UTBB FD-SOI: The Technology for Extreme Power Efficient SOCs
|
|
- Gertrude Fletcher
- 6 years ago
- Views:
Transcription
1 UTBB FD-SOI: The Technology for Extreme Power Efficient SOCs Philippe Flatresse Technology R&D
2 Bulk transistor is reaching its limits FD-SOI = 2D Limited body bias capability Gate gate Gate oxide stack Source Drain Complex channel architecture Heavily Doped Wells drain height source gate Fully Depleted devices are mandatory to continue the technology roadmap FinFET = 3D
3 28nm Planar UTBB FD-SOI Transistor 3 36 Masks: 7ML Dual Vt - Dual Oxide Thin Body (7nm) Substrate Ultra Thin Body & BOX Fully Depleted SOI transistor
4 28nm Planar UTBB FD-SOI Advantages 4 24nm Body-Bias Hybrid zone Shorter channel length 24nm technology! Better electrostatics Faster operation Low voltage Reduced variability Total dielectric isolation Latch up immunity Lower leakage current Less sensitive to temperature
5 28nm FD-SOI is same cost as 28LP, same performances as G technologies Cost/Performances Ratios The FD-SOI Advantage 5 2,5 1,4 20nm 14FD Relative Wafer Cost (1=28LP) 2,0 1,5 1,0 0,5 1,2 1,0 28LP 28G 40LP 28FD 40LP 40G 0,8 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 28LP 40G 28G 28FD 20nm 16/14FF 14FD Bulk planar FinFet FD-SOI FD-SOI, the only technology allowing the continuation of the Moore s law 0,0 0,0 0,5 1,0 1,5 2,0 Relative Technology Performances (1=28LP) Source: ST/Marketing 2013, IBS 2013
6 FD-SOI: the best solution to 10nm nm FD-SOI 14nm FD-SOI 10nm FD-SOI AVAILABLE TODAY! TODAY IN DEVELOPMENT TODAY IN R&D RP MP RP MP 28nm FD-SOI RP Risk Production MP General availability for Mass Production Advantages of FD-SOI 0.9V 113CPP 90Mx CPP: Contact to Poly Pitch Mx: Pitch at Metal layer 14nm FD-SOI 0.8V 90CPP 64Mx 10nm FD-SOI 0.7V 64CPP 48Mx
7 FD-SOI Benefits vs. Other Technologies 7 Good Fair Limited Poor Power Efficiency in high performance mode Power Efficiency in low power mode Extended DVFS Bulk FD-SOI FD-SOI FinFET 28 LP 28 G mobile 28FD 14FD 14FF ULV capability Cost Process Simplicity SER immunity Heat dissipation Analog Performance Conclusion: 28FD consistenly better than any 28nm alternative 20nm irrelevant for many segments: better use 28FD or go to 14FD 14FD consistently better than 14/FF
8 UTBB FD-SOI Design EcoSystem 8 FD-SOI uses a conventional bulk design flow Cadence, Mentor, Synopsys, Apache, Atrenta 4-terminals spice models available, from PSP Prototyping Floorplan Finalization Physical Implementation SignOff Low Power Digital Design Flow Major simulators supported UTBB FD-SOI uses same low power design techniques than for bulk. In addition : Optimized power switches Extended poly-bias Reverse & forward Dynamic body bias Adaptive Voltage Scaling Power / Clock Gating Power Switches Multi Vt Capabilities Dynamic Voltage & Frequency Scaling Process Monitoring & Compensation RTL Power Estimation Reverse & Forward Body Bias
9 Body Biasing (BB) 9 A very reasonable effort for extremely worthwhile benefits An extremely powerful and flexible concept in FD-SOI to : Boost performance Optimize passive and dynamic power consumption Cancel out process variations and extract optimal behavior from all parts 0 1.3V Comparatively easy to implement if you ve ever done DVFS you ll have no difficulty with Body Biasing No area penalty compared to Bulk Reuse of Bulk design techniques Speed/Power control
10 Extended Body Bias Range in UTBB FD-SOI 10 NMOS PMOS I PN (FBB) I GIDL (RBB) BULK UTBB FD-SOI -300mV +300mV -3V +3V RBB FBB nobb RBB nobb FBB Efficient knob for speed/leakage optimization S3S 2013, Monterey - California Sept 13
11 Body Bias Efficiency - Silicon Benchmark 11 FBB RBB
12 FBB usage per market segment 12 Infrastructure - Networking Servers and Storage Consumer Internet of Things µap Ultra-Low-Energy Configuration Supply: V high number multicore DVFS & FBB tuning for best MIPS/W ratio. Adapt perf&power to workload Supply: V Wide DVFS FBB linked to CPU workload & thermal conditions Supply: 0.6V-0.9V FBB: 0-1.5V FBB to solve the power/performance paradigm Ultra Low Voltage 0.3V- 0.4V Reverse Body Biasing Power efficiency Flexibility Perf/Power Ultra power efficiency 28 FD-SOI: Up to -50% total power reduction versus 0.6V FBB for ultimate power efficiency tuning 28 FD-SOI: Up to -50% power reduction FBB provides +18% max. performance boost versus 28G(mobile) 28 FD-SOI: Up to x 4 perf/power ratio versus 28G(mobile) at low voltage Low voltage power efficient performance. Reduce idle current
