C3P and NASA Technical Workshop September 8 th 2005, Lisbon, Portugal

Transcription

1 C3P and NASA Technical Workshop September 8 th 2005, Lisbon, Portugal s Initiatives RoHS compatible electronics boards design and assembly in Israel Moshe Salem General Manager iltam@iltam.org

2 Content About RoHS Readiness in Israel Activities toward RoHS implementation Seminars Evauation Projects Telecom & commercial track Military & aerospace track 2

3 About - The Israeli Users' Association of Advanced Technologies in Electronics - is a non-profit organization which started its activities in 1993 The association was established by the industry, for the industry and it is owned by its members (The Israeli high tech Industry) Currently there are about 90 electronics companies from the high tech industry in Israel which are members operates under the umbrella of the MAGNET program, within the framework of the Office of the Chief Scientist of the Israeli Ministry of Industry and Trade 3 magnet_lis bon.ppt

4 About (cont) 's aim is to support and encourage knowledge sharing among its members on the latest technological breakthroughs developed in Israel and abroad encourages the implementation of generic technological projects, which are performed by industries of the same line of activity, the knowledge and results of each project are open to all the companies comprising the project is looking for fruitful and prosperous cooperation with international organizations in the electronic field which have similar objectives, in order to formulate a framework for mutual work 4

5 RoHS Readiness in Israel OEM Companies Most of the companies are aware of the RoHS directive and its implications for them Companies defined their own policy and roadmaps and working to comply with RoHS EMS Companies Selected materials and setup processes Experiencing real products lead free assembly PCB Manufacturers Evaluate and acquire base materials In process of expanding lead free finishes capabilities 5

6 Logistics Preparations by OEM Companies at Israel Define affected products by RoHS directive Evaluate and set a catalog scheme and material management procedures Collect component and materials related data and update internal management systems Define logistics transition models from SnPb to Lead Free based processes Evaluate readiness of current EMS 6

7 Activities toward RoHS implementation assimilates the awareness and brought to Israel the knowledge by world class experts and local industry professionals As part of s goals to accelerate the implementation of advanced technologies and encourage knowledge sharing between its members, initiated an evaluation project for the assembly and test of RoHS compliant electronics boards is cooperating with leading international groups like Soldertec, SMTA, C3P and JGPP 7

8 Seminars in Israel Bob Willis, SMART Lead Free Assembly & Soldering Kay Nimmo, Soldertec RoHS Directive & Legistlative Process Rob Walls, Piek IPC Implementation of a Manufacturing Process Dr. Craig Hillman, DfR Reality of Pb-Free Reliability Dr. Jennie Hwang, H-Technologies Day 1 - Materials & Processes Day 2 - Reliability & Compatibility Day 3 - Workshop Rob Walls, Piek IPC Lead Free updates in IPC standards 8

9 Evaluation project for the assembly and test of RoHS compliant electronics boards Project Framework members - OEM, EMS and PCB manufacturers joined together to form the project team Project started by the end of 2004 and will last till mid 2006 Project team meets monthly for follow up and information exchange Project activities are coordinated by 9

10 Participating companies Participating companies Actelis, Alvarion, BATM, Creo, Digitron, Ezchip, ECI, EL-OP, Elbit Systems, Eltek, ELTA, IAI, Orbotech, Polycom, RAD com, Seabridge, Telrad, TKS 10

11 Project Objectives Evaluate solder joints quality and reliability for Lead Free and non Lead Free components with Lead Free paste/solder and various Lead Free PCB finishes Evaluate solder joints quality and reliability for Lead Free components with SnPb paste/solder Experiencing component engineering, purchasing and logistics specific aspects on real products Knowledge sharing and cross fertilization between the participating companies along the project and its results. 11

12 Project Process Definition OEM companies select one or two product boards, purchase RoHS compliant bare board and components, assemble the boards and conduct electrical tests The assembled boards will be sent to qualified labs for quality tests A final report summarizing the experience and conclusions of the project will be prepared and distributed among s members Note : Some companies evaluating a test vehicle prior to product assembly 12

13 Telecom and Commercial Track Preliminary Evaluation Phase 1 Solder paste evaluation (not shown) Phase 2 Test vehicle assembly Phase 3 Solder joint reliability tests Product assembly and test Phase 4 Product Assembly Phase 5 Electrical tests Phase 6 Quality and reliability evaluation 13

14 Phase 2 Test vehicle assembly Test vehicle designed to meet IPC-9701 test methods Daisy chained dummy components are connected to resistance monitoring system 14

15 Phase 3 Solder joint reliability tests Test vehicle boards are subjected to temprature cycling (0 100 deg C 10 cycles/day) Daisy chains are monitored for resistance changes (failure = 20% increase) Note : Boards shown outside the temp chamber 15

16 Phase 3 Solder joint reliability tests Performed tests Visual inspection X Ray inspection Cross section microscopy before/afrer thermal cycling Preliminary results After more than 1000 cycles similar performance observed with various lead free paste/finish combinations and as compared to reference SnPb assy 16

