 A102 A118 Unbiased HAST (UHST): PC before UHST (for SMDs only): Required UHST = 110 C/85%RH for 264 hrs. R Pass UHST Timed RO of 2-48hrs. MAX A104 AEC Q100- Appendix 3 Temperature Cycle (TC): H PC before TC (for SMDs only): Required For AEC: WBP =/> 3 TC = -50 C to 150 C for 1000 cycles. grams WBP after TC on 5 devices from 1 lot; 2 bonds per corner and one mid-bond per side on each device. Record which pins were used WP: 0/5, min > 3 grams ; WP: 0/5, min > 3 grams ; WP: 0/5, min > 3 grams TC Mamba_SPC5673L, (M17W), PBGAPGE *23, Q224258; ; WP: 0/5, min > 3 grams HTSL A103 High Temperature Storage Life (HTSL): 150 C for 1008 hrs. Timed RO = 96hrs. MAX Pass TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS High Temperature Operating Life (HTOL): A108 AEC Ta = 125 C for 1008 hrs. Bias = 1.6V (Core), 4.0V (DGO), 5.8V (HV) C Pass Cobra90, (N23A_TSMC14), 516 TePBGA 27x27, Q213667: 0/231 HTOL Devices incorporating NVM shall receive 1X 'NVM Fado, (N61C_TSMC14), MAPBGA x17, Q212483: 0/308 Mamba, (N31E_TSMC14), 516TePBGA 27x27, Q223225: Result: 0/77 ELFR AEC Q Early Life Failure Rate (ELFR): AEC Ta = 125 C for 48 hrs Bias = 1.6V (Core), 4.0V (DGO), 5.8V (HV) for Timed RO of 48 hrs MAX Pass Q213667: 0/1498 Fado, (N61C_TSMC14), MAPBGA *17, Q212483: 0/1619 Mamba, (N31E_TSMC14), 516TePBGA 27*27, Q223225: Result: 0/800 EDR AEC Q NVM Endurance, Data Retention, and C Pass Operational Life (EDR): Devices incorporating NVM shall receive 'NVM Q213667: 0/239 for 1008hrs Fado, (N61C_TSMC14), MAPBGA *17, Q212483: 0/336 for 1008hrs Mamba, (N31E_TSMC14), 516TePBGA 27*27, Q223225: Result: 0/77 FORMPPAP004XLS 4 of 6 Freescale Rev T

5 Plan or : TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS AEC Q Wire Bond shear (WBS) Cpk = or > bonds WBS 2 10 Lot A: 0/5; Cpk > 1.67 Mamba_SPC5673L, (M17W), PBGAPGE *23, Lot A: 0/5; Cpk > 1.67 MilStd883- Wire Bond Pull (WBP): Cpk = or > bonds 2 10 Lot A: 0/5; Cpk > Cond. C or D Mamba_SPC5673L, (M17W), PBGAPGE *23, Lot A: 0/5; Cpk > 1.67 WBP Solderability (SD): >95% lead coverage 15 B102 8hr.(1 hr. for Au-plated leads) Steam age prior to of critical areas SD test. If production burn-in is done, samples must also undergo burn-in prior to SD. Physical Dimensions(PD): Cpk = or > B100 PD per FSL 98A drawing PD Dimensional (DIM): DIM: Not change DIM & BOM GAO to verify PD results against valid 98A drawing. BOM Verification (BOM): GAO to verify qual lot ERF BOM is accurate. BOM: Approved AEC-Q Solder Ball Shear (SBS): Cpk = or > For solder ball mounted packages only; NOT for Flip Chips. Performed on all solder ball mounted packages (5 balls from a SBS e.g. PBGA, Chip Scale, Micro Lead Frame (but NOT Flip Chip). min. of 10 devices) Two reflow cycles at MSL reflow temperature before shear. Lead Integrity (LI): No lead breakage or 5 LI B105 Not required for surface mount devices; Only required for through-hole devices. cracks (10 leads from each of 5 parts) TEST GROUP D - DIE FABRICATION RELIABILITY TESTS End Point Requirements Minimum Sample Size # of Lots including spares Lot ID-(#Rej/SS) NA=Not Applicable Comments Electro Migration (EM) EM Time Dependent Dielectric Breakdown (TDDB) TDDB Hot Carrier Injection (HCI) HCI Stress Migration (SM) SM Negative Bias Temperature Instability (NBTI) NBTI TEST GROUP E - ELECTRICAL VERIFICATION TESTS Freescale 48A Pre- and Post Functional / Parametrics (TEST): For AEC, test software shall meet requirements of AEC-Q TEST Testing performed to the limits of device specification in temperature and limit value. 