13 FD-SOI enabling Ultra-Wide DVFS 13 CPU freq. (GHz) GHz at 1.34V 2.3 GHz at 1.0V FD-SOI allows the widest Vdd range for voltage scaling Still guaranteeing top notch speeds at very low operating voltage >5x when compared to 28LP technology >35% when compared to 28G technologies GHz at 0.61V 300 MHz at 0.5V CPU supply (V) Real measurements of continuous DVFS in the range 0.5V 1.4V Performed on a very large number of ICs, showing extremely good reliability of the DVFS in this range
14 28nm FD-SOI Best in class efficiency % 120% +43% vs low Vdd +83% vs 28G 100% Energy efficiency (relative DMIPS/mW) 80% 60% +50% vs high Vdd +25% vs 28G 40% 20% 0% 20% 40% 60% 80% 100% 120% low Vdd Speed (relative highvdd (overdrive)
15 FD-SOI: Efficiency at all levels 15 CPU, GPU and logic FBB dynamic modulation to get the best total power Best dynamic power /leakage tradeoff Memories Memory bit cells in FD-SOI have much less leakage compared to Bulk Analog & High-speed FD-SOI analog performance far beyond Bulk one Better figure of merit than FinFET for high-speed IPs Extended body bias range Lower gate leakage Fully depleted channel Lower channel leakage Better transistor electrostatics
16 FD-SOI The best technology choice 16 Superior and flexible technology FD-SOI transistors are faster, cooler, simpler Outstanding power efficiency across all use cases Efficiency at all levels: CPU, logic, Memories, Analog Manufacturing infrastructure and process reuse Improved reliability Enhanced design options Very large operating range for the same design Back-biasing as a flexible and powerful optimization Ultra-wide range DVFS Enhanced efficiency of multi-core processing Easier design than FinFET Gives your SOC competitive advantages Costs: chip-level and/or system-level (e.g. cost of cooling) Thermal power dissipation (TDP) Extended battery life Computing Power / Speed / Reactivity Reliability Time-to-Market
Material Engineering for 7nm FinFETs
Material Engineering for 7nm FinFETs Victor Moroz 2014 Synopsys. All rights reserved. 1 July 10, JTG Semicon West 2014, San Francisco Outline 2014 Synopsys. All rights reserved. 2 Outline 2014 Synopsys.
More informationEnergy Efficient Content-Addressable Memory
Energy Efficient Content-Addressable Memory Advanced Seminar Computer Engineering Institute of Computer Engineering Heidelberg University Fabian Finkeldey 26.01.2016 Fabian Finkeldey, Energy Efficient
More informationDesign-Technology Co-Optimization for 5nm Node and Beyond
Design-Technology Co-Optimization for 5 Node and Beyond Semicon West 26 Victor Moroz July 2, 26 Why Scaling? When What scales? When does it end? 965 999 2 Moore s Law (Fairchild): Double transistor density
More informationComposite Layout CS/ECE 5710/6710. N-type from the top. N-type Transistor. Polysilicon Mask. Diffusion Mask
Composite Layout CS/ECE 5710/6710 Introduction to Layout Inverter Layout Example Layout Design Rules Drawing the mask layers that will be used by the fabrication folks to make the devices Very different
More informationPresent Status and Prospects for Fuji Electric s IC Products and Technologies Yoshio Tsuruta Eiji Kuroda
Present Status and Prospects for Fuji Electric s IC Products and Technologies Yoshio Tsuruta Eiji Kuroda 1. Introduction Utilizing core technologies of high voltage technology (power IC technology), high
More informationDual-Rail Domino Logic Circuits with PVT Variations in VDSM Technology
Dual-Rail Domino Logic Circuits with PVT Variations in VDSM Technology C. H. Balaji 1, E. V. Kishore 2, A. Ramakrishna 3 1 Student, Electronics and Communication Engineering, K L University, Vijayawada,
More informationMaximizing the Power Efficiency of Integrated High-Voltage Generators
Maximizing the Power Efficiency of Integrated High-Voltage Generators Jan Doutreloigne Abstract This paper describes how the power efficiency of fully integrated Dickson charge pumps in high- IC technologies
More informationHelping Moore s Law: Architectural Techniques to Address Parameter Variation
Helping Moore s Law: Architectural Techniques to Address Parameter Variation Computer Science Department University of Illinois at Urbana-Champaign http://iacoma.cs.uiuc.edu/~teodores Technology scaling
More informationChallenges of integration of power supplies on chip. Indumini Ranmuthu Ph.D October 2016
