XC95108 In-System Programmable CPLD
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1 PODUCT OBSOLETE / UNDE OBSOLESCENCE 0 XC95108 In-System Programmable CPLD DS066 (v5.0) May 17, Features 7.5 ns pin-to-pin logic delays on all pins f CNT to 125 MHz 108 macrocells with 2,400 usable gates Up to 108 user pins 5V in-system programmable - Endurance of 10,000 program/erase cycles - Program/erase over full commercial voltage and temperature range Enhanced pin-locking architecture Flexible V Block - 90 product terms drive any or all of macrocells within Block - Global and product term clocks, output enables, set and reset signals Extensive IEEE Std boundary-scan (JTAG) support Programmable power reduction mode in each macrocell Slew rate control on individual outputs User programmable ground pin capability Extended pattern security features for design protection High-drive 24 ma outputs 3.3V or 5V capability Advanced CMOS 5V FastFLASH technology Supports parallel programming of more than one XC9500 concurrently Available in 84-pin PLCC, 100-pin PQFP, 100-pin TQFP, and 160-pin PQFP packages Description The XC95108 is a high-performance CPLD providing advanced in-system programming and test capabilities for general purpose logic integration. It is comprised of eight V Blocks, providing 2,400 usable gates with propagation delays of 7.5 ns. See Figure 2 for the architecture overview. Power Management Power dissipation can be reduced in the XC95108 by configuring macrocells to standard or low-power modes of operation. Unused macrocells are turned off to minimize power dissipation. Operating current for each design can be approximated for specific operating conditions using the following equation: I CC (ma) = MC HP (1.7) + MC LP (0.9) + MC (0.006 ma/mhz) f Where: MC HP = in high-performance mode MC LP = in low-power mode MC = Total number of macrocells used f = Clock frequency (MHz) Figure 1 shows a typical calculation for the XC95108 device. Typical I CC (ma) (0) 100 High Performance Low Power (250) (170) 0 50 Clock Frequency (MHz) 100 DS066_01_ Figure 1: Typical I CC vs. Frequency for XC , , 2013 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice. DS066 (v5.0) May 17,
2 PODUCT OBSOLETE / UNDE OBSOLESCENCE JTAG Port 1 3 JTAG Controller In-System Programming Controller Block 1 /GCK /GS /GTS Blocks Fast CONNECT II Switch Matrix Block 2 Block 3 Block 4 Block 5 Block 6 DS066_02_ Figure 2: XC95108 Architecture block outputs (indicated by the bold line) drive the blocks directly. 2 DS066 (v5.0) May 17, 2013
3 PODUCT OBSOLETE / UNDE OBSOLESCENCE Absolute Maximum atings Symbol Description Value Units V CC Supply voltage relative to GND 0.5 to 7.0 V V IN Input voltage relative to GND 0.5 to V CC V V TS Voltage applied to 3-state output 0.5 to V CC V T STG Storage temperature (ambient) 65 to +150 o C T J Junction temperature +150 o C Notes: 1. Stresses beyond those listed under Absolute Maximum atings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum atings conditions for extended periods of time may affect device reliability. ecommended Operation Conditions Symbol Parameter Min Max Units V CCINT Supply voltage for internal logic Commercial T A = 0 o C to 70 o C V and input buffers Industrial T A = 40 o C to +85 o C V CCIO Supply voltage for output drivers Commercial T A = 0 o C to 70 o C V for 5V operation Industrial T A = 40 o C to +85 o C