R Z18 Series : SMB CARLOCK

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1 .. pn ao TECHNICAL DATA SHEET 1 / 7 EDGE CARD PIN IN PASTE VERSION All dimensions are in mm. COMPONENTS MATERIALS PLATING (µm) BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS ZINC ALLOY BRASS PTFE TIN FOR HI TEMPERATURE GOLD 0.5 OVER NICKEL 2 UL CLASSIFICATION COLOR HOUSING PA %GF UL 94 V2 Water Blue RAL 5021 * According to FAKRA specification

2 TECHNICAL DATA SHEET 2 / 7 EDGE CARD PIN IN PASTE VERSION PACKAGING SPECIFICATION Standard Unit Other QS W option Contact us SN ** ELECTRICAL CHARACTERISTICS ENVIRONMENTAL Impedance 50 Ω Operating temperature 40/+110 C Frequency 04 GHz Hermetic seal NA Atm.cm3/s VSWR 1.06* + 0,0130 x F(GHz) Maxi Panel leakage NA Insertion loss 0.03 F(GHz) db Maxi RF leakage ( F(GHz)) db Maxi Voltage rating 335 Veff Maxi Dielectric withstanding voltage 1000 Veff mini Insulation resistance 1000 MΩ mini OTHER CHARACTERISTICS Assembly instruction MECHANICAL CHARACTERISTICS Center contact retention Axial force Mating end 10 N mini Axial force Opposite end 10 N mini Torque NA N.cm mini Others : * COAX TRANSMISSION LINE ONLY **Complaint except that 2D label does not include the shipping note number. Recommended torque Mating Panel nut NA N.cm NA N.cm Mating life Weight 50 Cycles mini 2,2028 g

3 TECHNICAL DATA SHEET 3 / 7 EDGE CARD PIN IN PASTE VERSION MOUNTING ZONE FOR RECEPTACLE Thickness of PCB: 1,6 mm. Material of PCB: FR4 (εr = 4.6). Solder paste has to be printed onto the land of solder and into holes to permit Pin In Hole Reflow

4 TECHNICAL DATA SHEET 4 / 7 EDGE CARD PIN IN PASTE VERSION SOLDER PROCEDURE 1. Deposition of solder paste Sn Ag4 Cu0.5 on mounting zone by screen printing application. We recommend a low residue flux. We advise a thickness of 0.2 millimetres min. ( inch min. ). Verify that the edges of the zone are clean. 2. Placement of the receptacle on the mounting zone with an automatic machine of pick and place type. Video camera is recommended for the positioning of the component. Adhesive agents must not be used on the receptacle. 3. Soldering by infrared reflow. Below, please find the typical profile to use. 4. Cleaning of printed circuit boards. 5. Checking of solder joints and position of the component by visual inspection. TEMPERATURE PROFILE Parameter Value Unit Temperature rising Area 1 4 C/sec Max Peak Temperature 260 C Max dwell C 10 sec Min dwell C 20 sec Max dwell C 60 sec Temperature drop in cooling Area 1 to 4 C/sec

5 TECHNICAL DATA SHEET 5 / 7 EDGE CARD PIN IN PASTE VERSION REEL PACKAGING PER 350 Label for identification : CELL MATERIAL : Polycarbonate COVER TAPE MATERIAL : conductive polyester film tape

6 TECHNICAL DATA SHEET 6 / 7 EDGE CARD PIN IN PASTE VERSION To obtain other coding for the connector please change the letter by the needed coding letter into the Part Number

7 TECHNICAL DATA SHEET 7 / 7 EDGE CARD PIN IN PASTE VERSION 1,65 min. 3,455 ± 0,125 0,18 max. 0,18 max. 0,05 B 0,10 B 0,10 B 0,1 x 45 0,505 ± 0,025 2,08 min. 3,05 nom. 3,685 ± 0,025 6,3 + 0,1 0 7,5 0 0,05 0,10 A 0,10 A 1,7 min. 0 min. 2,97 max. 2,25 ± 0,2 B A

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