Challenges of integration of power supplies on chip Indumini Ranmuthu Ph.D October 2016 Why this is important: There is significant trend in the industry towards power density and integration in power
More informationABB June 19, Slide 1
Dr Simon Round, Head of Technology Management, MATLAB Conference 2015, Bern Switzerland, 9 June 2015 A Decade of Efficiency Gains Leveraging modern development methods and the rising computational performance-price
More informationGC03 Logic gates and Transistors
GC3 Logic gates and Peter Rounce p.rounce@cs.ucl.ac.uk Electronic switch A B Switch Control Switch Control active - switch closed Resistance between A and B is very small Resistance ~ Voltage at V = Voltage
More informationHybrid Metrology 2.0: From Metrology to Information Technology Avron Ger - Nova Measuring Instruments. VP - Strategic Partnership Programs
Hybrid Metrology 2.0: From Metrology to Information Technology Avron Ger - Nova Measuring Instruments VP - Strategic Partnership Programs Outline Hybrid Metrology Introduction Hybrid Metrology Use Cases
More informationSi trim applications: benefits and challenges
Si trim applications: benefits and challenges SPCC, April 2, 2019 S. Kal 1, Y. Oniki 2, C. Alix 1, E. Liu 1, K. Pillai 1, D. Chanemougame 1, F. Holsteyns 2, A. Mosden 1, K. Kumar 1, P. Biolsi 1, T Hurd
More informationCore Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package
Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package Ozgur Misman, Mike DeVita, Nozad Karim, Amkor Technology, AZ, USA 1900 S. Price Rd, Chandler,
More informationLeakage Aware Design for Next Generation's SOCs
Roberto Zafalon Director, EU R&D Projects Leakage Aware Design for Next Generation's SOCs Roberto Zafalon European R&D Projects Date 09 workshop, April 24 th 2009 Designing for Embedded Parallel Computing
More informationHADES Workshop. May 24-26, 2011 Perma Works LLC. My thanks to the GNS and Tiger Energy Services. Randy Normann, CTO
HADES Workshop May 24-26, 2011 Perma Works LLC My thanks to the GNS and Tiger Energy Services Randy Normann, CTO randy@permaworks.com Perma Works LLC Albuquerque, New Mexico, USA Perma Works Acquiring
More informationCoreless Packaging Technology for High-performance Application
62 nd ECTC San Diego, CA: May 29 June 1, 2012 Coreless Packaging Technology for High-performance Application Corp Advanced LSI Assembly Product Department Analog LSI Bussiness Division Semiconductor Business
More informationASIC Design (7v81) Spring 2000
ASIC Design (7v81) Spring 2000 Lecture 1 (1/21/2000) General information General description We study the hardware structure, synthesis method, de methodology, and design flow from the application to ASIC
More informationWhite Paper: Pervasive Power: Integrated Energy Storage for POL Delivery
Pervasive Power: Integrated Energy Storage for POL Delivery Pervasive Power Overview This paper introduces several new concepts for micro-power electronic system design. These concepts are based on the
More informationFinite Element Based, FPGA-Implemented Electric Machine Model for Hardware-in-the-Loop (HIL) Simulation
Finite Element Based, FPGA-Implemented Electric Machine Model for Hardware-in-the-Loop (HIL) Simulation Leveraging Simulation for Hybrid and Electric Powertrain Design in the Automotive, Presentation Agenda
More informationSeoul, Korea. 6 June 2018
Seoul, Korea 6 June 2018 Innovation roadmap in clean mobility materials SPEAKER Denis Goffaux Chief Technology Officer Executive Vice-President Energy & Surface Technologies 2 Agenda Well to wheel efficiency
More informationIGBT Modules for Electric Hybrid Vehicles
IGBT Modules for Electric Hybrid Vehicles Akira Nishiura Shin Soyano Akira Morozumi 1. Introduction Due to society s increasing requests for measures to curb global warming, and benefiting from the skyrocketing
More informationAdvanced Technique for Si 1-x Ge x Characterization: Infrared Spectroscopic Ellipsometry
Advanced Technique for Si 1-x Ge x Characterization: Infrared Spectroscopic Ellipsometry Richard Sun Angstrom Sun Technologies Inc., Acton, MA Joint work with Darwin Enicks, I-Lih Teng, Janice Rubino ATMEL,
More informationCMPEN 411 VLSI Digital Circuits Spring Lecture 06: Static CMOS Logic
MPEN 411 VLSI Digital ircuits Spring 2012 Lecture 06: Static MOS Logic [dapted from Rabaey s Digital Integrated ircuits, Second Edition, 2003 J. Rabaey,. handrakasan,. Nikolic] Sp12 MPEN 411 L06 S.1 Review:
More informationOverview of SOI development (from the HEP perspective)