Supply voltage for output drivers for 3.3V operation V IL Low-level input voltage V V IH High-level input voltage 2.0 V CCINT V V O Output voltage 0 V CCIO V Quality and eliability Characteristics Symbol Parameter Min Max Units T D Data etention 20 - Years N PE Program/Erase Cycles (Endurance) 10,000 - Cycles DC Characteristic Over ecommended Operating Conditions Symbol Parameter Test Conditions Min Max Units V OH Output high voltage for 5V outputs I OH = 4.0 ma, V CC = Min V Output high voltage for 3.3V outputs I OH = 3.2 ma, V CC = Min V V OL Output low voltage for 5V outputs I OL = 24 ma, V CC = Min V Output low voltage for 3.3V outputs I OL = 10 ma, V CC = Min V I IL Input leakage current V CC = Max - ±10 μa V IN = GND or V CC I IH high-z leakage current V CC = Max - ±10 μa V IN = GND or V CC C IN capacitance V IN = GND f = 1.0 MHz - 10 pf I CC Operating supply current (low power mode, active) V I = GND, No load f = 1.0 MHz 100 (Typical) ma DS066 (v5.0) May 17,
4 PODUCT OBSOLETE / UNDE OBSOLESCENCE AC Characteristics XC XC XC XC Symbol Parameter Min Max Min Max Min Max Min Max Units T PD to output valid ns T SU setup time before GCK ns T H hold time after GCK ns T CO GCK to output valid ns f (1) CNT 16-bit counter frequency MHz f (2) SYSTEM Multiple FB internal operating MHz frequency T PSU setup time before p-term clock ns input T PH hold time after p-term clock input ns T PCO P-term clock output valid ns T OE GTS to output valid ns T OD GTS to output disable ns T POE Product term OE to output enabled ns T POD Product term OE to output disabled ns T WLH GCK pulse width (High or Low) ns T APPW Asynchronous preset/reset pulse width (High or Low) ns Notes: 1. f CNT is the fastest 16-bit counter frequency available, using the local feedback when applicable. f CNT is also the Export Control Maximum flip-flop toggle rate, f TOG. 2. f SYSTEM is the internal operating frequency for general purpose system designs spanning multiple FBs. V TEST Device Output 1 2 C L Output Type V CCIO 5.0V 3.3V V TEST 5.0V 3.3V 1 160Ω 260Ω 2 120Ω 0Ω C L 35 pf 35 pf DS067_03_ Figure 3: AC Load Circuit 4 DS066 (v5.0) May 17, 2013
5 PODUCT OBSOLETE / UNDE OBSOLESCENCE Internal Timing Parameters XC XC XC XC Symbol Parameter Min Max Min Max Min Max Min Max Units Buffer Delays T IN Input buffer delay ns T GCK GCK buffer delay ns T GS GS buffer delay ns T GTS GTS buffer delay ns T OUT Output buffer delay ns T EN Output buffer enable/disable delay ns Product Term Control Delays T PTCK Product term clock delay ns T PTS Product term set/reset delay ns T PTTS Product term 3-state delay ns Internal egister and Combinatorial Delays T PDI Combinatorial logic propagation delay ns T SUI egister setup time ns T HI egister hold time ns T COI egister clock to output valid time ns T AOI egister async. S/ to output delay ns T AI egister async. S/ recover before clock ns T LOGI Internal logic delay ns T LOGILP Internal low power logic delay ns Feedback Delays T F FastCONNECT feedback delay ns T LF block local feedback delay ns Time Adders T (1) PTA Incremental product term allocator delay ns T SLEW Slew-rate limited delay ns Notes: 1. T PTA is multiplied by the span of the function as defined in the XC9500 family data sheet. DS066 (v5.0) May 17,
