ProSurf EIPC dissemination and contribution Keynote. Loughborough University (

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1 M.W.04/08 Keynote Jisso European Council Future Trends of PCBs in Europe How does the Printed Circuit Board industry need to adapt? Presentation at the 3rd Annual Conference Friday, July 4th 2008 At Henry Ford College, Michael Weinhold EIPC Technical Director European Institute of Printed Circuits EIPC Technology update 1 Keynote Presenter support for the ProSurf Project 2 1

2 Presentation overview Welcome and Introduction Background on EIPC and the Roadmap Process Program review to focus on key items How will Europe fit in the global market The rigid PCB roadmap and its support by the EU Technology drivers How will flexible PCBs develop Will printed electronics impacting the OEM developments Summary 3 ProSurf: The EU support for the PCB industry Focus on Small and Medium Enterprises (SME) in the field of Electronics Guide manufacturing, process, material, equipment, and product research and development in order to establish and maintain leadership in electronic interconnection technology; integrate the development of new and innovative solutions with partners in the electronics industry, academia, and government; and excel in the global market by implementing these developments and continuously improving customer satisfaction. 4 2

3 Under the EU regulation in Million habitants 5 The PCB fabricators market in Europe 6 3

4 The importance of the PCB industry in the SME field in Europe Data source: M.Gasch / VdL About 400 companies producing PCBs people employed Most companies classify for SME 7 The PCB Market in Europe The PCB market in the EU in not regarded as a fast growing market The fabrication cost for large series are very high in Europe compared to Asia (China) Design and developments are conducted in the EU Sample jobs and pre-production orders are manufactured in Europe For how long? At what cost? New technologies have to be introduced in Europe to gain or maintain technology leadership A large number of technologies and equipment is still developed in Europe Get into a leading position when writing new standards 8 4

5 WECC and IEC Standards meeting in Tokyo June, Activities in gaining knowledge CPCA show and Electronic Circuit World Convention in Shanghai March 2008 New PCB fabrication technology MUST have (get) global acceptance 10 5

6 JISSO International Council Affiliations ProSurf / EIPC Tutorial SMT, / JISSO to harmonize Electronics Road Maps JISSO Level Structure 12 6

7 The EIPC Web Site dedicated to the PCB technology in Europe Provide easy access Allow for fast market update and follow up layer ML layer ML layer ML layer ML layer ML layer ML 2.25 Single Sided 0.67 Double sided

8 Benchmark Manufacturing Equipment Traditional Little significant change EP manufacturing Testing, Cure ovens, Trim Laser technology across processes Operating environment is a factor Manufacturing Processes Traditional through hole HDI with a focus on parallel technology Surface finishes still a problem Flatness (Bow & Twist)?? W/ LF temp EP processes (Developing) Photonic processes (Conceptual) Standards PWB Continuous review and update PWB Embedded passive and active components Opto Emerging (IPC/JPCA) 15 Current state of Substrate Technology Product Boards 16 8

9 New state of Substrate Technology Embedding technology to improve reliability and to reduce cost 17 Imaging capabilities for miniaturization LDI Resist used at 405 nm wave length 18 9

10 New Packages and Printed Circuits Component package miniaturization is driving the PWB industry CTE of Silicon 3 ppm/ C Large CTE to Silicon large risk CTE of Silicon 3 ppm/ C CTE of FR4 PWB 17 ppm/ C CTE of RCF > 60 ppm/ C CTE of new RCF ppm/ C CTE of Aramid 9-12 ppm/ C 19 Opportunity for different surface finishes Ag 6% Sn 5% HASL 26% OSP 63% Focusing on surfaces that are lead free soldering compatible using Nano technologies based on organic metals 20 10

11 IONMET Silver CoatingProject Silver as a surface finish for PCB is used in niche application in Europe Existing technology does not provide a cost or environmental challenge New immersion Silver coatings are based on Nano-Technology offer advantages (Avoid Ag migration and visibility in the intermetallic layer) The EIPC sees the Ionic liquid technology as an innovative way of manufacturing PCBs more cost-effective and with less impact on the environment. Ionic liquid Ag coating of PCBs would only result in a Me too product 21 Desirable Finish Characteristics Solder-Finishes Advantages Disadvantages OSP Good planar surface Most inexpensive finish No intermetallics formed before use Strongest solder joints Does not stain gold tabs 30 years history of usage Very narrow process window for multi-pass assembly Difficult getting adequate hole fill Probing and grounding issues through Copper oxides Handling concerns etch finger prints in Copper Shortest shelf life Can t detect soldermask residue on Cu Incomplete pad wetting Thick OSP Imm Silver Nano Finish Based on Organic Metal Good planar surface Inexpensive finish No intermetallics formed before assembly Strongest solder joints Withstand multiple reflow step Excellent Solderability Wets faster than OSP Consistent flat surface for SMT Good initial electrical probe surface Withstands multiple process steps No holes plugged Visual inspect if silver has deposited on pads Visually see tarnish Compatible with Lead-free processes Excellent Solderability Allow for multiple soldering processes comparable or better than metallic finishes Wets faster than OSP Lighter color than Cu, no discoloration during reflow (automated visual control possible) Consistent flat surface for SMT Good initial electrical probe surface Withstands multiple process steps e.g. cleaning No holes plugged Visually see tarnish Compatible with Lead-free processes Narrow process window for multiple passes Some thick coatings deposit film on gold Some thick coatings stain gold Difficult getting adequate hole fill Probing and grounding issues through hard OSP after assembly Handling concerns Can t detect soldermask residue on Cu Incomplete pad wetting Not available from all suppliers Multiple board finishes difficult Long term use as electrical contact unknown Long term storage issues unknown 2 years production use - possible unknowns as a board finish Possible compatibility problem with via plug UL-796 Issue for some applications Not available from all suppliers Multiple board finishes difficult Long term use as electrical contact unknown Long term storage issues unknown One years production use - possible unknowns as a board finish 22 11