Overview of SOI development (from the HEP perspective) International workshop on CEPC, 6-8 Nov. 2017, Beijing Yunpeng Lu on behalf of SOIPIX collaboration Outline Concept of SOI pixel sensor Technology
More informationAccurate and available today: a ready-made implementation of a battery management system for the new 48V automotive power bus
Accurate and available today: a ready-made implementation of a battery management system for the new 48V automotive power bus Gernot Hehn Today s personal vehicles have an electrical system operating from
More informationHIGH TEMPERATURE ULTRA HIGH VOLTAGE SIC THYRISTORS
HIGH TEMPERATURE ULTRA HIGH VOLTAGE SIC THYRISTORS R. Singh, S. Creamer, E. Lieser, S. Jeliazkov, S. Sundaresan GeneSiC Semiconductor Inc. 43670 Trade Center Place, Suite 155, Dulles, VA 20166, USA. Email:
More informationTHINERGY MEC220. Solid-State, Flexible, Rechargeable Thin-Film Micro-Energy Cell
THINERGY MEC220 Solid-State, Flexible, Rechargeable Thin-Film Micro-Energy Cell DS1013 v1.1 Preliminary Product Data Sheet Features Thin Form Factor 170 µm Thick Capacity options up to 400 µah All Solid-State
More informationThe MathWorks Crossover to Model-Based Design
The MathWorks Crossover to Model-Based Design The Ohio State University Kerem Koprubasi, Ph.D. Candidate Mechanical Engineering The 2008 Challenge X Competition Benefits of MathWorks Tools Model-based
More informationThe LHCb experiment. The LHCb experiment. dedicated b-physics experiment at LHC to study CP-violating phenomena main challenges:
The LHCb experiment The LHCb experiment dedicated b-physics experiment at LHC to study CP-violating phenomena main challenges: highly selective trigger to collect large samples of B decays in specific
More informationRich, unique history of engineering, manufacturing and distributing
Rich, unique history of engineering, manufacturing and distributing United Silicon Carbide, inc. is a semiconductor company specializing in the development of high efficiency Silicon Carbide (SiC) devices
More informationUniversity Program Software Selection
Level One Conformal - GXL Conformal Constraint Design - L Conformal Constraint Design - XL CCD Multi-Constraint Check option Conformal Low Power - XL Conformal Low Power GXL Conformal ECO Designer Virtuoso
More informationCMPEN 411 VLSI Digital Circuits Spring Lecture 24: Peripheral Memory Circuits
CMPEN 411 VLSI Digital Circuits Spring 2012 Lecture 24: Peripheral Memory Circuits [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] Sp12
More informationRealization of a New Concept for Power Chip Embedding
As originally published in the SMTA Proceedings Realization of a New Concept for Power Chip Embedding H. Stahr 1, M. Morianz 1, I. Salkovic 1 1: AT&S AG, Leoben, Austria Abstract: Embedded components technology
More informationGreen Server Design: Beyond Operational Energy to Sustainability
Green Server Design: Beyond Operational Energy to Sustainability Justin Meza Carnegie Mellon University Jichuan Chang, Partha Ranganathan, Cullen Bash, Amip Shah Hewlett-Packard Laboratories 1 Overview
More informationLayout Design and Implementation of Adiabatic based Low Power CPAL Ripple Carry Adder
Layout Design and Implementation of Adiabatic based Low Power CPAL Ripple Carry Adder Ms. Bhumika Narang TCE Department CMR Institute of Technology, Bangalore er.bhumika23@gmail.com Abstract this paper
More informationThe Chances and Potentials for Low-Voltage Hybrid Solutions in Ultra-Light Vehicles
Switzerland, Schlatt, 9 th -10 th October 2014 The Chances and Potentials for Low-Voltage Hybrid Solutions in Ultra-Light Vehicles Dipl.-Ing. Robert Steffan Prof. Dr. Peter Hofmann Prof. Dr. Bernhard Geringer
More informationgan power Energy-efficient Power Electronics using Gallium Nitride Transistors Leti, technology research institute Contact:
gan power Energy-efficient Power Electronics using Gallium Nitride Transistors, technology research institute Contact: leti.contact@cea.fr A GROWTH MARKET GaN Devices for Next-Era Power Electronics $ 600.0M
More informationPower Electronics Roadmap. Updated by the Advanced Propulsion Centre in collaboration with and on behalf of the Automotive Council
Power Electronics Roadmap Updated by the Advanced Propulsion Centre in collaboration with and on behalf of the Automotive Council Executive summary: Power electronics The 2013 roadmap was developed alongside