6 PODUCT OBSOLETE / UNDE OBSOLESCENCE XC95108 Pins Block Macrocell PC84 PQ100 TQ100 PQ160 BScan Order Block Macrocell PC84 PQ100 TQ100 PQ [1] 24 [1] 22 [1] 33 [1] 288 [1] [1] 25 [1] 23 [1] 35 [1] 282 [1] [1] 29 [1] 27 [1] 42 [1] 276 [1] [1] 1 [1] 99 [1] 159 [1] 255 [1] [1] 5 [1] 3 [1] 6 [1] 246 [1] [1] 6 [1] 4 [1] 8 [1] 243 [1] Notes: 1. Global control pin. BScan Order 6 DS066 (v5.0) May 17, 2013
7 PODUCT OBSOLETE / UNDE OBSOLESCENCE XC95108 Pins (Continued) Block Macrocell PC84 PQ100 TQ100 PQ160 BScan Order XC95108 Global, JTAG, and Power Pins Block Macrocell PC84 PQ100 TQ100 PQ160 BScan Order Pin Type PC84 PQ100 TQ100 PQ160 /GCK /GCK /GCK /GTS /GTS /GS TCK TDI TDO TMS V CCINT 5V 38,73,78 7,59,100 5,57,98 10,46,94,157 V CCIO 3.3V/5V 22,64 28,40,53,90 26,38,51,88 1,41,61,81,121,141 GND 8,16,27,42,49,60 2,23,33,46,64,71,77,86 100,21,31,44,62,69,75,84 20,31,40,51,70,80,99 GND 100,110,120,127,137 GND 160 No connects 3,5,7,32,38,39,48,53,55,6 5,66,67,83,85,93,109, 1,119,125,130,131, 132,149,150,151 DS066 (v5.0) May 17,
8 PODUCT OBSOLETE / UNDE OBSOLESCENCE Device Part Marking and Ordering Combination Information Device Type Package Speed Operating ange XC95xxx TQ144 7C This line not related to device part number Device Ordering and Part Marking Number Speed (pin-to-pin delay) Pkg. Symbol 1 Sample package with part marking. No. of Pins Package Type Operating ange (1) XC PC84C 7.5 ns PC84 84-pin Plastic Lead Chip Carrier (PLCC) C XC PCG84C 7.5 ns PGC84 84-pin Plastic Lead Chip Carrier (PLCC); Pb-Free C XC PQ100C 7.5 ns PQ pin Plastic Quad Flat Pack (PQFP) C XC PQG100C 7.5 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free C XC TQ100C 7.5 ns TQ pin Thin Quad Flat Pack (TQFP) C XC TQG100C 7.5 ns TQG pin Thin Quad Flat Pack (TQFP); Pb-Free C XC PQ160C 7.5 ns PQ pin Plastic Quad Flat Pack (PQFP) C XC PQG160C 7.5 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free C XC PC84I 7.5 ns PC84 84-pin Plastic Lead Chip Carrier (PLCC) I XC PCG84I 7.5 ns PCG84 84-pin Plastic Lead Chip Carrier (PLCC); Pb-Free I XC PQ100I 7.5 ns PQ pin Plastic Quad Flat Pack (PQFP) I XC PQG100I 7.5 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free I XC TQ100I 7.5 ns TQ pin Thin Quad Flat Pack (TQFP) I XC TQG100I 7.5 ns TQG pin Thin Quad Flat Pack (TQFP); Pb-Free I XC PQ160I 7.5 ns PQ pin Plastic Quad Flat Pack (PQFP) I XC PQG160I 7.5 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free I XC PC84C 10 ns PC84 84-pin Plastic Lead Chip Carrier (PLCC) C XC PCG84C 10 ns PCG84 84-pin Plastic Lead Chip Carrier (PLCC); Pb-Free C XC PQ100C 10 ns PQ pin Plastic Quad Flat Pack (PQFP) C XC PQG100C 10 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free C XC TQ100C 10 ns TQ pin Thin Quad Flat Pack (TQFP) C XC TQG100C 10 ns TQG pin Thin Quad Flat Pack (TQFP); Pb-Free C XC PQ160C 10 ns PQ pin Plastic Quad Flat Pack (PQFP) C XC PQG160C 10 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free C XC PC84I 10 ns PC84 84-pin Plastic Lead Chip Carrier (PLCC) I XC PCG84I 10 ns PCG84 84-pin Plastic Lead Chip Carrier (PLCC); Pb-Free I XC PQ100I 10 ns PQ pin Plastic Quad Flat Pack (PQFP) I XC PQG100I 10 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free I XC TQ100I 10 ns TQ pin Thin Quad Flat Pack (TQFP) I XC TQG100I 10 ns TQG pin Thin Quad Flat Pack (TQFP); Pb-Free I XC PQ160I 10 ns PQ pin Plastic Quad Flat Pack (PQFP) I XC PQG160I 10 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free I XC PC84C 15 ns PC84 84-pin Plastic Lead Chip Carrier (PLCC) C 8 DS066 (v5.0) May 17, 2013