12 Future Surfaces finishes for PCBs Application Today Future Mobile Phones OSP/ENIG Nano Finish Automotive Sn/Ag/OSP/HASL Nano Finish Telecom Base Station Industrial Electronics Sn / Ag HASL/Sn/Ag Nano Finish Nano Finish Military HASL/ENIG Nano Finish Consumer Electronics OSP/Ag Nano Finish 23 1 cm 3 cm²/g 1 µm 3 m²/g 10 nm 300 m²/g Source: Ormecon Dr. Weßling 24 12

13 Surface ENIG versus Nano-Finish Reflow solder connection Separation crack in NiP layer in ENIG surface after reflow soldering Reliable intermetalic phase after reflow after soldering (modern Nano finish) 25 PCB made with in Additive technology PCB made in full additive technology using permanent additive resists (PAR) technology. Minimum inprocess waste and high yields even recycle of defect PCBs during plating was possible

14 Copper de-solution with Lead Free solder that contains Ag Plated copper at the center of the holes Plated copper = µm HAL-Sn about = 10 µm 27 Example: Automotive Airbag Control Unit (Chart 1) 28 14

15 Example: Automotive Airbag Control Unit (Chart 2) 29 Example: Automotive - Engine Control unit (Chart 1) 30 15

16 Example: Automotive - Engine Control unit (Chart 2) 31 Rigid PCB Roadmap for Minimum Line Width Technologie Single Sided PCBs Double Sided PCBs Multilayer PCBs Build-up PCB Core Layers Build-up PCB Build-up Layers Class Minimum Line width (µm) Current Medium Term Long Term IS LE IS LE IS LE IS LE IS LE

17 Rigid PCB Roadmap for Minimum Via Hole Diameter Technologie Single Sided PCBs Double Sided PCBs Multilayer PCBs Build-up PCB Core Layers Build-up PCB Build-up Layers Minimum Via Hole Diameter (µm) Class Current Medium Term Long Term IS LE IS LE IS LE IS LE IS LE Manufacturing Capability - Imaging - Phototool Requirements 34 17

18 The developments of flexible PCBs 35 HDI Semi-Flex Concept Drivers for Rigid-Flex technology Modularity Miniaturisaton One of the main drivers for Rigid Flex technology is the 3D assembly Clearly more than 60% used for flex to install applications 18

19 Freedom of the design HDI PCB build-ups HDI Semi-Flex Design Multiple flex areas can be designed Flex layers can be designed for both sides Flex areas can be designed fully free, to any direction Flexible Circuit Interconnect Laser Profiling by LPKF Cannon Digital Camera 38 19

20 Printed Electronics made in 1980 PCB for Automotive Radio application Single Sided PCB with Printed Circuit pattern (made with Ag paste) on second side. Printed Through Holes for electrical connection Single Sided PCB with drilled holes and Printed Through Holes for electrical connection Jisso Internation al Council 39 Printed Electronics made in 2006 Inkjet Printing technology are using Nano particle technology Line width of 50µm have been achieved by using Inkjet technology Jisso Internation al Council 40 20

21 What is needed to continue PCB Production in Europe Faster realization of new projects Time to market Environmental safe PCB fabrication processes Lead free REACh Lower cost fabrication technology To maintain competitive advantages versus non EU fabricators New PCB Fabrication Technology with the capabilities to drive this innovation and lower unit cost 41 Example: How will NEW Project help to meet innovation objective The chemistry developed under EU Project IONMET : Is environmental safe Works in a close to neutral ph Easy waste water and waste treatment Can be recycled Suitable for electroless metal deposition processes Provide an option to develop additive fabrication processes using Permanent Additive Resists (PAR) or no resist 42 21

22 Program items and future activities Provide a focused activity program to the PCB industry to meet the objectives of: Innovative and fast Cost-effective Environmental safe Suitable for the next generations of PCBs Get partners that will support and benefit from the the technologies that are developed with the support of the EU funding like IONMET to meet future needs 43 Free copy of the EU ProSurf sponsored PCB road map 44 22

23 Summary and outlook The European industry has a large opportunity to receive EU funds for R&D activities The Industry and the academia world should partner on meaningful programs that will help Europe to maintain or expand industrial leadership The EIPC and its member companies are in a position to help defining meaningful projects and finding partners for cooperation It is important that the projects are professionally managed by using the Cluster Management Technology Measurable results have to be achieved 45 23