More informationLearn to Design with Stratix III FPGAs Programmable Power Technology and Selectable Core Voltage
Learn to Design with Stratix III FPGAs Programmable Power Technology and Selectable Core Voltage Vaughn Betz and Sanjay Rajput Copyright 2007 Altera Corporation Agenda The power challenge Stratix III power
More informationHYBRID ELECTRIC VEHICLE SYSTEM MODELING AND CONTROL
HYBRID ELECTRIC VEHICLE SYSTEM MODELING AND CONTROL Second Edition Wei Liu General Motors, USA WlLEY Contents Preface List of Abbreviations Nomenclature xiv xviii xxii 1 Introduction 1 1.1 Classification
More informationSolar Power Energy Harvesting Electrical Integration
WHITEPAPER Solar Power Energy Harvesting Electrical Integration Contents Introduction... 1 Solar Cell Electrical Characteristics... 2 Energy Harvesting System Topologies... 4 Design Guide... 6 Indoor Single
More informationgan power Energy-efficient power electronics with Gallium Nitride transistors Leti, technology research institute Contact:
gan power Energy-efficient power electronics with Gallium Nitride transistors, technology research institute Contact: leti.contact@cea.fr A market in growth GaN devices for next-era power-electronics applications
More informationDynamic Control of Grid Assets
Dynamic Control of Grid Assets Panel on Power Electronics in the Smart Grid Prof Deepak Divan Associate Director, Strategic Energy Institute Director, Intelligent Power Infrastructure Consortium School
More informationEvolving Bump Chip Carrier
FUJITSU INTEGRATED MICROTECHNOLOGY LIMITED. The Bump Chip Carrier, which was developed as a small pin type, miniature, and lightweight CSP, is not only extremely small due to its characteristic structure,
More informationThyristors for >10 GW Power Transmission
Thyristors for >10 GW Power Transmission A new thyristor platform with voltage ratings 6.7 kv, 7.2 kv and 8.5 kv was developed to enable an optimal design of converter valves with DC link voltages above
More informationUPGRADE OF AN INDUSTRIAL Al-BSF SOLAR CELL LINE INTO PERC USING SPATIAL ALD Al 2 O 3
UPGRADE OF AN INDUSTRIAL SOLAR CELL LINE INTO USING SPATIAL ALD Al 2 O 3 Floor Souren, Xavier Gay, Bas Dielissen and Roger Görtzen SoLayTec, Dillenburgstraat 9G, 5652 AM, Eindhoven, The Netherlands e-mail
More informationDesign and evaluate vehicle architectures to reach the best trade-off between performance, range and comfort. Unrestricted.
Design and evaluate vehicle architectures to reach the best trade-off between performance, range and comfort. Unrestricted. Introduction Presenter Thomas Desbarats Business Development Simcenter System
More informationDriving Electromobility
Driving Electromobility Content The evolution of electromobility... 4 (H)EV Systems... 6 48 V System... 7 Focus products... 11 Breakthrough technologies... 14 Wide Band Gap (WBG) technologies revolutionize
More informationMEMS Sensors in Chassis and Active Safety Applications
MEMS Sensors in Chassis and Active Safety Applications Vehicle Dynamic Expo, Technology Forum, 18 June 2009 Matthieu Rezé, EMEA Automotive Sensors Marketing One Billion MEMS Milestone just passed... 1
More informationCMPEN 411 VLSI Digital Circuits Spring Lecture 15: Dynamic CMOS
CMPEN 411 VLSI Digital Circuits Spring 2012 Lecture 15: Dynamic CMOS [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] Sp12 CMPEN 411 L15
More informationDr. Chris Borroni-Bird, VP, Strategic Development, Qualcomm Technologies Incorporated. Enabling Connected and Electric Vehicles
Dr. Chris Borroni-Bird, VP, Strategic Development, Qualcomm Technologies Incorporated Enabling Connected and Electric Vehicles 1 2 3 4 Introduction DSRC WEVC Summary Agenda 2 Multiple technologies intersect
More informationWheels for a MEMS MicroVehicle
EE245 Fall 2001 1 Wheels for a MEMS MicroVehicle Isaac Sever and Lloyd Lim sever@eecs.berkeley.edu, limlloyd@yahoo.com ABSTRACT Inch-worm motors achieve high linear displacements with high forces while
More informationNEXT-GENERATION POWER SEMICONDUCTORS: MARKETS MATERIALS, TECHNOLOGIES
NEXT-GENERATION POWER SEMICONDUCTORS: MARKETS MATERIALS, TECHNOLOGIES The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is forecast to pass the $1 billion mark
More informationMaking Silicon Carbide Schottky Diodes and MOSFETs Mainstream Demands New Approaches to Wafer Fabrication and Converter Design
Making Silicon Carbide Schottky Diodes and MOSFETs Mainstream Demands New Approaches to Wafer Fabrication and Converter Design by Corey Deyalsingh, Littelfuse and Sujit Banerjee, Monolith Semiconductor
