Lead Free Process Group. Jasbir Bath Solectron Corporation Process Team Leader
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1 Lead Free Process Group Jasbir Bath Solectron Corporation Process Team Leader
2 Acknowledgements NEMI Lead Free Process Team Len Poch, Maurice Davis Universal Instruments Jeff Schake DEK USA Denis Barbini Vitronics-Soltec Oliver Bast Orbotech Steve Martell Sonoscan Mark Walz, Terry Leahy, Harold Hyman SRT/Genrad Jeremy Jessen Agilent Jana Coustineau Alcatel Frank Grano SCI Chuck Woychik IBM Al Gickler Johnson Manufacturing Ray Altieri Indium Corp. Dennis Bernier Kester Solder Rob Herber Alpha Metals Brian Bauer Heraeus Thilo Sack Celestica
3 Agenda Paste Evaluation (Solectron Milpitas) Paste printability, X-ray inspection, Reflow profile, Cross-sections, Pull/Shear tests NEMI Reliability Test board builds (Universal Instruments) - Printability, Placement, Reflow, Electrical Inspection X-ray inspection- Agilent Technologies Sonoscan Inspection AOI Inspection (Orbotech) BGA/ CSP rework (SRT/Genrad) Wave soldering evaluations (Vitronics- Soltec)
4 Paste Evaluation (Solectron( Solectron,, Milpitas, CA) Evaluate five Sn3.9Ag0.7Cu and five Sn37Pb solder pastes. Choose one SnPb and one SnAgCu paste for use on NEMI reliability test boards. Evaluation criteria: High Paste volume and good consistency of print on test board on 16mil, 20mil QFP pads, 0402 chip pads, 1mm, 1.27mm pitch BGA pads. Reflow with tin-lead coated components and lead-free components placed on test board: visual inspection of joints after reflow (nitrogen atmosphere used in reflow oven). Test board- OSP surface finish, 62mil FR4 board X-ray inspection: X-ray defect report for lead-free and tin-lead paste soldered boards Cross-sections of selected components Pull tests/ Shear tests
5 Paste Evaluation(Solectron Milpitas) {-Max Vol 16mil pads: 3840Cumils} mil pitch pad Paste Volume and Standard Deviation of Volume Paste Volume (Cumils) Average Volume SnPb Stdev SnPb Average Volume SnAgCu Stdev SnAgCu Paste Number
6 Paste Evaluation(Solectron Milpitas) Paste Volume (Cumils) 50mil pitch BGA Paste Volume and Standard Deviation Paste Volume Paste Number Average SnAgCu Stdev SnAgCu Average SnPb Stdev SnPb
7 Paste Evaluation(Solectron Milpitas) SnAgCu Paste 4 (left): SnPbPaste 5 (right)
8 Paste Evaluation(Solectron Milpitas) X-ray defect report for SnPb and SnAgCu solder pastes Defect Number Paste Number Defect report No.SnPb Defect report No.SnAgCu
9 Paste Evaluation(Solectron Milpitas) Summary Print scoresx-ray scoressolderability Total Other comments SnPb Paste SnPb Paste SnPb Paste SnPb Paste SnPb Paste SnAgCu Paste Stencil Life issue SnAgCu Paste SnAgCu Paste SnAgCu Paste SnAgCu Paste
10 Paste Evaluation(Solectron Milpitas)NiPd QFP SnPb Paste 5 (left): SnAgCuPaste 4 (right)
11 Paste Evaluation(SLR Milpitas)Pure Sn1206 SnPb Paste 5 (left): SnAgCuPaste 4 (right)
12 Paste Evaluation(Solectron Milpitas) Pull Force (lbs) Pull force for NiPd QFP leads before and after ageing (-40 C to 125 C, 1000 cycles) Average Sn37Pb SnAgCu Sn37Pb(After ATC) SnAgCu(After ATC)
13 Paste Evaluation(Solectron Milpitas) Shear force (lbs) before and after ageing(-40 C to 125 C, 1000 cycles) for pure tin coated 1206 chip Shear Force(lbs) Average Sn37Pb SnAgCu Sn37Pb(After ATC) SnAgCu(After ATC)
14 NEMI Reliability Test Board Builds (Universal Instruments SMT Lab, Binghamton, NY) DEK 265 Screen Printing Machine(plus SVS paste inspection machine) Universal GSM placement machine Vitronics-Soltec reflow oven(10 zone) in Nitrogen atmosphere(<20ppm O2) 208CSP, 169CSP, 256PBGA, 256CerBGA, 48TSSOP and 2512 resistor boards Lead-free Paste Component peak temperatures C(Time over 217 C: 61-90sec) Tin-lead Paste component peak temperatures C(Time over 183 C: 83-88sec) 62 mil thick High Tg (170 C) FR4 board, Immersion Ag surface finish
15 X-ray Inspection (Agilent( Agilent,, Loveland, CO) X-ray inspection of boards (Agilent 5DX) Initial observations: Lead-free paste with tin-lead components> voiding than lead-free paste with lead-free components> voiding than tin-lead paste with tin-lead components
16 AOI Inspection (Orbotech( Orbotech,, Santa Ana, CA) AOI inspection of lead-free and tinlead TSSOP(NiPd/SnPb) and 2512(Sn/Sn10Pb) resistor boards Evaluate and compare solder joint shape/geometry and wetting for: (1)Lead-free paste soldered with lead-free component (2) Lead-free paste soldered with tin-lead component (3) Tin-lead paste soldered with tinlead component
17 Genrad/SRT (Westford( Westford,MA) Rework NEMI 208CSP(0.8mm pitch) and 256PBGA(1.27mm pitch) lead-free and tin-lead boards using SRT Summit 1100HR Plus machine Develop BGA/CSP rework profiles for lead-free paste with lead-free and tin-lead components and compare with profile for tin-lead paste with tinlead component boards
18 BGA/CSP SRT/Genrad Rework Additional control features were used to rework the SnAgCu solder alloy. Positive air feature was used to keep the temperature of the top of the BGA to a more modest temperature. Maximum BGA top surface temperature (purple line) kept to 212 C while the solder joint was raised to 243 C and kept over melting point (217 C) for 74 seconds
19 Sonoscan(Elk Grove Village, IL) Inspect BGA/CSP and TSSOP components preassembly, post-assembly and post-thermal cycling for package delamination and other anomalies 208CSP and 169CSP post-assembled tin-lead and lead-free boards inspected so far: No major anomalies
20 Process Timelines NEMI Reliability test board builds: Complete: November 2000 X-ray inspection: To be complete by Jan BGA rework evaluations: Complete by Jan/Feb AOI inspection: Complete by Jan/Feb Sonoscan inspection: Pre-build: Completed Oct 2000 Post-build: Complete by Jan/Feb 2001 Post-thermal cycling: Complete by June 2001
21 Wave Solder Overview (Vitronics( Vitronics-Soltec, Binghamton, NY)
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