17 Phase 4 Product assembly - Actual Parameter Size (inches) Critical comp type Comp count % LF comp 6x5.5 BGA 20 mil % 9x9 20 mil BGA % 11x6.7 FPBGA 20 mil % PCB finish Solder paste ENIG Imm Silver SAC305 Imm Silver SAC305 Imm Silver SAC387 17

18 Phase 4 Product assembly - Actual (cont) Parameter PCB material Layers count PCB thick (mm) Maturity in SnPb FR4 Tg= Production FR4 Tg= Initial series FR Production Qty assembled Assembly line Internal EMS Internal Assembly date

19 Phase 4 Product assembly - Planned Parameter Size (inches) Critical comp type Comp count % LF comp Telecom Company A 8.2x9 Mix 20 mil 2279 TBD 11.8x15.7 BGA 0.8 FP Telecom Company B 11.3x12.6 SMT,FBGA TH Telecom Company C 12x12 FBGA,PQFP FP / % -95% 90% 95% PCB finish Solder paste Imm Silver SAC Imm Silver SAC TBD SAC Imm Silver SAC (In) 19

20 Phase 4 Product assembly Planned (cont) Parameter PCB material Layers count PCB thick (mm) Maturity in SnPb Telecom Company A FR4 Hi-Tg Production IS410/or Nelco4000 Telecom Company B TBD Telecom Company C Initial series Production FR4 Tg=180 New Product Assembly line Planned Assy date EMS EMS EMS EMS

21 Phase 4 Product assembly and test (example 1) Design by BATM and Assembly by EMS 21

22 Phase 4 Product assembly and test (example 2) Design and Assembly by Creo (a Kodak company) 22

23 Phase 5 Electrical tests Assembled lead free boards were electrically tested by the OEM companies (ICT/JTAG/Functional) Lead free boards are under evaluation in a working product/system at the OEM site Phase 6 Quality and reliability evaluation Visual inspection X Ray inspection Cross section microscopy (SEM/EDS) Mechanical tests Note : SEM Scanning Electron Microscopy EDS Energy Dispersive Spectrometry 23

24 Military and Aerospace Track 24

25 Project plan First year ( ) 2006) Reliability of Lead Free components and SnPb components using SnPb soldering process Identify Lead-Free components and their backwards compatible to SnPb soldering Recommendation for process change to fit mixed components The effect of Lead-free components on reliability of the PCB soldered with SnPb solder paste and process Note : The project is based on the work done by the JGPP group and continue it 25

26 Project plan second year ( ) Lead-Free components and process Identify and choosing Lead-Free solder paste Recommendation on PCB Lead-Free technology (laminate and finishing) Reliability of Lead-Free technology The effect of conformal coating on the reliability 26

27 Test Vehicle Assembly The test vehicle is a printed circuit board (PCB), designed to evaluate solder joint reliability. The design incorporates components representative of the parts used for defense and space systems The test vehicle will be used for all tests. The PCB will have 2 components sides. The test vehicle will include a variety of plated through hole (PTH) and surface mount technology (SMT) components Most of the components will be dummy daisychained components and will contain simulated die 27

28 Test Vehicle Assembly (cont) The test vehicle will also include the following test pattern: Resolution test pattern (line and spaces in variable spaces) Wetting test pattern Daisy chain plated through hole (various sizes) for PWA reliability test The PCB shall have the following surface finish options: Immersion silver surface finish HASL surface finish The PCB will be made from: High temperature laminates (glass transition temperature of 170 o C per IPC-4101/26) Polyimide laminates 28

29 Experiment design (First Year) First Year Site A Pre test Metallurgy cross Process Temp profile Process PWA Material PWB Finishing Commponents Solder Past Number of boardssection optimization optimization Standard FR4 HASL Lead Free + BGA SnPb SnPb control FR4 HASL SnPb SnPb Standard Polyimide HASL SnPb SnPb Standard FR4 Im Ag Lead Free+ BGA SnPb SnPb Rework and SAC BGA Assemblies using Tin- Lead solder with higher reflow profile FR4 HASL Lead free + BGA SAC SnPb Total 94 First Year Site B Metallurgy cross Process Temp profile Ptrocess PWA Material PWB Finishing Commponents Solder Past Number of boardssection optimization optimization Standard Polyimide HASL Lead Free + BGA SnPb SnPb Control Polyimide HASL SnPb SnPb Standard Sp Polyimide Im Ag Lead Free + BGA SnPb SnPb LF using SnPb Polyimide HASL Lead Free SnPb Rework and SAC BGA Assemblies using Tin- Lead solder with higher reflow profile Polyimide HASL Lead free +BGA SAC SnPb Total 96 Total number of boards

30 Reliability Test Validation Test Vibration Thermal Cycling Combined Environments Test Reference MIL-STD-810F, Method 514.5, Procedure I IPC-SM-785 MIL-STD-810F Method Procedure I Electrical Test Electrical continuity failure Electrical continuity failure Electrical continuity failure Acceptance Criteria Better than or equal to tin/lead controls at 10% Weibull cumulative failures Better than or equal to tin/lead controls at 10% Weibull cumulative failures Better than or equal to tin/lead controls at 10% Weibull cumulative Failures Five test vehicles will be used for each test, the sample size for each component type would be 25. This sample size provide a statistically meaningful results. 30

31 Thank you 31