More informationDynamic Control of Grid Assets
Dynamic Control of Grid Assets ISGT Panel on Power Electronics in the Smart Grid Prof Deepak Divan Associate Director, Strategic Energy Institute Director, Intelligent Power Infrastructure Consortium School
More informationCMPEN 411 VLSI Digital Circuits Spring Lecture 22: Memery, ROM
CMPEN 411 VLSI Digital Circuits Spring 2012 Lecture 22: Memery, ROM [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] Sp12 CMPEN 411 L22 S.1
More informationDrowsy Caches Simple Techniques for Reducing Leakage Power Krisztián Flautner Nam Sung Kim Steve Martin David Blaauw Trevor Mudge
Drowsy Caches Simple Techniques for Reducing Leakage Power Krisztián Flautner Nam Sung Kim Steve Martin David Blaauw Trevor Mudge krisztian.flautner@arm.com kimns@eecs.umich.edu stevenmm@eecs.umich.edu
More informationLecture 2. Power semiconductor devices (Power switches)
Lecture 2. Power semiconductor devices (Power switches) Power semiconductor switches are the work-horses of power electronics (PE). There are several power semiconductors devices currently involved in
More informationHigh Efficiency SiC Power Semiconductor. May 20, 2014 Toyota Motor Corporation
1 High Efficiency SiC Power Semiconductor May 20, 2014 Toyota Motor Corporation Outline 2 1.Overview of power semiconductors 2.Aim of SiC power semiconductor development 3.Steps toward SiC power semiconductor
More informationDesign and Analysis of 32 Bit Regular and Improved Square Root Carry Select Adder
76 Design and Analysis of 32 Bit Regular and Improved Square Root Carry Select Adder Anju Bala 1, Sunita Rani 2 1 Department of Electronics and Communication Engineering, Punjabi University, Patiala, India
More informationNot for New Design 10 WATT WD DUAL LOW INPUT SERIES DC/DC CONVERTERS. Features
Features Universal 9 to 36 Volt Input Range Up to 10 Watts of PCB Mounted Power Efficiencies to > 80% Optional On/Off Control Pin Fully isolated, Filtered Design Low Noise Outputs Very Low I/O Capacitance,
More informationDevices and their Packaging Technology
4 th Workshop Future of Electronic Power Processing and Conversion Devices and their Packaging Technology May 2001 Werner Tursky SEMIKRON ELEKTRONIK GmbH Nuremberg, Germany 1 1. Devices 2. From Discrete
More informationEE 330 Integrated Circuit. Sequential Airbag Controller
EE 330 Integrated Circuit Sequential Airbag Controller Chongli Cai Ailing Mei 04/2012 Content...page Introduction...3 Design strategy...3 Input, Output and Registers in the System...4 Initialization Block...5
More informationHERZLICH WILLKOMMEN ZUM LIEFERANTEN-INNOVATIONSTAG 2015
HERZLICH WILLKOMMEN ZUM LIEFERANTEN-INNOVATIONSTAG 2015 18. November 2015 TOGETHER WE MOVE ff TECH-SESSION: VERNETZUNG & ASSISTENZ 14:30 16:00 Uhr TOGETHER WE MOVE ff New Solutions for High Frequency /
More informationHigh Speed V-Series of Fast Discrete IGBTs
High Speed V-Series of Fast Discrete IGBTs Taketo Watashima Ryu Araki ABSTRACT Fuji Electric has developed and commercialized the High Speed V-Series of discrete IGBTs (insulated gate bipolar transistors)
More informationGetting the Lead Out December, 2007
Getting the Lead Out December, 2007 Tom DeBonis Assembly & Test Technology Development Technology and Manufacturing Group Summary Intel has removed the lead (Pb) from its manufacturing process across its
More informationMMA Q5 Q / / / - /Chip Gain Flatness RL Current -1 d B T yp/m a x
New MMIC Products High Performance/Quality MMIC Based on InGaP HBT, phemt, and Linear MESFET Technologies High Linearity, Fully Matched WiMax Power Amplifiers High Power/Efficiency, Wide and Narrow Band
More informationPower Systems Overview. Summer Programs
Power Systems Overview Summer Programs Part I Early History Key Developers Early Inventions AC versus DC Modern Power Grid!2 Electricity in History Attractive Force was studied in ancient times! Revealed
More informationAdvanced Topics. Packaging Power Distribution I/O. ECE 261 James Morizio 1
Advanced Topics Packaging Power Distribution I/O ECE 261 James Morizio 1 Package functions Packages Electrical connection of signals and power from chip to board Little delay or distortion Mechanical connection
More informationHybrid VTOL: Increased Energy Density for Increased Payload and Endurance