0 Fails All All All See Summary This action refers to Final Testing of all qualification units. AEC-Q / ElectroStatic Discharge/ 0 0 Pass A114E Human Body Model Classification (HBM): 2KV min. Mamba, (N31E ), PBGA-PGE516 27*27, FSL-KLM-FM, Q223225: Jan /1000/1500/2000 Volts Lot A: For AEC, see AEC-Q for classification HBM 1000V: 0/ V: 0/3 AEC-Q ElectroStatic Discharge/ or JESD22 Machine Model Classification m(mm): 200V min. 50/100/200 Volts MM For AEC, see AEC-Q for classification AEC-Q ElectroStatic Discharge/ 0 0 Pass Charged Device Model Classification (CDM): All pins =/> 500V Mamba, (N31E ), PBGA-PGE516 27*27, FSL-KLM-FM, Q223225: 250/500/750 Volts For AEC, Corner pins Lot A: CDM For AEC, see AEC-Q for classification =/> 750V; 250V: 0/3 Timed RO of 96hrs MAX. 750V: 0/3 (Corner pins) LU JESD78 plus AEC-Q for AEC Latch-up (LU): Pass Test per JEDEC JESD78 with the AEC-Q Mamba, (N31E ), PBGA-PGE516 27*27, FSL-KLM-FM, Q223225: requirements for AEC. Lot A: 0/6 Ta= Maximum operating temperature Vsupply = Maximum operating voltage FORMPPAP004XLS 5 of 6 Freescale Rev T

6 Plan or : AEC-Q , Electrical Distribution (ED) Freescale 48A spec C For AEC, Cpk target > Pass Comparison between Cu wire and Au wire at T0 Mamba, (N31E), 516TePBGA 27*27, Result: Cpk > 1.67 ED Q Fault Grading (FG) FG shall be = or > 90% for qual units FG%= No change FG CHAR Q003 Characterization (CHAR): Ony performed on new technologies and part families per AEC Q003. Not required GL (for information only) Q Electro-Thermally Induced Gate Leakage (GL): R 6 Freescale does not plan Gate Leakage testing in alignment with the expected revision 155 C, 2.0 min, +400/-400 V to AEC Q100 that will eliminate this "for information only" stress. Per AEC Q100 Rev G, this test is performed for information only. Timed RO of 96 hrs MAX. For all failures, perform unbiased bake (4hrs/125 C, or 2hrs/150 C) and retest; recovered units are GL failures. EMC SAE J1752/3 - Radiated Emissions Electromagnetic Compatibility (EMC) (see AEC Q100 Appendix 5 for test applicability; done on case-by-case basis per customer/freescale agreement) <40dBuV 150kHz - 1GHz 1 Product Information FSL-KLM-FM Q TSMC14 / N31E / Mamba / SPC X PBGAPGE 324 CRM-1525 SUMITOMO G770SFL 20um PdCu 23SQ1.25P1.0 (5366) Die List: FSL-KLM-FM Q TSMC14 / N23A / Cobra90 / SPC X TEPBGA PGE 516 CRM-1525 SUMITOMO G770SFL 23um Au Q TSMC14 / N61C / Fado / SPC X FSL-KLM-FM MAPBGA *17 (5253) ABLEBOND 2025D SUMITOMO G770SFL 23um Au Q TSMC14 / N31E / Mamba / SPC X FSL-KLM-FM TEPBGA PGE 516 CRM-1525 SUMITOMO G770SFL 20um PdCu Package List: Q TSMC14 / 0N23A Cobra90 / SPC X FSL-KLM-FM PBGA-PGE 516 CRM-1525 SUMITOMO G770SFL 20um PdCu / 27SQ1.25P1 (5193) PBGA-PGE 516 Q FSL-ATMC-FAB / Mamba / SPC X FSL-KLM-FM CRM-1525 SUMITOMO G770SFL 20um PdCu 3M17W / 27SQ1.25P1 (5193) PBGAPGE Q FSL-ATMC-FAB / Mamba / SPC X FSL-KLM-FM 324 CRM-1525 SUMITOMO G770SFL 20um PdCu 3M17W / 23SQ1.25P1.0 (5366) Revision Date Comments Author Rev O 8-May-14 Qualfiication result update. Chew Kim Seong FORMPPAP004XLS 6 of 6 Freescale Rev T