9 PODUCT OBSOLETE / UNDE OBSOLESCENCE Device Ordering and Part Marking Number Speed (pin-to-pin delay) Pkg. Symbol No. of Pins Package Type Operating ange (1) XC PCG84C 15 ns PCG84 84-pin Plastic Lead Chip Carrier (PLCC); Pb-Free C XC PQ100C 15 ns PQ pin Plastic Quad Flat Pack (PQFP) C XC PQG100C 15 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free C XC TQ100C 15 ns TQ pin Thin Quad Flat Pack (TQFP) C XC TQG100C 15 ns TQG pin Thin Quad Flat Pack (TQFP); Pb-Free C XC PQ160C 15 ns PQ pin Plastic Quad Flat Pack (PQFP) C XC PQG160C 15 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free C XC PC84I 15 ns PC84 84-pin Plastic Lead Chip Carrier (PLCC) I XC PCG84I 15 ns PCG84 84-pin Plastic Lead Chip Carrier (PLCC); Pb-Free I XC PQ100I 15 ns PQ pin Plastic Quad Flat Pack (PQFP) I XC PQG100I 15 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free I XC TQ100I 15 ns TQ pin Thin Quad Flat Pack (TQFP) I XC TQG100I 15 ns TQG pin Thin Quad Flat Pack (TQFP); Pb-Free I XC PQ160I 15 ns PQ pin Plastic Quad Flat Pack (PQFP) I XC PQG160I 15 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free I XC PC84C 20 ns PC84 84-pin Plastic Lead Chip Carrier (PLCC) C XC PCG84C 20 ns PCG84 84-pin Plastic Lead Chip Carrier (PLCC); Pb-Free C XC PQ100C 20 ns PQ pin Plastic Quad Flat Pack (PQFP) C XC PQG100C 20 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free C XC TQ100C 20 ns TQ pin Thin Quad Flat Pack (TQFP) C XC TQG100C 20 ns TQG pin Thin Quad Flat Pack (TQFP); Pb-Free C XC PQ160C 20 ns PQ pin Plastic Quad Flat Pack (PQFP) C XC PQG160C 20 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free C XC PC84I 20 ns PC84 84-pin Plastic Lead Chip Carrier (PLCC) I XC PCG84I 20 ns PCG84 84-pin Plastic Lead Chip Carrier (PLCC); Pb-Free I XC PQ100I 20 ns PQ pin Plastic Quad Flat Pack (PQFP) I XC PQG100I 20 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free I XC TQ100I 20 ns TQ pin Thin Quad Flat Pack (TQFP) I XC TQG100I 20 ns TQG pin Thin Quad Flat Pack (TQFP); Pb-Free I XC PQ160I 20 ns PQ pin Plastic Quad Flat Pack (PQFP) I XC PQG160I 20 ns PQG pin Plastic Quad Flat Pack (PQFP); Pb-Free I Notes: 1. C = Commercial: T A = 0 to +70 C; I = Industrial: T A = 40 to +85 C DS066 (v5.0) May 17,
10 PODUCT OBSOLETE / UNDE OBSOLESCENCE Warranty Disclaimer THESE PODUCTS AE SUBJECT TO THE TEMS OF THE XILINX LIMITED WAANTY WHICH CAN BE VIEWED AT THIS LIMITED WAANTY DOES NOT EXTEND TO ANY USE OF THE PODUCTS IN AN APPLICATION O ENVIONMENT THAT IS NOT WITHIN THE SPECIFICATIONS STATED ON THE THEN-CUENT XILINX DATA SHEET FO THE PODUCTS. PODUCTS AE NOT DESIGNED TO BE FAIL-SAFE AND AE NOT WAANTED FO USE IN APPLICATIONS THAT POSE A ISK OF PHYSICAL HAM O LOSS OF LIFE. USE OF PODUCTS IN SUCH APPLICATIONS IS FULLY AT THE ISK OF CUSTOME SUBJECT TO APPLICABLE LAWS AND EGULATIONS. evision History The following table shows the revision history for this document. Date Version evision 12/04/ Update AC characteristics and internal parameters. 06// Updated format. 08/21/ Updated Package Device Marking Pin 1 orientation. 03/01/ Updated table on page 8 for PQ160 pins. 04/15/ Added asynchronous preset/reset pulse width specification (T APPW ). 04/03/ Added Warranty Disclaimer. Added Pb-Free package ordering information. 05/17/ The products listed in this data sheet are obsolete. See XCN11010 for further information DS066 (v5.0) May 17, 2013
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