Hybrid VTOL: Increased Energy Density for Increased Payload and Endurance Top Flight Airborg 10K H8 with Micro Hybrid Generator Engine Dr. Paul DeBitetto, VP/Software Engineering, paul.debitetto@topflighttech.com,
More informationUniversity Program Software Selection
Page 1 of 8 Level One Conformal - GXL CFM300 CONFRML172 Conformal Constraint Design L CFM401 CONFRML172 Conformal Constraint Designer - XL CFM421 CONFRML172 CCD Multi-Contraint Check Option CFM422 CONFRML172
More informationOverview. Battery Monitoring
Wireless Battery Management Systems Highlight Industry s Drive for Higher Reliability By Greg Zimmer Sr. Product Marketing Engineer, Signal Conditioning Products Linear Technology Corporation Overview
More informationMORSE: MOdel-based Real-time Systems Engineering. Reducing physical testing in the calibration of diagnostic and driveabilty features
MORSE: MOdel-based Real-time Systems Engineering Reducing physical testing in the calibration of diagnostic and driveabilty features Mike Dempsey Claytex Future Powertrain Conference 2017 MORSE project
More informationIME TSI Consortium Industry Forum
Institute of Microelectronics IME TSI Consortium Industry Forum 2.5D Heterogeneous Integration on Through Silicon Interposers 17 th August 2012 1 IME Industry Forum on 2.5D Through Si Interposer (TSI)
More informationIMEC 2010 RADIATION HARDENED MIXED- SIGNAL IP WITH DARE TECHNOLOGY
RADIATION HARDENED MIXED- SIGNAL IP WITH DARE TECHNOLOGY OUTLINE Introduction DARE+ activity DARE legacy Analog IP portfolio DARE technology porting SOC design Analog rad-hard design methodology 2 AMICSA
More informationE-DRIVE: HIGHLY INTEGRATED AND HIGH EFFICIENT
E-DRIVE: HIGHLY INTEGRATED AND HIGH EFFICIENT Korea EV Engineering & Testing Exhibition Roger Perthen AVL List GmbH (Headquarters) KEY ASPECTS FOR BATTERY ELECTRIC VEHICLES (BEVs) E-DRIVE: AFFORDABLE -
More informationChapter 1. Structure and Features
Chapter 1 Structure and Features CONTENTS Page 1 History of IGBT structure 1-2 2 Module structure 1-4 3 Circuit configuration of IGBT module 1-5 4 Overcurrent limiting feature 1-6 5 RoHS compliance 1-6
More informationDiscovery of Design Methodologies. Integration. Multi-disciplinary Design Problems
Discovery of Design Methodologies for the Integration of Multi-disciplinary Design Problems Cirrus Shakeri Worcester Polytechnic Institute November 4, 1998 Worcester Polytechnic Institute Contents The
More informationReRAM Technology, Versatility, and Readiness
ReRAM Technology, Versatility, and Readiness Hagop Nazarian VP of Engineering & Cofounder Santa Clara, CA 1 Introduction to ReRAM ReRAM Technology Attributes Scalability Ease of integration with CMOS Architectural
More informationOptimized IGBT technology for mild hybrid vehicles
EVS27 Barcelona, Spain, November 17-20, 2013 Optimized IGBT technology for mild hybrid vehicles Dr. Carlos Castro 1, Laurent Beaurenaut 1 1 Infineon Technologies AG, Am Campeon 1-12, D-85579, Neubiberg,
More informationTest Infrastructure Design for Core-Based System-on-Chip Under Cycle-Accurate Thermal Constraints
Test Infrastructure Design for Core-Based System-on-Chip Under Cycle-Accurate Thermal Constraints Thomas Edison Yu, Tomokazu Yoneda, Krishnendu Chakrabarty and Hideo Fujiwara Nara Institute of Science
More informationPiezoresistive Absolute Pressure Sensors
Pressure Piezoresistive Absolute Pressure Sensors Universal Precision Pressure Sensors Type 4043A..., 4045A..., 4073A..., 4075A... Universal sensor suitable for measuring absolute pressures in ranges from
More informationAn High Voltage CMOS Voltage Regulator for automotive alternators with programmable functionalities and full reverse polarity capability
L. Fanucci, G. Pasetti University of Pisa P. D Abramo, R. Serventi, F. Tinfena Austriamicrosystems P. Tisserand, P. Chassard, L. Labiste - Valeo An High Voltage CMOS Voltage Regulator for automotive alternators
More informationHow Much Power Does your Server Consume? Estimating Wall Socket Power Using RAPL Measurements
How Much Power Does your Server Consume? Estimating Wall Socket Power Using RAPL Measurements Kashif Nizam Khan Zhonghong Ou, Mikael Hirki, Jukka K. Nurminen, Tapio Niemi 1 Motivation The Large Hadron
More informationFigure 1 Linear Output Hall Effect Transducer (LOHET TM )
PDFINFO p a g e - 0 8 4 INTRODUCTION The SS9 Series Linear Output Hall Effect Transducer (LOHET TM ) provides mechanical and electrical designers with significant position and current sensing capabilities.
More informationAllegro Sigrity SI / PI Overview
Allegro Sigrity SI / PI Overview Brad Griffin Allegro Product Marketing February, 2015 1 2012 Cadence Design Systems, Inc. All rights reserved. Agenda Allegro Sigrity Signal Integrity Solutions Allegro
More informationNon-volatile STT-RAM: A True Universal Memory
Non-volatile STT-RAM: A True Universal Memory Farhad Tabrizi Grandis Inc., Milpitas, California August 13 th, 2009 Santa Clara, CA, USA, August 2009 1 Outline Grandis Corporation Overview Current Flash
More informationSolution-processed carbon nanotube thin-film complementary static random access memory
Solution-processed carbon nanotube thin-film complementary static random access memory Michael L. Geier, Julian J. McMorrow, Weichao Xu, Jian Zhu, Chris H. Kim, Tobin J. Marks, and Mark C. Hersam * *Corresponding
More informationSteel solutions in the green economy FutureSteelVehicle
Steel solutions in the green economy FutureSteelVehicle CONTENTS introduction Introduction 3 FutureSteelVehicle characteristics 6 Life cycle thinking 10 The World Steel Association (worldsteel) is one
More informationAPEC 2011 Special Session Polymer Film Capacitors March 2011
This presentation covers current topics in polymer film capacitors commonly used in power systems. Polymer film capacitors are essential components in higher voltage and higher current circuits. Unlike
More informationBuilding Blocks and Opportunities for Power Electronics Integration
Building Blocks and Opportunities for Power Electronics Integration Ralph S. Taylor APEC 2011 March 8, 2011 What's Driving Automotive Power Electronics? Across the globe, vehicle manufacturers are committing
More informationImplications of Digital Control and Management for a High Performance Isolated DC/DC Converter
MPM-07:000199 Uen Rev A Implications of Digital Control and Management for a High Performance Isolated DC/DC Converter March 2007 Technical Paper Digital control implemented in an isolated DC/DC converter
More informationTransforming the Grid from the Distribution System Out
Power Systems Engineering Research Center Transforming the Grid from the Distribution System Out Tom Jahns Bob Lasseter University of Wisconsin - Madison PSERC Webinar Tuesday, November 4, 2014 2014 Changing
More informationTechnology Development of Dual Power Supply System for Mild Hybrid System and Micro Hybrid System
DENSO TEN Technical Review Vol.1 Technology Development of Dual Power Supply System for Mild Hybrid System and Micro Hybrid System Yasuki MIO Masato HISANAGA Yoshinori SHIBACHI Keiichi YONEZAKI Yoshikazu
More informationAll-SiC Module for Mega-Solar Power Conditioner
All-SiC Module for Mega-Solar Power Conditioner NASHIDA, Norihiro * NAKAMURA, Hideyo * IWAMOTO, Susumu A B S T R A C T An all-sic module for mega-solar power conditioners has been developed. The structure
More informationDesigning for Cost Effective Flip Chip Technology
Designing for Cost Effective Flip Chip Technology Jack Bogdanski White Electronic Designs Corp. Designing For Cost Effective Flip Chip Technology Bump and fl ip approaches to semiconductor packaging have
More informationEmbedded Systems and Software. Some Power Considerations
Embedded Systems and Software Some Power Considerations Slide-1 Energy/Power Considerations Terms Cell, Battery Energy (Joule) Power (J/s or Watt) Ampere-hour (Ah) Deep-cycle MCU Sleep Modes ADC Data rate
More informationUniversity of Florida Low Cost Solar Driven Desalination
132 P a g e University of Florida Low Cost Solar Driven Desalination PI: James Klausner Students: Fadi Alnaimat/Ph.D. Mechanical Engineering Description: Water and energy scarcity poses a future threat
More informationVehicle Electrical Systems Integration
Vehicle Electrical Systems Integration Aim: Reduce cost, size and improve reliability of the electrical power systems by integration of functionality in Automotive applications Low TRL level to support
More information